HANSUNG RYU

Person

Yongin-si, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package with stiffener
- Patent number 12,272,610
- Issue date Apr 8, 2025
- Samsung Electronics Co., Ltd.
- Hansung Ryu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 11,574,819
- Issue date Feb 7, 2023
- Samsung Electronics Co., Ltd.
- Chanho Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 10,937,667
- Issue date Mar 2, 2021
- Samsung Electronics Co., Ltd.
- Chanho Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages
- Patent number 10,937,771
- Issue date Mar 2, 2021
- Samsung Electronics Co., Ltd.
- Jichul Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 10,699,915
- Issue date Jun 30, 2020
- Samsung Electronics Co., Ltd.
- Chanho Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages having redistribution substrate
- Patent number 10,347,611
- Issue date Jul 9, 2019
- Samsung Electronics Co., Ltd.
- Jichul Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 10,211,070
- Issue date Feb 19, 2019
- Samsung Electronics Co., Ltd.
- Chanho Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of fabricating the same
- Patent number 9,978,694
- Issue date May 22, 2018
- Samsung Electronics Co., Ltd.
- Kyongsoon Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including image sensor and holder with transp...
- Patent number 9,640,575
- Issue date May 2, 2017
- Samsung Electronics Co., Ltd.
- Hansung Ryu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including an image sensor and a holder with s...
- Patent number 9,324,748
- Issue date Apr 26, 2016
- Samsung Electronics Co., Ltd.
- Hansung Ryu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING DUMMY PADS AND MANUFACTURING METHOD...
- Publication number 20250157962
- Publication date May 15, 2025
- Samsung Electronics Co., Ltd.
- HANSUNG RYU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH BANDWIDTH MEMORY
- Publication number 20250151293
- Publication date May 8, 2025
- Samsung Electronics Co., Ltd.
- Jeehyun JUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250132227
- Publication date Apr 24, 2025
- Samsung Electronics Co., Ltd.
- Hansung Ryu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20250132274
- Publication date Apr 24, 2025
- Samsung Electronics Co., Ltd.
- Hansung Ryu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250022812
- Publication date Jan 16, 2025
- Samsung Electronics Co., Ltd.
- Hansung Ryu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHOD FOR FABRICATING THE SAME
- Publication number 20240172371
- Publication date May 23, 2024
- Samsung Electronics Co., Ltd.
- JIHYUN LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240105657
- Publication date Mar 28, 2024
- Samsung Electronics Co., Ltd.
- Hansung Ryu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH REINFORCING STRUCTURE
- Publication number 20240063077
- Publication date Feb 22, 2024
- Samsung Electronics Co., Ltd.
- Jongbeom PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH STIFFENER
- Publication number 20220059420
- Publication date Feb 24, 2022
- Samsung Electronics Co., Ltd.
- Hansung RYU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20210183663
- Publication date Jun 17, 2021
- Samsung Electronics Co., Ltd.
- Chanho LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20200273723
- Publication date Aug 27, 2020
- Samsung Electronics Co., Ltd.
- Chanho LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20190287951
- Publication date Sep 19, 2019
- Samsung Electronics Co., Ltd.
- JICHUL KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20190139785
- Publication date May 9, 2019
- Samsung Electronics Co., Ltd.
- Chanho LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20180315620
- Publication date Nov 1, 2018
- Samsung Electronics Co., Ltd.
- Chanho LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20180068958
- Publication date Mar 8, 2018
- Samsung Electronics Co., Ltd.
- KyongSoon CHO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20170207205
- Publication date Jul 20, 2017
- Jichul KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE STRIP
- Publication number 20160379937
- Publication date Dec 29, 2016
- Samsung Electronics Co., Ltd.
- KyongSoon CHO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20160218130
- Publication date Jul 28, 2016
- Samsung Electronics Co., Ltd.
- HANSUNG RYU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20140264699
- Publication date Sep 18, 2014
- Samsung Electronics Co., Ltd.
- HANSUNG RYU
- H01 - BASIC ELECTRIC ELEMENTS

HANSUNG RYU

Person

Patents Grantslast 30 patents

Semiconductor package with stiffener

Semiconductor device and method for manufacturing the same

Semiconductor device and method for manufacturing the same

Semiconductor packages

Semiconductor device and method for manufacturing the same

Semiconductor packages having redistribution substrate

Semiconductor device and method for manufacturing the same

Semiconductor package and method of fabricating the same

Semiconductor package including image sensor and holder with transp...

Semiconductor package including an image sensor and a holder with s...

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE INCLUDING DUMMY PADS AND MANUFACTURING METHOD...

HIGH BANDWIDTH MEMORY

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGES AND METHOD FOR FABRICATING THE SAME

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE WITH REINFORCING STRUCTURE

SEMICONDUCTOR PACKAGE WITH STIFFENER

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGES

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR PACKAGES

SUBSTRATE STRIP

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME