Han-Ti Hsiaw

Person

Zhubei City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method
- Patent number 12,125,876
- Issue date Oct 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuan-Cheng Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Isolation regions including two layers and method forming same
- Patent number 12,051,614
- Issue date Jul 30, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Tsung Han Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with a work function layer having a concentrat...
- Patent number 11,380,549
- Issue date Jul 5, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jung-Shiung Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Isolation regions including two layers and method forming same
- Patent number 11,031,280
- Issue date Jun 8, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung Han Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact openings and methods forming same
- Patent number 10,978,341
- Issue date Apr 13, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Hung Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and methods of manufacture
- Patent number 10,727,066
- Issue date Jul 28, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jung-Shiung Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact openings and methods forming same
- Patent number 10,510,593
- Issue date Dec 17, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Hung Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and methods of manufacture
- Patent number 10,504,734
- Issue date Dec 10, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jung-Shiung Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and methods of manufacture
- Patent number 10,269,569
- Issue date Apr 23, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jung-Shiung Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated bi-layer STI deposition
- Patent number 9,960,074
- Issue date May 1, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung Han Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact openings and methods forming same
- Patent number 9,881,834
- Issue date Jan 30, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hung Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical filtering for integrated dielectrics UV curing processes
- Patent number 9,837,267
- Issue date Dec 5, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuan-Cheng Wang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Flowable films and methods of forming flowable films
- Patent number 9,728,402
- Issue date Aug 8, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuan-Cheng Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density dielectric etch-stop layer
- Patent number 9,379,061
- Issue date Jun 28, 2016
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Joung-Wei Liou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of back-end-of-line (BEOL) fabrication, and devices formed b...
- Patent number 9,130,022
- Issue date Sep 8, 2015
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shiauhan Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a high density dielectric etch-stop layer
- Patent number 9,076,845
- Issue date Jul 7, 2015
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Joung-Wei Liou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hard mask for back-end-of-line (BEOL) interconnect structure
- Patent number 9,059,259
- Issue date Jun 16, 2015
- Taiwan Semiconductor Manufacturing Company Limited
- Joung-Wei Liou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and equipment for removing photoresist residue after dry etch
- Patent number 9,048,268
- Issue date Jun 2, 2015
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Mu-Chen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
ILD stack with improved CMP results
- Patent number 6,869,836
- Issue date Mar 22, 2005
- Taiwan Semiconductor Manufacturing Co., Ltd
- Han-Ti Hsiaw
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor Device and Methods of Manufacture
- Publication number 20220328316
- Publication date Oct 13, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jung-Shiung Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Isolation Regions Including Two Layers and Method Forming Same
- Publication number 20210296160
- Publication date Sep 23, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tsung Han Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHODS OF MANUFACTURE
- Publication number 20200357645
- Publication date Nov 12, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jung-Shiung Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Contact Openings and Methods Forming Same
- Publication number 20200111705
- Publication date Apr 9, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hung Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Methods of Manufacture
- Publication number 20200090939
- Publication date Mar 19, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jung-Shiung Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Methods of Manufacture
- Publication number 20190096678
- Publication date Mar 28, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jung-Shiung Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Bi-Layer STI Deposition
- Publication number 20180226291
- Publication date Aug 9, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung Han Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Methods of Manufacture
- Publication number 20180151373
- Publication date May 31, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jung-Shiung Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Contact Openings and Methods Forming Same
- Publication number 20180151425
- Publication date May 31, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hung Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method
- Publication number 20180145131
- Publication date May 24, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuan-Cheng Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Bi-Layer STI Deposition
- Publication number 20180005870
- Publication date Jan 4, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung Han Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL FILTERING FOR INTEGRATED DIELECTRICS UV CURING PROCESSES
- Publication number 20170316936
- Publication date Nov 2, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuan-Cheng Wang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Flowable Films and Methods of Forming Flowable Films
- Publication number 20170053798
- Publication date Feb 23, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuan-Cheng Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING A HIGH DENSITY DIELECTRIC ETCH-STOP LAYER
- Publication number 20150311158
- Publication date Oct 29, 2015
- Taiwan Semiconductor Manufacturing Co., LTD
- Joung-Wei Liou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND EQUIPMENT FOR REMOVING PHOTORESIST RESIDUE AFER DRY ETCH
- Publication number 20150249024
- Publication date Sep 3, 2015
- Taiwan Semiconductor Manufacturing Co., LTD
- Mu-Chen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High Density Dielectric Etch Stop Layer
- Publication number 20150097288
- Publication date Apr 9, 2015
- Taiwan Semiconductor Manufacturing Co., LTD
- Joung-Wei Liou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HARD MASK FOR BACK-END-OF-LINE (BEOL) INTERCONNECT STRUCTURE
- Publication number 20150021779
- Publication date Jan 22, 2015
- Taiwan Semiconductor Manufacturing Company Limited
- JOUNG-WEI LIOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF BACK-END-OF-LINE (BEOL) FABRICATION, AND DEVICES FORMED B...
- Publication number 20140264870
- Publication date Sep 18, 2014
- Taiwan Semiconductor Manufacturing Co., LTD
- Shiauhan WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND EQUIPMENT FOR REMOVING PHOTORESIST RESIDUE AFTER DRY ETCH
- Publication number 20140256138
- Publication date Sep 11, 2014
- Taiwan Semiconductor Manufacturing Co., LTD
- Mu-Chen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ILD STACK WITH IMPROVED CMP RESULTS
- Publication number 20050070058
- Publication date Mar 31, 2005
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Han-Ti Hsiaw
- H01 - BASIC ELECTRIC ELEMENTS

