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Patents Grantslast 30 patents

Information Patent Grant
Bonding element and method for manufacturing the same
- Patent number 11,621,241
- Issue date Apr 4, 2023
- NATIONAL YANG MING CHIAO TUNG UNIVERSITY
- Han-Wen Hu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240030184
- Publication date Jan 25, 2024
- National Yang Ming Chiao Tung University
- Kuan-Neng CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANTENNA PACKAGE STRUCTURE
- Publication number 20230402744
- Publication date Dec 14, 2023
- TRON FUTURE TECH INC.
- KUAN-NENG CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING ELEMENT AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20230025936
- Publication date Jan 26, 2023
- National Yang Ming Chiao Tung University
- Han-Wen HU
- H01 - BASIC ELECTRIC ELEMENTS