Hans Krueger

Person

Munich, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Wafer-level package and method for production thereof
- Patent number 9,647,196
- Issue date May 9, 2017
- Snaptrack, Inc.
- Christian Bauer
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Component and method for producing a component
- Patent number 9,382,110
- Issue date Jul 5, 2016
- EPCOS AG
- Christian Bauer
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for connecting a plurality of unpackaged substrates
- Patent number 9,165,905
- Issue date Oct 20, 2015
- EPCOS AG
- Hans Krueger
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method and apparatus for producing chip devices, and chip device pr...
- Patent number 9,114,979
- Issue date Aug 25, 2015
- EPCOS AG
- Michael Gerner
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Miniaturized electrical component comprising an MEMS and an ASIC an...
- Patent number 9,056,760
- Issue date Jun 16, 2015
- EPCOS AG
- Gregor Feiertag
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Circuit board with flexible region and method for production thereof
- Patent number 9,035,189
- Issue date May 19, 2015
- EPCOS AC
- Wolfgang Pahl
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
MEMS microphone and method for producing the MEMS microphone
- Patent number 8,865,499
- Issue date Oct 21, 2014
- EPCOS AG
- Wolfgang Pahl
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Hermetically sealed housing for electronic components and manufactu...
- Patent number 8,759,677
- Issue date Jun 24, 2014
- EPCOS AG
- Christian Bauer
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Element with optical marking, manufacturing method, and use
- Patent number 8,691,369
- Issue date Apr 8, 2014
- EPCOS AG
- Alexander Schmajew
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Semiconductor chip arrangement with sensor chip and manufacturing m...
- Patent number 8,580,613
- Issue date Nov 12, 2013
- EPCOS AG
- Gregor Feiertag
- G01 - MEASURING TESTING
Information Patent Grant
MEMS package and method for the production thereof
- Patent number 8,432,007
- Issue date Apr 30, 2013
- EPCOS AG
- Anton Leidl
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for producing a MEMS package
- Patent number 8,404,516
- Issue date Mar 26, 2013
- EPCOS AG
- Christian Bauer
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS package and method for the production thereof
- Patent number 8,169,041
- Issue date May 1, 2012
- EPCOS AG
- Wolfgang Pahl
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS component and method for production
- Patent number 8,110,962
- Issue date Feb 7, 2012
- EPCOS AG
- Christian Bauer
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Component with reduced temperature response, and method for production
- Patent number 8,098,001
- Issue date Jan 17, 2012
- EPCOS AG
- Wolfgang Pahl
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Flip-chip component production method
- Patent number 7,673,386
- Issue date Mar 9, 2010
- EPCOS AG
- Alois Stelzl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for hermetically encapsulating a component
- Patent number 7,552,532
- Issue date Jun 30, 2009
- EPCOS AG
- Alois Stelzl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Encapsulated electrical component and production method
- Patent number 7,544,540
- Issue date Jun 9, 2009
- EPCOS AG
- Christian Bauer
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Electric component with a flip-chip construction
- Patent number 7,518,249
- Issue date Apr 14, 2009
- EPCOS AG
- Hans Krueger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Encapsulated electronic component and production method
- Patent number 7,388,281
- Issue date Jun 17, 2008
- EPCOS AG
- Hans Krueger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for the hermetic encapsulation of a component
- Patent number 7,259,041
- Issue date Aug 21, 2007
- EPCOS AG
- Alois Stelzl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Encapsulated component which is small in terms of height and method...
- Patent number 6,982,380
- Issue date Jan 3, 2006
- EPCOS AG
- Christian Hoffmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for manufacturing an electronic component, in particular a...
- Patent number 6,722,030
- Issue date Apr 20, 2004
- EPCOS AG
- Alois Stelzl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stripline laser resonator
- Patent number 5,502,740
- Issue date Mar 26, 1996
- Siemens Aktiengesellschaft
- Wolfgang Welsch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Diffusion-cooled CO.sub.2 stripline laser having reduced ignition v...
- Patent number 5,434,881
- Issue date Jul 18, 1995
- Siemens Aktiengesellschaft
- Wolfgang Welsch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stripline laser having composite electrodes
- Patent number 5,430,753
- Issue date Jul 4, 1995
- Siemens Aktiengesellschaft
- Wolfgang Welsch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gas laser
- Patent number 5,303,252
- Issue date Apr 12, 1994
- Siemens Aktiengesellschaft
- Wolfgang Welsch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stripline laser including electrically conducting mirror
- Patent number 5,293,573
