Han-Shen Lo

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Chu-pei, TW

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Patents Grantslast 30 patents

Information Patent Grant
Structures and methods for heat dissipation of semiconductor devices
- Patent number 11,658,088
- Issue date May 23, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- S. L. Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures and methods for heat dissipation of semiconductor devices
- Patent number 10,910,290
- Issue date Feb 2, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- S. L. Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer structure for high aspect ratio etch
- Patent number 9,647,022
- Issue date May 9, 2017
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tsai-Hao Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Defect inspection apparatus and method
- Patent number 9,188,547
- Issue date Nov 17, 2015
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chun-Yen Ho
- G01 - MEASURING TESTING
Information Patent Grant
High density ROM with select lines
- Patent number 5,493,527
- Issue date Feb 20, 1996
- United Micro Electronics Corporation
- Han-Shen Lo
- G11 - INFORMATION STORAGE
Information Patent Grant
Method of making 0.6 micrometer word line pitch ROM cell by 0.6 mic...
- Patent number 5,330,924
- Issue date Jul 19, 1994
- United Microelectronics Corporation
- Heng S. Huang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
STRUCTURES AND METHODS FOR HEAT DISSIPATION OF SEMICONDUCTOR DEVICES
- Publication number 20230268242
- Publication date Aug 24, 2023
- Taiwan Semiconductor Manufacturing Co., LTD
- S.L. CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTION STRUCTURE LINED BY ISOLATION LAYER
- Publication number 20220139833
- Publication date May 5, 2022
- Taiwan Semiconductor Manufacturing Co., LTD
- Hsin-Liang CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURES AND METHODS FOR HEAT DISSIPATION OF SEMICONDUCTOR DEVICES
- Publication number 20190122951
- Publication date Apr 25, 2019
- Taiwan Semiconductor Manufacturing Co., LTD
- S.L. CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTION STRUCTURE LINED BY ISOLATION LAYER
- Publication number 20190109090
- Publication date Apr 11, 2019
- Taiwan Semiconductor Manufacturing Co., LTD
- Hsin-Liang CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LAYER STRUCTURE FOR HIGH ASPECT RATIO ETCH
- Publication number 20160240568
- Publication date Aug 18, 2016
- Taiwan Semiconductor Manufacturing Co., LTD
- Tsai-Hao Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEFECT INSPECTION APPARATUS AND METHOD
- Publication number 20150116701
- Publication date Apr 30, 2015
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chun-Yen HO
- G01 - MEASURING TESTING