Hanjian LENG

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Shenzhen, CN

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Patents Grantslast 30 patents

Information Patent Grant
Package structure and packaging method
- Patent number 11,646,278
- Issue date May 9, 2023
- Shenzhen Goodix Technology Co., Ltd.
- Hanjian Leng
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE STRUCTURE AND PACKAGING METHOD
- Publication number 20210118825
- Publication date Apr 22, 2021
- Shenzhen Goodix Technology Co., Ltd.
- Hanjian LENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING STRUCTURE, AND FORMING METHOD AND PACKAGING METHOD THEREOF
- Publication number 20210098426
- Publication date Apr 1, 2021
- Shenzhen Goodix Technology Co., Ltd.
- Chaohong WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP INTERCONNECTION STRUCTURE, CHIP, AND CHIP INTERCONNECTION METHOD
- Publication number 20210050330
- Publication date Feb 18, 2021
- Shenzhen Goodix Technology Co., Ltd.
- Hanjian LENG
- H01 - BASIC ELECTRIC ELEMENTS