- Issue date Mar 8, 1994
- Siemens Aktiengesellschaft
- Wolfgang Welsch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Waveguide laser for use at high laser power
- Patent number 5,271,029
- Issue date Dec 14, 1993
- Siemens Aktiengesellschaft
- Werner Seiffarth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mirror mount for lasers
- Patent number 5,268,923
- Issue date Dec 7, 1993
- Siemens Aktiengesellschaft
- Wolfgang Welsch
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SIMPLE TO PRODUCE ELECTRIC COMPONENT AND METHOD FOR PRODUCING AN EL...
- Publication number 20170272855
- Publication date Sep 21, 2017
- SnapTrack, Inc.
- Christian BAUER
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Component and Method for Producing a Component
- Publication number 20140226285
- Publication date Aug 14, 2014
- EPCOS AG
- Christian Bauer
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Wafer-Level Package and Method for Production Thereof
- Publication number 20140111062
- Publication date Apr 24, 2014
- EPCOS AG
- Christian Bauer
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Component and Method for Producing a Component
- Publication number 20130214405
- Publication date Aug 22, 2013
- EPCOS AG
- Christian Bauer
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS Microphone And Method For Producing The MEMS Microphone
- Publication number 20130140656
- Publication date Jun 6, 2013
- EPCOS AG
- Wolfgang Pahl
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Miniaturized Electrical Component Comprising an MEMS and an ASIC an...
- Publication number 20130119492
- Publication date May 16, 2013
- EPCOS AG
- Gregor Feiertag
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Method for Connecting a Plurality of Unpackaged Substrates
- Publication number 20120159778
- Publication date Jun 28, 2012
- EPCOS AG
- Hans Krueger
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Method and Apparatus for Producing Chip Devices, and Chip Device Pr...
- Publication number 20120061778
- Publication date Mar 15, 2012
- EPCOS AG
- Michael Gerner
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR CHIP ARRANGEMENT WITH SENSOR CHIP AND MANUFACTURING M...
- Publication number 20110233690
- Publication date Sep 29, 2011
- EPCOS AG
- Gregor Feiertag
- G01 - MEASURING TESTING
Information Patent Application
Circuit Board with Flexible Region and Method for Production Thereof
- Publication number 20110214905
- Publication date Sep 8, 2011
- EPCOS AG
- Wolfgang Pahl
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MEMS Package and Method for the Production Thereof
- Publication number 20110186943
- Publication date Aug 4, 2011
- EPCOS AG
- Wolfgang Pahl
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
HERMETICALLY SEALED HOUSING FOR ELECTRONIC COMPONENTS AND MANUFACTU...
- Publication number 20110114355
- Publication date May 19, 2011
- EPCOS AG
- Christian Bauer
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Component with Reduced Temperature Response, and Method for Production
- Publication number 20100187949
- Publication date Jul 29, 2010
- Wolfgang Pahl
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
MEMS Component and Method for Production
- Publication number 20100148285
- Publication date Jun 17, 2010
- Christian Bauer
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
Method for Producing a MEMS Package
- Publication number 20100127377
- Publication date May 27, 2010
- Christian Bauer
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Element with Optical Marking, Manufacturing Method, and Use
- Publication number 20090104415
- Publication date Apr 23, 2009
- Alexander Schmajew
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
Flip-Chip Component and Method for its Production
- Publication number 20090071710
- Publication date Mar 19, 2009
- Alois Stelzl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Mems Package and Method for the Production Thereof
- Publication number 20090001553
- Publication date Jan 1, 2009
- EPCOS AG
- Wolfgang Pahl
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Electric Component With A Flip-Chip Construction
- Publication number 20080048317
- Publication date Feb 28, 2008
- EPCOS AG
- Hans Krueger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Encapsulated Electrical Component and Production Method
- Publication number 20070222056
- Publication date Sep 27, 2007
- EPCOS AG
- Christian Bauer
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Encapsulated electronic component and production method
- Publication number 20060151203
- Publication date Jul 13, 2006
- Hans Krueger
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
Method for the hermetic encapsulation of a component
- Publication number 20050121785
- Publication date Jun 9, 2005
- Alois Stelzl
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
Encapsulated component which is small in terms of height and method...
- Publication number 20050034888
- Publication date Feb 17, 2005
- Christian Hoffmann
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
Method for hermetically encapsulating a component
- Publication number 20040237299
- Publication date Dec 2, 2004
- Alois Stelzl
- H01 - BASIC ELECTRIC ELEMENTS

