Han-Liang Tseng

Person

Hsinchu, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor devices and methods for forming the same
- Patent number 11,989,966
- Issue date May 21, 2024
- Vanguard International Semiconductor Corporation
- Hsin-Hui Lee
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Optical sensor device with reduced thickness and method for forming...
- Patent number 11,621,287
- Issue date Apr 4, 2023
- Vanguard International Semiconductor Corporation
- Hsin-Hui Lee
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor devices and methods for forming the same
- Patent number 11,482,552
- Issue date Oct 25, 2022
- Vanguard International Semiconductor Corporation
- Hsin-Hui Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical sensors and methods for forming the same
- Patent number 11,315,964
- Issue date Apr 26, 2022
- Vanguard International Semiconductor Corporation
- Hsin-Hui Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for forming the same
- Patent number 11,271,024
- Issue date Mar 8, 2022
- Vanguard International Semiconductor Corporation
- Hsin-Hui Lee
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor devices and methods for forming the same
- Patent number 11,177,397
- Issue date Nov 16, 2021
- Vanguard International Semiconductor Corporation
- Hsin-Hui Lee
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor devices and methods for forming the same
- Patent number 11,152,422
- Issue date Oct 19, 2021
- Vanguard International Semiconductor Corporation
- Hsin-Hui Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and fingerprint identification device
- Patent number 11,049,771
- Issue date Jun 29, 2021
- Vanguard International Semiconductor Corporation
- Han-Liang Tseng
- G02 - OPTICS
Information Patent Grant
Optical sensor and method for forming the same
- Patent number 10,935,805
- Issue date Mar 2, 2021
- Vanguard International Semiconductor Corporation
- Hsin-Hui Lee
- G02 - OPTICS
Information Patent Grant
Optical sensor and method for forming the same
- Patent number 10,915,727
- Issue date Feb 9, 2021
- Vanguard International Semiconductor Corporation
- Hsin-Hui Lee
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Optical sensor and method for forming the same
- Patent number 10,770,602
- Issue date Sep 8, 2020
- Vanguard International Semiconductor Corporation
- Hsin-Hui Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for forming the same
- Patent number 10,763,288
- Issue date Sep 1, 2020
- Vanguard International Semiconductor Corporation
- Hsin-Hui Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical sensor and manufacturing method thereof
- Patent number 10,699,092
- Issue date Jun 30, 2020
- Vanguard International Semiconductor Corporation
- Han-Liang Tseng
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Optical sensor structure and method for forming the same
- Patent number 10,651,218
- Issue date May 12, 2020
- Vanguard International Semiconductor Corporation
- Hsin-Hui Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip holder with wafer level redistribution layer
- Patent number 8,049,323
- Issue date Nov 1, 2011
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Shien Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating a semiconductor package including stress rel...
- Patent number 7,662,665
- Issue date Feb 16, 2010
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Shien Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for improved dielectric layer metrology calibration
- Patent number 6,710,889
- Issue date Mar 23, 2004
- Taiwan Semiconductor Manufacturing Co., Ltd
- Pey-Yuan Lee
- G01 - MEASURING TESTING
Information Patent Grant
Ion implant method for forming trench isolation for integrated circ...
- Patent number 6,004,864
- Issue date Dec 21, 1999
- Taiwan Semiconductor Manufacturing Company Ltd.
- Ji-Chung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microlens process
- Patent number 6,001,540
- Issue date Dec 14, 1999
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ji-Chung Huang
- G02 - OPTICS
Information Patent Grant
System for in-line monitoring of photo processing tilt in VLSI fabr...
- Patent number 5,990,567
- Issue date Nov 23, 1999
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Huan-Chi Tseng
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
System for in-line monitoring of photo processing in VLSI fabrication
- Patent number 5,949,547
- Issue date Sep 7, 1999
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Huan-Chi Tseng
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Method for shielding polysilicon resistors from hydrogen intrusion
- Patent number 5,530,418
- Issue date Jun 25, 1996
- Taiwan Semiconductor Manufacturing Company
- Shun-Liang Hsu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS FOR FORMING THE SAME
- Publication number 20220029035
- Publication date Jan 27, 2022
- Vanguard International Semiconductor Corporation
- Hsin-Hui LEE
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
OPTICAL SENSOR DEVICE AND METHOD FOR FORMING THE SAME
- Publication number 20210327941
- Publication date Oct 21, 2021
- Vanguard International Semiconductor Corporation
- Hsin-Hui LEE
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS FOR FORMING THE SAME
- Publication number 20210217906
- Publication date Jul 15, 2021
- Vanguard International Semiconductor Corporation
- Hsin-Hui LEE
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME
- Publication number 20210175271
- Publication date Jun 10, 2021
- Vanguard International Semiconductor Corporation
- Hsin-Hui LEE
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS FOR FORMING THE SAME
- Publication number 20210151489
- Publication date May 20, 2021
- Vanguard International Semiconductor Corporation
- Hsin-Hui LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS FOR FORMING THE SAME
- Publication number 20210126039
- Publication date Apr 29, 2021
- Vanguard International Semiconductor Corporation
- Hsin-Hui LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL SENSOR AND METHOD FOR FORMING THE SAME
- Publication number 20200266305
- Publication date Aug 20, 2020
- Vanguard International Semiconductor Corporation
- Hsin-Hui LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME
- Publication number 20200266226
- Publication date Aug 20, 2020
- Vanguard International Semiconductor Corporation
- Hsin-Hui LEE
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
OPTICAL SENSOR AND METHOD FOR FORMING THE SAME
- Publication number 20200249490
- Publication date Aug 6, 2020
- Vanguard International Semiconductor Corporation
- Hsin-Hui LEE
- G02 - OPTICS
Information Patent Application
OPTICAL SENSORS AND METHODS FOR FORMING THE SAME
- Publication number 20200251506
- Publication date Aug 6, 2020
- Vanguard International Semiconductor Corporation
- Hsin-Hui LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL SENSOR AND METHOD FOR FORMING THE SAME
- Publication number 20200210669
- Publication date Jul 2, 2020
- Vanguard International Semiconductor Corporation
- Hsin-Hui LEE
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME
- Publication number 20190386048
- Publication date Dec 19, 2019
- Vanguard International Semiconductor Corporation
- Hsin-Hui LEE
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
OPTICAL SENSOR AND MANUFACTURING METHOD THEREOF
- Publication number 20190347462
- Publication date Nov 14, 2019
- Vanguard International Semiconductor Corporation
- Han-Liang TSENG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME
- Publication number 20190304837
- Publication date Oct 3, 2019
- Vanguard International Semiconductor Corporation
- Han-Liang TSENG
- G02 - OPTICS
Information Patent Application
CHIP HOLDER WITH WAFER LEVEL REDISTRIBUTION LAYER
- Publication number 20080197473
- Publication date Aug 21, 2008
- Taiwan Semiconductor Manufacturing Co., LTD
- Chen-Shien Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stress relieving layer for flip chip packaging
- Publication number 20080174002
- Publication date Jul 24, 2008
- Taiwan Semiconductor Manufacturing Co., LTD
- Chen-Shien Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR IMPROVED DIELECTRIC LAYER METROLOGY CALIBRATION
- Publication number 20040004730
- Publication date Jan 8, 2004
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Pey-Yuan Lee
- G01 - MEASURING TESTING
Information Patent Application
Apparatus and method for improving scrubber cleaning
- Publication number 20030230323
- Publication date Dec 18, 2003
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wei-Ming You
- B08 - CLEANING

