Han Wah Ng

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Johor, MY

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Patents Grantslast 30 patents

Information Patent Grant
Method of controlled low-k via etch for Cu interconnections
- Patent number 7,906,426
- Issue date Mar 15, 2011
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Wuping Liu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Method of controlled low-k via etch for Cu interconnections
- Publication number 20080258308
- Publication date Oct 23, 2008
- Wuping Liu
- H01 - BASIC ELECTRIC ELEMENTS