Han-Peng Hsu

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Taichung City, TW

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method of forming the same
- Patent number 12,185,553
- Issue date Dec 31, 2024
- Winbond Electronics Corp.
- Chi-Ching Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system for monitoring temperature of wafer
- Patent number 10,365,672
- Issue date Jul 30, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shu-Han Chen
- G05 - CONTROLLING REGULATING

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF FORMING SEMICONDUCTOR DEVICE
- Publication number 20250072008
- Publication date Feb 27, 2025
- WINBOND ELECTRONICS CORP.
- Chi-Ching Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME
- Publication number 20230329009
- Publication date Oct 12, 2023
- WINBOND ELECTRONICS CORP.
- Chi-Ching Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND SYSTEM FOR MONITORING TEMPERATURE OF WAFER
- Publication number 20180166309
- Publication date Jun 14, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shu-Han Chen
- G05 - CONTROLLING REGULATING
Information Patent Application
OVERLOAD PROTECTION DEVICE FOR LED LUMINARY
- Publication number 20110175540
- Publication date Jul 21, 2011
- Han-Peng Hsu
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Cable tie
- Publication number 20080083094
- Publication date Apr 10, 2008
- Han-Peng Hsu
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL