Han-Min Chu

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Kwei Shan Hsiang, TW

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Patents Grantslast 30 patents

Information Patent Grant
High-power connector having heat dissipation structure
- Patent number 8,439,713
- Issue date May 14, 2013
- Simula Technology Inc.
- Hsien-Yu Chiu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
HIGH-POWER CONNECTOR HAVING HEAT DISSIPATION STRUCTURE
- Publication number 20120214331
- Publication date Aug 23, 2012
- SIMULA TECHNOLOGY INC.
- Hsien-Yu Chiu
- H01 - BASIC ELECTRIC ELEMENTS