Han Na JIN

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Suwon-si, KR

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Patents Grantslast 30 patents

Information Patent Grant
Method of manufacturing semiconductor package having connection str...
- Patent number 11,670,518
- Issue date Jun 6, 2023
- Samsung Electronics Co., Ltd.
- Han Na Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having a connection structure with tapering c...
- Patent number 11,088,081
- Issue date Aug 10, 2021
- Samsung Electronics Co., Ltd.
- Han Na Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carrier substrate and method of manufacturing semiconductor package...
- Patent number 10,828,871
- Issue date Nov 10, 2020
- Samsung Electronics Co., Ltd.
- Han Na Jin
- B32 - LAYERED PRODUCTS
Information Patent Grant
Semiconductor package
- Patent number 10,796,997
- Issue date Oct 6, 2020
- Samsung Electronics Co., Ltd.
- Jae Ean Lee
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE HAVING A CONNECTION STRUCTURE WITH TAPERING C...
- Publication number 20210335717
- Publication date Oct 28, 2021
- Samsung Electronics Co., Ltd.
- Han Na JIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20200105676
- Publication date Apr 2, 2020
- Samsung Electronics Co., Ltd.
- Han Na JIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20200066639
- Publication date Feb 27, 2020
- Samsung Electronics Co., Ltd.
- Jae Ean LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARRIER SUBSTRATE AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE...
- Publication number 20190366690
- Publication date Dec 5, 2019
- Samsung Electronics Co., Ltd.
- Han Na JIN
- B32 - LAYERED PRODUCTS