Hank Sung

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Allen, TX, US

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Patents Applicationslast 30 patents

Information Patent Application
POLYMERIC DIE PAD FOR DIE ISOLATION IN CHIP ON LEAD PACKAGE
- Publication number 20250210470
- Publication date Jun 26, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Rongwei Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE WITH INTERNAL MAGNETIC SHIELD FOR HALL...
- Publication number 20250138054
- Publication date May 1, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Yi Yan
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE WITH ISOLATION
- Publication number 20240258211
- Publication date Aug 1, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Sreenivasan K. Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICAL HIGH CURRENT HALL SENSOR WITH INTEGRATED HEAT SLUG CURRENT...
- Publication number 20240096767
- Publication date Mar 21, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Hank Sung
- H01 - BASIC ELECTRIC ELEMENTS