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Concord, MA, US
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last 30 patents
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Patent Grant
Deskewing method for a physical layer interface on a multi-chip module
Patent number
11,283,589
Issue date
Mar 22, 2022
Advanced Micro Devices, Inc.
Varun Gupta
H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information
Patent Grant
Deskewing method for a physical layer interface on a multi-chip module
Patent number
10,873,445
Issue date
Dec 22, 2020
Advanced Micro Devices, Inc.
Varun Gupta
H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information
Patent Grant
Deskewing method for a physical layer interface on a multi-chip module
Patent number
10,581,587
Issue date
Mar 3, 2020
Advanced Micro Devices, Inc.
Varun Gupta
H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information
Patent Grant
Microprocessor module with integrated voltage regulators
Patent number
6,865,682
Issue date
Mar 8, 2005
Samsung Electronics Co., Ltd.
Gerald Talbot
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Dynamic initialization of processor module via motherboard interface
Patent number
6,772,328
Issue date
Aug 3, 2004
Samsung Electronics Co., Ltd.
Gerald Talbot
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Common motherboard interface for processor modules of multiple arch...
Patent number
6,516,373
Issue date
Feb 4, 2003
Samsung Electronics Co., Ltd.
Gerald Talbot
G06 - COMPUTING CALCULATING COUNTING
Patents Applications
last 30 patents
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Patent Application
DESKEWING METHOD FOR A PHYSICAL LAYER INTERFACE ON A MULTI-CHIP MODULE
Publication number
20210111861
Publication date
Apr 15, 2021
ADVANCED MICRO DEVICES, INC.
Varun Gupta
H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information
Patent Application
DESKEWING METHOD FOR A PHYSICAL LAYER INTERFACE ON A MULTI-CHIP MODULE
Publication number
20200344039
Publication date
Oct 29, 2020
ADVANCED MICRO DEVICES, INC.
Varun Gupta
H04 - ELECTRIC COMMUNICATION TECHNIQUE