Hannes Eder

Person

Villach-Landskron, AT

People

Patents Grantslast 30 patents

Information Patent Grant
Method of producing a semiconductor device and a semiconductor device
- Patent number 10,020,285
- Issue date Jul 10, 2018
- Infineon Technologies Austria AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thinning in package using separation structure as stop
- Patent number 9,627,287
- Issue date Apr 18, 2017
- Infineon Technologies AG
- Manfred Engelhardt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for manufacturing a chip arrangement, methods for manufactu...
- Patent number 9,576,875
- Issue date Feb 21, 2017
- Infineon Technologies AG
- Reinhard Hess
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for manufacturing a chip arrangement, methods for manufactu...
- Patent number 8,951,915
- Issue date Feb 10, 2015
- Infineon Technologies AG
- Reinhard Hess
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device including a semiconductor chip and a carrier and fabrication...
- Patent number 8,637,379
- Issue date Jan 28, 2014
- Infineon Technologies AG
- Hannes Eder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip, semiconductor device and methods for producing...
- Patent number 8,324,115
- Issue date Dec 4, 2012
- Infineon Technologies AG
- Ralf Otremba
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC

Patents Applicationslast 30 patents

Information Patent Application
Processing of Semiconductor Devices
- Publication number 20160240366
- Publication date Aug 18, 2016
- INFINEON TECHNOLOGIES AG
- Manfred Engelhardt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Producing a Semiconductor Device and a Semiconductor Device
- Publication number 20160071819
- Publication date Mar 10, 2016
- INFINEON TECHNOLOGIES AUSTRIA AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR MANUFACTURING A CHIP ARRANGEMENT, METHODS FOR MANUFACTU...
- Publication number 20150115417
- Publication date Apr 30, 2015
- INFINEON TECHNOLOGIES AG
- Reinhard Hess
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thinning in package using separation structure as stop
- Publication number 20150108666
- Publication date Apr 23, 2015
- INFINEON TECHNOLOGIES AG
- Manfred ENGELHARDT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Removable indicator structure in electronic chips of a common subst...
- Publication number 20140327003
- Publication date Nov 6, 2014
- Edward FUERGUT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods for manufacturing a chip arrangement, methods for manufactu...
- Publication number 20140070376
- Publication date Mar 13, 2014
- INFINEON TECHNOLOGIES AG
- Reinhard Hess
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE INCLUDING A SEMICONDUCTOR CHIP AND A CARRIER AND FABRICATION...
- Publication number 20110084369
- Publication date Apr 14, 2011
- INFINEON TECHNOLOGIES AG
- Hannes Eder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor chip, semiconductor device and methods for producing...
- Publication number 20080105907
- Publication date May 8, 2008
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS

Hannes Eder

Person

Patents Grantslast 30 patents

Method of producing a semiconductor device and a semiconductor device

Thinning in package using separation structure as stop

Methods for manufacturing a chip arrangement, methods for manufactu...

Methods for manufacturing a chip arrangement, methods for manufactu...

Device including a semiconductor chip and a carrier and fabrication...

Semiconductor chip, semiconductor device and methods for producing...

Patents Applicationslast 30 patents

Processing of Semiconductor Devices

Method of Producing a Semiconductor Device and a Semiconductor Device

METHODS FOR MANUFACTURING A CHIP ARRANGEMENT, METHODS FOR MANUFACTU...

Thinning in package using separation structure as stop

Removable indicator structure in electronic chips of a common subst...

Methods for manufacturing a chip arrangement, methods for manufactu...

DEVICE INCLUDING A SEMICONDUCTOR CHIP AND A CARRIER AND FABRICATION...

Semiconductor chip, semiconductor device and methods for producing...