Hans Adolf Gerber

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Burghausen, DE

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor wafers with highly precise edge profile and method fo...
- Patent number 7,767,470
- Issue date Aug 3, 2010
- Siltronic AG
- Peter Wagner
- B24 - GRINDING POLISHING
Information Patent Grant
Holding device and method for treating wafer-like objects, and a me...
- Patent number 5,093,550
- Issue date Mar 3, 1992
- Wacker-Chemitronic Gesellschaft fur Elektronic-Grundstoffe mbH
- Hans A. Gerber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for the manufacture of semiconductor wafers with a rear sid...
- Patent number 4,539,050
- Issue date Sep 3, 1985
- Wacker-Chemitronic Gesellschaft fur Elektronik-Grundstoffe mbH
- Josef Kramler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making reference surface markings on semiconductor wafers...
- Patent number 4,522,656
- Issue date Jun 11, 1985
- Wacker-Chemitronic Gesellschaft fur Elektronik-Grundstoffe mbH
- Franz Kuhn-Kuhnenfeld
- B44 - DECORATIVE ARTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor Wafers With Highly Precise Edge Profile And Method Fo...
- Publication number 20080036040
- Publication date Feb 14, 2008
- Siltronic AG
- Peter Wagner
- B24 - GRINDING POLISHING