Hannes Voraberger

Person

Graz, AT

People

Patents Grantslast 30 patents

Information Patent Grant
Component carrier with adhesion promoting shape of wiring structure
- Patent number 11,044,812
- Issue date Jun 22, 2021
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Hannes Voraberger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Highly thermally conductive dielectric structure for heat spreading...
- Patent number 10,880,988
- Issue date Dec 29, 2020
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Jonathan Silvano De Sousa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Embedding component with pre-connected pillar in component carrier
- Patent number 10,765,005
- Issue date Sep 1, 2020
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Hannes Stahr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a printed circuit board
- Patent number 10,492,288
- Issue date Nov 26, 2019
- AT & S Austria Technologie & Systemtechnik Aktiengesellschaft
- Simon Sebanz
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Deformed layer for short electric connection between structures of...
- Patent number 10,410,963
- Issue date Sep 10, 2019
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Gerald Weis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component carrier with adhesion promoting shape of wiring structure
- Patent number 10,349,521
- Issue date Jul 9, 2019
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Hannes Voraberger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a printed circuit board
- Patent number 9,795,025
- Issue date Oct 17, 2017
- AT&S AUSTRIA TECHNOLOGIE & SYSTEMTECHNIK AKTIENGESELLSCHAFT
- Simon Sebanz
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for fixing an electronic component on a printed circuit boar...
- Patent number 8,541,690
- Issue date Sep 24, 2013
- AT & S Austria Technologie & Systemtechnik Aktiengesellschaft
- Hannes Voraberger
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF MANUFACTURING A PRINTED CIRCUIT BOARD
- Publication number 20200053864
- Publication date Feb 13, 2020
- AT & S AUSTRIA TECHNOLOGIE & SYSTEMTECHNIK AKTIENGESELLSCHAFT
- Simon Sebanz
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Component Carrier With Adhesion Promoting Shape of Wiring Structure
- Publication number 20190274218
- Publication date Sep 5, 2019
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Hannes Voraberger
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Highly Thermally Conductive Dielectric Structure for Heat Spreading...
- Publication number 20190223285
- Publication date Jul 18, 2019
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Jonathan Sivano De Sousa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Embedding Component With Pre-Connected Pillar in Component Carrier
- Publication number 20190124772
- Publication date Apr 25, 2019
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Hannes Stahr
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Component Carrier With Adhesion Promoting Shape of Wiring Structure
- Publication number 20180132354
- Publication date May 10, 2018
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Hannes Voraberger
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING A PRINTED CIRCUIT BOARD
- Publication number 20180042099
- Publication date Feb 8, 2018
- AT & S AUSTRIA TECHNOLOGIES & SYSTEMTECHNIK AKTIENGESELLSCHAFT
- Simon Sebanz
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING A RIGID-FLEX PRINTED CIRCUIT BOARD OR A SUB...
- Publication number 20140216792
- Publication date Aug 7, 2014
- AT & S AUSTRIA TECHNOLOGIE & SYSTEMTECHNIK AKTIENGESELLSCHAFT
- Simon Sebanz
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING A PRINTED CIRCUIT BOARD OR A SUB-ASSEMBLY T...
- Publication number 20140216793
- Publication date Aug 7, 2014
- AT & S AUSTRIA TECHNOLOGIE & SYSTEMTECHNIK AKTIENGESELLSCHAFT
- Simon Sebanz
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
OPTICAL EVANESCENT FIELD SENSOR
- Publication number 20130202488
- Publication date Aug 8, 2013
- Gregor Langer
- G02 - OPTICS
Information Patent Application
METHOD FOR IMPROVING THE CORROSION RESISTANCE OF AN ELECTRONIC COMP...
- Publication number 20110171367
- Publication date Jul 14, 2011
- Hannes Voraberger
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for fixing an electronic component on a printed circuit boar...
- Publication number 20090101398
- Publication date Apr 23, 2009
- Hannes Voraberger
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Hannes Voraberger

Person

Patents Grantslast 30 patents

Component carrier with adhesion promoting shape of wiring structure

Highly thermally conductive dielectric structure for heat spreading...

Embedding component with pre-connected pillar in component carrier

Method of manufacturing a printed circuit board

Deformed layer for short electric connection between structures of...

Component carrier with adhesion promoting shape of wiring structure

Method of manufacturing a printed circuit board

Method for fixing an electronic component on a printed circuit boar...

Patents Applicationslast 30 patents

METHOD OF MANUFACTURING A PRINTED CIRCUIT BOARD

Component Carrier With Adhesion Promoting Shape of Wiring Structure

Highly Thermally Conductive Dielectric Structure for Heat Spreading...

Embedding Component With Pre-Connected Pillar in Component Carrier

Component Carrier With Adhesion Promoting Shape of Wiring Structure

METHOD OF MANUFACTURING A PRINTED CIRCUIT BOARD

METHOD OF MANUFACTURING A RIGID-FLEX PRINTED CIRCUIT BOARD OR A SUB...

METHOD OF MANUFACTURING A PRINTED CIRCUIT BOARD OR A SUB-ASSEMBLY T...

OPTICAL EVANESCENT FIELD SENSOR

METHOD FOR IMPROVING THE CORROSION RESISTANCE OF AN ELECTRONIC COMP...

Method for fixing an electronic component on a printed circuit boar...