Han Wooi Lim

Follow

Person

Bayan Lepas, MY

People

Patents Grantslast 30 patents

Information Patent Grant
Fabric die to fabric die interconnect for modularized integrated ci...
- Patent number 12,009,298
- Issue date Jun 11, 2024
- Intel Corporation
- Chee Hak Teh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabric die to fabric die interconnect for modularized integrated ci...
- Patent number 11,670,589
- Issue date Jun 6, 2023
- Intel Corporation
- Chee Hak Teh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabric die to fabric die interconnect for modularized integrated ci...
- Patent number 10,886,218
- Issue date Jan 5, 2021
- Intel Corporation
- Chee Hak Teh
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Fabric Die to Fabric Die Interconnect for Modularized Integrated Ci...
- Publication number 20240312909
- Publication date Sep 19, 2024
- Intel Corporation
- Chee Hak Teh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fabric Die to Fabric Die Interconnect for Modularized Integrated Ci...
- Publication number 20230378061
- Publication date Nov 23, 2023
- Intel Corporation
- Chee Hak Teh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fabric Die to Fabric Die Interconnect for Modularized Integrated Ci...
- Publication number 20210111116
- Publication date Apr 15, 2021
- Intel Corporation
- Chee Hak Teh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fabric Die to Fabric Die Interconnect for Modularized Integrated Ci...
- Publication number 20190326210
- Publication date Oct 24, 2019
- Chee Hak Teh
- H01 - BASIC ELECTRIC ELEMENTS