Han-wen Lin

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Zhubei City, TW

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Patents Applicationslast 30 patents

Information Patent Application
MICROELECTRONIC ASSEMBLIES INCLUDING SOLDER AND NON-SOLDER INTERCON...
- Publication number 20230420413
- Publication date Dec 28, 2023
- Intel Corporation
- Alois Nitsch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT ASSEMBLIES HAVING INTERCONNECTION BRIDGES SPANNI...
- Publication number 20230387073
- Publication date Nov 30, 2023
- Intel Corporation
- Kai-Chiang Wu
- H01 - BASIC ELECTRIC ELEMENTS