HANMIN ZHANG

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Tianjin, CN

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Patents Grantslast 30 patents

Information Patent Grant
Packaged semiconductor devices having ribbon wires
- Patent number 9,570,325
- Issue date Feb 14, 2017
- FREESCALE SEMICONDUCTOR, INC.
- Liqiang Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Brace for long wire bond
- Patent number 8,692,134
- Issue date Apr 8, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Jie Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Brace for wire bond
- Patent number 8,524,529
- Issue date Sep 3, 2013
- FREESCALE SEMICONDUCTOR, INC.
- Meiquan Huang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGED SEMICONDUCTOR DEVICES HAVING RIBBON WIRES
- Publication number 20160190086
- Publication date Jun 30, 2016
- FREESCALE SEMICONDUCTOR, INC.
- LIQIANG XU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE METALLIZATION PATTERNS FOR INTEGRATED CIRCUITS
- Publication number 20150235969
- Publication date Aug 20, 2015
- Hanmin Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDING MACHINE AND METHOD FOR TESTING WIRE BOND CONNECTIONS
- Publication number 20140103096
- Publication date Apr 17, 2014
- Hanmin Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF ASSEMBLING SEMICONDUCTOR DEVICE
- Publication number 20120326288
- Publication date Dec 27, 2012
- FREESCALE SEMICONDUCTOR, INC.
- Meiquan Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BRACE FOR LONG WIRE BOND
- Publication number 20120145446
- Publication date Jun 14, 2012
- FREESCALE SEMICONDUCTOR, INC.
- Jie YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BRACE FOR WIRE BOND
- Publication number 20120077316
- Publication date Mar 29, 2012
- FREESCALE SEMICONDUCTOR, INC.
- Meiquan HUANG
- H01 - BASIC ELECTRIC ELEMENTS