Hank Huang

Person

Kaohsiung, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Compressor circuit and compressor circuit layout
- Patent number 10,003,342
- Issue date Jun 19, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chi-Lin Liu
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Enhanced adhesion strength between mold resin and polyimide
- Patent number 7,390,697
- Issue date Jun 24, 2008
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ken Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Buildup substrate pad pre-solder bump manufacturing
- Patent number 6,960,518
- Issue date Nov 1, 2005
- Taiwan Semiconductor Manufacturing Co., Ltd
- Pei-Haw Tsao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Enhanced adhesion strength between mold resin and polyimide
- Patent number 6,884,662
- Issue date Apr 26, 2005
- Taiwan Semiconductor Manufacturing Company
- Ken Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of protecting a passivation layer during solder bump formation
- Patent number 6,782,897
- Issue date Aug 31, 2004
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chung-Yu Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method for low-stress concentration solder bumps
- Patent number 6,774,026
- Issue date Aug 10, 2004
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chung Yu Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Under bump metallization structure
- Patent number 6,770,958
- Issue date Aug 3, 2004
- Taiwan Semiconductor Manufacturing Company
- Chung Yu Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical performance enhanced wafer level chip scale package with...
- Patent number 6,656,827
- Issue date Dec 2, 2003
- Taiwan Semiconductor Manufacturing Co., Ltd
- Pei-Haw Tsao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for protecting the front side of semiconductor wafers
- Patent number 6,638,837
- Issue date Oct 28, 2003
- Taiwan Semiconductor Manufacturing Company
- Pei-Haw Tsao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating an under bump metallization structure
- Patent number 6,596,619
- Issue date Jul 22, 2003
- Taiwan Semiconductor Manufacturing Company
- Chung Yu Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
X-cable between a TV and a computer
- Patent number D405049
- Issue date Feb 2, 1999
- AITech Int'l Corporation
- Henry Huang
- D13 - Equipment for production, distribution, or transformation of energy

Patents Applicationslast 30 patents

Information Patent Application
COMPRESSOR CIRCUIT AND COMPRESSOR CIRCUIT LAYOUT
- Publication number 20160156358
- Publication date Jun 2, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chi-Lin LIU
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
Enhanced adhesion strength between mold resin and polyimide
- Publication number 20050167807
- Publication date Aug 4, 2005
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
- Ken Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structure and method for low-stress concentration solder bumps
- Publication number 20040217482
- Publication date Nov 4, 2004
- Chung Yu Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of protecting a passivation layer during solder bump formation
- Publication number 20030219987
- Publication date Nov 27, 2003
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chung-Yu Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING AN UNDER BUMP METALLIZATION STRUCTURE
- Publication number 20030216039
- Publication date Nov 20, 2003
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
- Chung Yu Wang
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Compressor circuit and compressor circuit layout

Enhanced adhesion strength between mold resin and polyimide

Buildup substrate pad pre-solder bump manufacturing

Enhanced adhesion strength between mold resin and polyimide

Method of protecting a passivation layer during solder bump formation

Structure and method for low-stress concentration solder bumps

Under bump metallization structure

Electrical performance enhanced wafer level chip scale package with...

Method for protecting the front side of semiconductor wafers

Method for fabricating an under bump metallization structure

X-cable between a TV and a computer

Patents Applicationslast 30 patents

COMPRESSOR CIRCUIT AND COMPRESSOR CIRCUIT LAYOUT

Enhanced adhesion strength between mold resin and polyimide

Structure and method for low-stress concentration solder bumps

Method of protecting a passivation layer during solder bump formation

METHOD FOR FABRICATING AN UNDER BUMP METALLIZATION STRUCTURE