Hanqing Hu

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Suzhou, CN

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Patents Grantslast 30 patents

Information Patent Grant
Optical fingerprint recognition chip package and packaging method
- Patent number 10,817,700
- Issue date Oct 27, 2020
- China Wafer Level CSP Co., Ltd.
- Zhiqi Wang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Chip package and chip packaging method
- Patent number 10,541,186
- Issue date Jan 21, 2020
- China Wafer Level CSP Co., Ltd.
- Zhiqi Wang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
OPTICAL FINGERPRINT RECOGNITION CHIP PACKAGE AND PACKAGING METHOD
- Publication number 20200234028
- Publication date Jul 23, 2020
- China Wafer Level CSP Co., Ltd.
- Zhiqi Wang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
PACKAGING METHOD AND PACKAGING STRUCTURE FOR SEMICONDUCTOR CHIP
- Publication number 20190296064
- Publication date Sep 26, 2019
- China Wafer Level CSP Co., Ltd.
- Zhiqi Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL FINGERPRINT RECOGNITION CHIP PACKAGE AND PACKAGING METHOD
- Publication number 20190188447
- Publication date Jun 20, 2019
- China Wafer Level CSP Co., Ltd.
- Zhiqi Wang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
PACKAGING METHOD AND PACKAGE STRUCTURE FOR FINGERPRINT RECOGNITION...
- Publication number 20190013302
- Publication date Jan 10, 2019
- China Wafer Level CSP Co., Ltd.
- Zhiqi Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND CHIP PACKAGING METHOD
- Publication number 20180366387
- Publication date Dec 20, 2018
- China Wafer Level CSP Co., Ltd.
- Zhiqi Wang
- H01 - BASIC ELECTRIC ELEMENTS