Han-Ti Hsiaw

Person

Patents Grantslast 30 patents

Semiconductor device and method

Isolation regions including two layers and method forming same

Semiconductor device with a work function layer having a concentrat...

Isolation regions including two layers and method forming same

Contact openings and methods forming same

Semiconductor device and methods of manufacture

Contact openings and methods forming same

Semiconductor device and methods of manufacture

Semiconductor device and methods of manufacture

Integrated bi-layer STI deposition

Contact openings and methods forming same

Optical filtering for integrated dielectrics UV curing processes

Flowable films and methods of forming flowable films

High density dielectric etch-stop layer

Method of back-end-of-line (BEOL) fabrication, and devices formed b...

Method of forming a high density dielectric etch-stop layer

Hard mask for back-end-of-line (BEOL) interconnect structure

Method and equipment for removing photoresist residue after dry etch

ILD stack with improved CMP results

Patents Applicationslast 30 patents

Semiconductor Device and Methods of Manufacture

Isolation Regions Including Two Layers and Method Forming Same

SEMICONDUCTOR DEVICE AND METHODS OF MANUFACTURE

Contact Openings and Methods Forming Same

Semiconductor Device and Methods of Manufacture

Semiconductor Device and Methods of Manufacture

Integrated Bi-Layer STI Deposition

Semiconductor Device and Methods of Manufacture

Contact Openings and Methods Forming Same

Semiconductor Device and Method

Integrated Bi-Layer STI Deposition

OPTICAL FILTERING FOR INTEGRATED DIELECTRICS UV CURING PROCESSES

Flowable Films and Methods of Forming Flowable Films

METHOD OF FORMING A HIGH DENSITY DIELECTRIC ETCH-STOP LAYER

METHOD AND EQUIPMENT FOR REMOVING PHOTORESIST RESIDUE AFER DRY ETCH

High Density Dielectric Etch Stop Layer

HARD MASK FOR BACK-END-OF-LINE (BEOL) INTERCONNECT STRUCTURE

METHOD OF BACK-END-OF-LINE (BEOL) FABRICATION, AND DEVICES FORMED B...

METHOD AND EQUIPMENT FOR REMOVING PHOTORESIST RESIDUE AFTER DRY ETCH

ILD STACK WITH IMPROVED CMP RESULTS