Han-Liang Tseng

Person

Patents Grantslast 30 patents

Semiconductor devices and methods for forming the same

Optical sensor device with reduced thickness and method for forming...

Semiconductor devices and methods for forming the same

Optical sensors and methods for forming the same

Semiconductor device and method for forming the same

Semiconductor devices and methods for forming the same

Semiconductor devices and methods for forming the same

Semiconductor device and fingerprint identification device

Optical sensor and method for forming the same

Optical sensor and method for forming the same

Optical sensor and method for forming the same

Semiconductor device and method for forming the same

Optical sensor and manufacturing method thereof

Optical sensor structure and method for forming the same

Chip holder with wafer level redistribution layer

Method for fabricating a semiconductor package including stress rel...

Method for improved dielectric layer metrology calibration

Ion implant method for forming trench isolation for integrated circ...

Microlens process

System for in-line monitoring of photo processing tilt in VLSI fabr...

System for in-line monitoring of photo processing in VLSI fabrication

Method for shielding polysilicon resistors from hydrogen intrusion

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICES AND METHODS FOR FORMING THE SAME

OPTICAL SENSOR DEVICE AND METHOD FOR FORMING THE SAME

SEMICONDUCTOR DEVICES AND METHODS FOR FORMING THE SAME

SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME

SEMICONDUCTOR DEVICES AND METHODS FOR FORMING THE SAME

SEMICONDUCTOR DEVICES AND METHODS FOR FORMING THE SAME

OPTICAL SENSOR AND METHOD FOR FORMING THE SAME

SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME

OPTICAL SENSOR AND METHOD FOR FORMING THE SAME

OPTICAL SENSORS AND METHODS FOR FORMING THE SAME

OPTICAL SENSOR AND METHOD FOR FORMING THE SAME

SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME

OPTICAL SENSOR AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME

CHIP HOLDER WITH WAFER LEVEL REDISTRIBUTION LAYER

Stress relieving layer for flip chip packaging

METHOD FOR IMPROVED DIELECTRIC LAYER METROLOGY CALIBRATION

Apparatus and method for improving scrubber cleaning