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HanGil Shin
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Gyeonggi-do, KR
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Patents Grants
last 30 patents
Information
Patent Grant
Semiconductor device and method of forming 3D dual side die embedde...
Patent number
10,510,703
Issue date
Dec 17, 2019
STATS ChipPAC Pte. Ltd.
HeeJo Chi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of forming interposer frame electri...
Patent number
9,966,335
Issue date
May 8, 2018
STATS ChipPAC Pte. Ltd.
NamJu Cho
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods of forming conductive and insulating layers
Patent number
9,865,575
Issue date
Jan 9, 2018
STATS ChipPAC Pte. Ltd.
HeeJo Chi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of forming vertical interconnect in...
Patent number
9,842,808
Issue date
Dec 12, 2017
STATS ChipPAC Pte. Ltd.
HanGil Shin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of forming 3D dual side die embedde...
Patent number
9,691,707
Issue date
Jun 27, 2017
STATS ChipPAC Pte. Ltd.
HeeJo Chi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device with thin profile WLCSP with vertical intercon...
Patent number
9,558,965
Issue date
Jan 31, 2017
STATS ChipPAC Pte. Ltd.
HeeJo Chi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods of forming conductive jumper traces
Patent number
9,508,635
Issue date
Nov 29, 2016
STATS ChipPAC Pte. Ltd.
HanGil Shin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Carrier system with multi-tier conductive posts and method of manuf...
Patent number
9,496,152
Issue date
Nov 15, 2016
STATS ChipPAC Pte. Ltd.
NamJu Cho
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods of forming conductive and insulating layers
Patent number
9,406,533
Issue date
Aug 2, 2016
STATS ChipPAC Pte. Ltd.
HeeJo Chi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of forming pre-molded semiconductor...
Patent number
9,397,050
Issue date
Jul 19, 2016
STATS ChipPAC Pte. Ltd.
HanGil Shin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of forming 3D dual side die embedde...
Patent number
9,362,161
Issue date
Jun 7, 2016
STATS ChipPAC, Ltd.
HeeJo Chi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit package stacking system with shielding and metho...
Patent number
9,355,939
Issue date
May 31, 2016
Stats Chippac Ltd.
NamJu Cho
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of forming leadframe with conductiv...
Patent number
9,312,218
Issue date
Apr 12, 2016
STATS ChipPAC, Ltd.
DaeSik Choi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit packaging system with single metal layer interpo...
Patent number
9,299,650
Issue date
Mar 29, 2016
Stats Chippac Ltd.
HeeJo Chi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of making an embedded wafer level b...
Patent number
9,269,691
Issue date
Feb 23, 2016
STATS ChipPAC, Ltd.
HeeJo Chi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device with thin profile WLCSP with vertical intercon...
Patent number
9,269,595
Issue date
Feb 23, 2016
STATS ChipPAC, Ltd.
HeeJo Chi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of forming open cavity in TSV inter...
Patent number
9,263,332
Issue date
Feb 16, 2016
STATS ChipPAC, Ltd.
HeeJo Chi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit packaging system with package-on-package and met...
Patent number
9,230,898
Issue date
Jan 5, 2016
Stats Chippac Ltd.
HanGil Shin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of forming conductive posts and hea...
Patent number
9,064,859
Issue date
Jun 23, 2015
STATS ChipPAC, Ltd.
HeeJo Chi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of forming open cavity in TSV inter...
Patent number
9,048,306
Issue date
Jun 2, 2015
STATS ChipPAC, Ltd.
HeeJo Chi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods of forming solder balls in semiconductor packages
Patent number
8,951,834
Issue date
Feb 10, 2015
Stats Chippac Ltd.
Kyung Moon Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of forming interposer frame electri...
Patent number
8,932,907
Issue date
Jan 13, 2015
STATS ChipPAC, Ltd.
NamJu Cho
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Semiconductor device and method of forming conductive layer over me...
Patent number
8,901,755
Issue date
Dec 2, 2014
STATS ChipPAC, Ltd.
HeeJo Chi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit packaging system with package-on-package and met...
Patent number
8,749,040
Issue date
Jun 10, 2014
Stats Chippac Ltd.
HeeJo Chi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit packaging system with through silicon via and me...
Patent number
8,723,309
Issue date
May 13, 2014
Stats Chippac Ltd.
HanGil Shin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit packaging system with encapsulation and method o...
Patent number
8,716,065
Issue date
May 6, 2014
Stats Chippac Ltd.
HeeJo Chi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit packaging system with embedded thermal heat shie...
Patent number
8,564,125
Issue date
Oct 22, 2013
Stats Chippac Ltd.
NamJu Cho
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit packaging system with interposer interconnection...
Patent number
8,558,366
Issue date
Oct 15, 2013
Stats Chippac Ltd.
A Leam Choi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit package system with package stacking and method...
Patent number
8,541,872
Issue date
Sep 24, 2013
Stats Chippac Ltd.
NamJu Cho
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit packaging system with stiffener and method of ma...
