Hannsjorg Obermaier

Person

Los Gotos, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Cooling plate arrangement for electronic components
- Patent number 6,687,126
- Issue date Feb 3, 2004
- Hewlett-Packard Development Company, L.P.
- Chandrakant D. Patel
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method of manufacturing multilayer substrates
- Patent number 6,656,314
- Issue date Dec 2, 2003
- Hewlett-Packard Development Company, L.P.
- Hannsjorg Obermaier
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power distribution in multi-chip modules
- Patent number 6,600,220
- Issue date Jul 29, 2003
- Hewlett-Packard Company
- Vernon Alan Barber
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Cooling arrangement for high density packaging of electronic compon...
- Patent number 6,496,375
- Issue date Dec 17, 2002
- Hewlett-Packard Company
- Chandrakant D. Patel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
On-line replacement apparatus for printed circuit cards
- Patent number 6,185,104
- Issue date Feb 6, 2001
- Hewlett-Packard Company
- Hannsjorg Obermaier
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Minimal length computer backplane
- Patent number 5,966,293
- Issue date Oct 12, 1999
- Hewlett-Packard Company
- Hannsjorg Obermaier
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Spring-biased heat sink assembly for a plurality of integrated circ...
- Patent number 5,430,611
- Issue date Jul 4, 1995
- Hewlett-Packard Company
- Chandrakant Patel
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Method of manufacturing multilayer substrates
- Publication number 20020176961
- Publication date Nov 28, 2002
- Hannsjorg Obermaier
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
Power distribution in multi-chip modules
- Publication number 20020167080
- Publication date Nov 14, 2002
- Vernon Alan Barber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Cooling arrangement for high density packaging of electronic compon...
- Publication number 20020159237
- Publication date Oct 31, 2002
- Chandrkant D. Patel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Cooling plate arrangement for electronic components
- Publication number 20020159233
- Publication date Oct 31, 2002
- Chandrakant D. Patel
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
PRINTED CIRCUIT CARD CARRIER FOR LONGITUDINAL ON-LINE REPLACEMENT
- Publication number 20020081890
- Publication date Jun 27, 2002
- HANNSJORG OBERMAIER
- H01 - BASIC ELECTRIC ELEMENTS

Hannsjorg Obermaier

Person

Patents Grantslast 30 patents

Cooling plate arrangement for electronic components

Method of manufacturing multilayer substrates

Power distribution in multi-chip modules

Cooling arrangement for high density packaging of electronic compon...

On-line replacement apparatus for printed circuit cards

Minimal length computer backplane

Spring-biased heat sink assembly for a plurality of integrated circ...

Patents Applicationslast 30 patents

Method of manufacturing multilayer substrates

Power distribution in multi-chip modules

Cooling arrangement for high density packaging of electronic compon...

Cooling plate arrangement for electronic components

PRINTED CIRCUIT CARD CARRIER FOR LONGITUDINAL ON-LINE REPLACEMENT