Hans Krueger

Person

Patents Grantslast 30 patents

Wafer-level package and method for production thereof

Component and method for producing a component

Method for connecting a plurality of unpackaged substrates

Method and apparatus for producing chip devices, and chip device pr...

Miniaturized electrical component comprising an MEMS and an ASIC an...

Circuit board with flexible region and method for production thereof

MEMS microphone and method for producing the MEMS microphone

Hermetically sealed housing for electronic components and manufactu...

Element with optical marking, manufacturing method, and use

Semiconductor chip arrangement with sensor chip and manufacturing m...

MEMS package and method for the production thereof

Method for producing a MEMS package

MEMS package and method for the production thereof

MEMS component and method for production

Component with reduced temperature response, and method for production

Flip-chip component production method

Method for hermetically encapsulating a component

Encapsulated electrical component and production method

Electric component with a flip-chip construction

Encapsulated electronic component and production method

Method for the hermetic encapsulation of a component

Encapsulated component which is small in terms of height and method...

Process for manufacturing an electronic component, in particular a...

Stripline laser resonator

Diffusion-cooled CO.sub.2 stripline laser having reduced ignition v...

Stripline laser having composite electrodes

Gas laser

Stripline laser including electrically conducting mirror

Waveguide laser for use at high laser power

Mirror mount for lasers

Patents Applicationslast 30 patents

SIMPLE TO PRODUCE ELECTRIC COMPONENT AND METHOD FOR PRODUCING AN EL...

Component and Method for Producing a Component

Wafer-Level Package and Method for Production Thereof

Component and Method for Producing a Component

MEMS Microphone And Method For Producing The MEMS Microphone

Miniaturized Electrical Component Comprising an MEMS and an ASIC an...

Method for Connecting a Plurality of Unpackaged Substrates

Method and Apparatus for Producing Chip Devices, and Chip Device Pr...

SEMICONDUCTOR CHIP ARRANGEMENT WITH SENSOR CHIP AND MANUFACTURING M...

Circuit Board with Flexible Region and Method for Production Thereof

MEMS Package and Method for the Production Thereof

HERMETICALLY SEALED HOUSING FOR ELECTRONIC COMPONENTS AND MANUFACTU...

Component with Reduced Temperature Response, and Method for Production

MEMS Component and Method for Production

Method for Producing a MEMS Package

Element with Optical Marking, Manufacturing Method, and Use

Flip-Chip Component and Method for its Production

Mems Package and Method for the Production Thereof

Electric Component With A Flip-Chip Construction

Encapsulated Electrical Component and Production Method

Encapsulated electronic component and production method

Method for the hermetic encapsulation of a component

Encapsulated component which is small in terms of height and method...

Method for hermetically encapsulating a component