Patent number
8,492,888
Issue date
Jul 23, 2013
Stats Chippac Ltd.
HeeJo Chi
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
Semiconductor Device and Method of Forming 3D Dual Side Die Embedde...
Publication number
20170250154
Publication date
Aug 31, 2017
STATS ChipPAC Pte Ltd.
HeeJo Chi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Methods of Forming Conductive and Insulating Layers
Publication number
20160329310
Publication date
Nov 10, 2016
STATS ChipPAC Pte Ltd.
HeeJo Chi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method of Forming 3D Dual Side Die Embedde...
Publication number
20160233168
Publication date
Aug 11, 2016
STATS ChipPAC, Ltd.
HeeJo Chi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method of Forming 3D Dual Side Die Embedde...
Publication number
20150270237
Publication date
Sep 24, 2015
STATS ChipPAC, Ltd.
HeeJo Chi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method of Forming Interposer Frame Electri...
Publication number
20150123273
Publication date
May 7, 2015
STATS ChipPAC, Ltd.
NamJu Cho
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method of Making an Embedded Wafer Level B...
Publication number
20150091157
Publication date
Apr 2, 2015
STATS ChipPAC, Ltd.
HeeJo Chi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Methods of Forming Conductive Materials on Contact Pads
Publication number
20150004750
Publication date
Jan 1, 2015
STATS ChipPAC, Ltd.
HeeJo Chi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Methods of Forming Conductive Jumper Traces
Publication number
20150004748
Publication date
Jan 1, 2015
STATS ChipPAC, Ltd.
HanGil Shin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Methods of Forming Conductive and Insulating Layers
Publication number
20150004756
Publication date
Jan 1, 2015
STATS ChipPAC, Ltd.
HeeJo Chi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method of Making an Embedded Wafer Level B...
Publication number
20140367848
Publication date
Dec 18, 2014
HeeJo Chi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method of Using Leadframe Bodies to Form O...
Publication number
20140361423
Publication date
Dec 11, 2014
STATS ChipPAC, Ltd.
HeeJo Chi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH THROUGH SILICON VIA AND ME...
Publication number
20130334697
Publication date
Dec 19, 2013
HanGil Shin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method of Forming Open Cavity in TSV Inter...
Publication number
20130299974
Publication date
Nov 14, 2013
HeeJo Chi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method of Forming Conductive Layer Over Me...
Publication number
20130249104
Publication date
Sep 26, 2013
STATS ChipPAC, Ltd.
HeeJo Chi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method of Forming Conductive Posts and Hea...
Publication number
20130105970
Publication date
May 2, 2013
STATS ChipPAC, Ltd.
HeeJo Chi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method of Forming Interposer Frame Electri...
Publication number
20130099378
Publication date
Apr 25, 2013
STATS ChipPAC, Ltd.
NamJu Cho
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH ENCAPSULATION AND METHOD O...
Publication number
20130075927
Publication date
Mar 28, 2013
HeeJo Chi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH EMBEDDED THERMAL HEAT SHIE...
Publication number
20130056864
Publication date
Mar 7, 2013
NamJu Cho
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH STIFFENER AND METHOD OF MA...
Publication number
20130056863
Publication date
Mar 7, 2013
HeeJo Chi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method of Forming Vertical Interconnect in...
Publication number
20130026654
Publication date
Jan 31, 2013
STATS ChipPAC, Ltd.
HanGil Shin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method of Using Leadframe Bodies to Form O...
Publication number
20130001762
Publication date
Jan 3, 2013
STATS ChipPAC, Ltd.
HeeJo Chi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH PADS AND METHOD OF MANUFAC...
Publication number
20120319295
Publication date
Dec 20, 2012
HeeJo Chi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH INTRA SUBSTRATE DIE AND ME...
Publication number
20120319263
Publication date
Dec 20, 2012
NamJu Cho
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH PACKAGE STACKING AND METHO...
Publication number
20120306102
Publication date
Dec 6, 2012
NamJu Cho
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method of Forming Leadframe with Conductiv...
Publication number
20120286407
Publication date
Nov 15, 2012
STATS ChipPAC, Ltd.
DaeSik Choi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH AN INTERPOSER SUBSTRATE AN...
Publication number
20120241925
Publication date
Sep 27, 2012
In Sang Yoon
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method of Forming Open Cavity in TSV Inter...
Publication number
20120168916
Publication date
Jul 5, 2012
STATS ChipPAC, Ltd.
HeeJo Chi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method of Forming Thin Profile WLCSP with...
Publication number
20120153467
Publication date
Jun 21, 2012
STATS ChipPAC, Ltd.
HeeJo Chi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method of Forming Thin Profile WLCSP with...
Publication number
20120153505
Publication date
Jun 21, 2012
STATS ChipPAC, Ltd.
HeeJo Chi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method of Forming Interposer Frame Electri...
Publication number
20120119388
Publication date
May 17, 2012
STATS ChipPAC, Ltd.
NamJu Cho
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR