Hao-Cheng Hou

Person

Hsinchu, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor packages and methods of forming same
- Patent number 12,142,560
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chung-Shi Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure comprising buffer layer for reducing thermal stre...
- Patent number 11,961,777
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Chih Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with through vias and stacked redistribution...
- Patent number 11,894,341
- Issue date Feb 6, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tsung-Ding Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having molded die and semiconductor die and m...
- Patent number 11,538,761
- Issue date Dec 27, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hao-Cheng Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connector formation methods and packaged semiconductor devices
- Patent number 11,424,199
- Issue date Aug 23, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jung Wei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure comprising buffer layer for reducing thermal stre...
- Patent number 11,404,342
- Issue date Aug 2, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Chih Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including dies having high-modulus dielectric...
- Patent number 11,270,921
- Issue date Mar 8, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hao-Cheng Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 11,145,639
- Issue date Oct 12, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jung-Wei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Redistribution structures in semiconductor packages and methods of...
- Patent number 11,101,209
- Issue date Aug 24, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chung-Shi Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and semiconductor device
- Patent number 11,088,069
- Issue date Aug 10, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hao-Cheng Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure
- Patent number 10,818,614
- Issue date Oct 27, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Meng-Tse Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connector formation methods and packaged semiconductor devices
- Patent number 10,522,486
- Issue date Dec 31, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jung Wei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of fabricating the same
- Patent number 10,504,858
- Issue date Dec 10, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd
- Meng-Tse Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package substrates, packaged semiconductor devices, and methods of...
- Patent number 10,128,208
- Issue date Nov 13, 2018
- Taiwan Semiconductor Manufacturing Company
- Hao-Cheng Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated fan-out package and method of fabricating the same
- Patent number 10,074,604
- Issue date Sep 11, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hao-Cheng Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate design for semiconductor packages and method of forming same
- Patent number 10,026,671
- Issue date Jul 17, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package structure and methods for forming the same
- Patent number 9,985,013
- Issue date May 29, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien-Hsun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device with optimized thermal characteristics
- Patent number 9,929,115
- Issue date Mar 27, 2018
- Taiwan Semiconductor Manufacturing Company Ltd.
- Hao-Cheng Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package substrates, packaged semiconductor devices, and methods of...
- Patent number 9,917,068
- Issue date Mar 13, 2018
- Taiwan Semiconductor Manufacturing Company
- Hao-Cheng Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structures and methods of forming the same
- Patent number 9,859,267
- Issue date Jan 2, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hao-Cheng Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated fan-out package and method of fabricating the same
- Patent number 9,824,902
- Issue date Nov 21, 2017
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hao-Cheng Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connector formation methods and packaged semiconductor devices
- Patent number 9,691,723
- Issue date Jun 27, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jung Wei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structures and methods of forming the same
- Patent number 9,564,416
- Issue date Feb 7, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hao-Cheng Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package structure and methods for forming the same
- Patent number 9,165,876
- Issue date Oct 20, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien-Hsun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Magnetic recording media and method for making the same
- Patent number 8,658,293
- Issue date Feb 25, 2014
- National Tsing Hua University
- Chih-Huang Lai
- G11 - INFORMATION STORAGE
Information Patent Grant
Perpendicular magnetic recording medium
- Patent number 7,989,098
- Issue date Aug 2, 2011
- National Tsing Hua University
- Chih-Huang Lai
- G11 - INFORMATION STORAGE

Patents Applicationslast 30 patents

Information Patent Application
INTERPOSER HAVING FIRST AND SECOND REDISTRIBUTION LAYERS AND METHOD...
- Publication number 20240387386
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Shang-Yun Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF FORMING SAME
- Publication number 20240379535
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chung-Shi Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE INCLUDING LOWER MOLDED STRUCTURE INCLUDING A SUBS...
- Publication number 20240321759
- Publication date Sep 26, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Tsung-Ding Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Redistribution Lines and The Method Forming the Same Through Stitching
- Publication number 20240310733
- Publication date Sep 19, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shang-Yun Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF FORMING SAME
- Publication number 20240234302
- Publication date Jul 11, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chung-Shi Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE COMPRISING BUFFER LAYER FOR REDUCING THERMAL STRE...
- Publication number 20240222215
- Publication date Jul 4, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Chih Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240128232
- Publication date Apr 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Ding Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Three-Dimensional Semiconductor Device and Method
- Publication number 20240105631
- Publication date Mar 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jeng-An Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240071939
- Publication date Feb 29, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jung-Wei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20240071999
- Publication date Feb 29, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tseng Hsing Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20240071888
- Publication date Feb 29, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien-Chang Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240061037
- Publication date Feb 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hao-Cheng Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE WITH INTEGRATED VOLTAGE REGULATOR AND METHOD FORMING THE SAME
- Publication number 20240055468
- Publication date Feb 15, 2024
- TAIWAN SEMICONDUCTOR MANUFACTRING CO., LTD.
- Wei-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND FORMING METHOD THEREOF
- Publication number 20240047322
- Publication date Feb 8, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chin-Liang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packages with Chips Comprising Inductor-Vias and Methods Forming th...
- Publication number 20240047509
- Publication date Feb 8, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hao-Cheng Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Packages and Methods of Forming the Same
- Publication number 20240038646
- Publication date Feb 1, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chi-Yang Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHODS OF FABRICATING A SEMICONDUCTOR PA...
- Publication number 20240030157
- Publication date Jan 25, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chin-Liang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROBE CARD SUBSTRATE, SUBSTRATE STRUCTURE AND METHOD OF FABRICATING...
- Publication number 20230358786
- Publication date Nov 9, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Yu Chen
- G01 - MEASURING TESTING
Information Patent Application
LAMINATED STRUCTURE WITH PADS AND MANUFACTURING METHOD THEREOF
- Publication number 20230319991
- Publication date Oct 5, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hao-Cheng Hou
- G01 - MEASURING TESTING
Information Patent Application
Packages Including Interconnect Die Embedded in Package Substrates
- Publication number 20230307427
- Publication date Sep 28, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Sheng-Chi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package and Method of Forming the Same
- Publication number 20230307375
- Publication date Sep 28, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hao-Cheng Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING SUBSTRATE INCLUDING AN UNDERFILL INJECTION OPENING AND ME...
- Publication number 20230307345
- Publication date Sep 28, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Hao-Cheng Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHOD OF MANUFACTURING THE SAME
- Publication number 20220367366
- Publication date Nov 17, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hao-Cheng Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Connector Formation Methods and Packaged Semiconductor Devices
- Publication number 20220359436
- Publication date Nov 10, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jung Wei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE COMPRISING BUFFER LAYER FOR REDUCING THERMAL STRE...
- Publication number 20220328372
- Publication date Oct 13, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Chih Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20220216153
- Publication date Jul 7, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hao-Cheng Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF FORMING SAME
- Publication number 20210384120
- Publication date Dec 9, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chung-Shi Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20210242172
- Publication date Aug 5, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Ding Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20210242100
- Publication date Aug 5, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hao-Cheng Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20210183844
- Publication date Jun 17, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jung-Wei Cheng
- H01 - BASIC ELECTRIC ELEMENTS

Hao-Cheng Hou

Person

Patents Grantslast 30 patents

Semiconductor packages and methods of forming same

Package structure comprising buffer layer for reducing thermal stre...

Semiconductor package with through vias and stacked redistribution...

Semiconductor package having molded die and semiconductor die and m...

Connector formation methods and packaged semiconductor devices

Package structure comprising buffer layer for reducing thermal stre...

Semiconductor package including dies having high-modulus dielectric...

Semiconductor package and manufacturing method thereof

Redistribution structures in semiconductor packages and methods of...

Semiconductor package and semiconductor device

Package structure

Connector formation methods and packaged semiconductor devices

Package structure and method of fabricating the same

Package substrates, packaged semiconductor devices, and methods of...

Integrated fan-out package and method of fabricating the same

Substrate design for semiconductor packages and method of forming same

Package-on-package structure and methods for forming the same

Device with optimized thermal characteristics

Package substrates, packaged semiconductor devices, and methods of...

Package structures and methods of forming the same

Integrated fan-out package and method of fabricating the same

Connector formation methods and packaged semiconductor devices

Package structures and methods of forming the same

Package-on-package structure and methods for forming the same

Magnetic recording media and method for making the same

Perpendicular magnetic recording medium

Patents Applicationslast 30 patents

INTERPOSER HAVING FIRST AND SECOND REDISTRIBUTION LAYERS AND METHOD...

SEMICONDUCTOR PACKAGES AND METHODS OF FORMING SAME

PACKAGE STRUCTURE INCLUDING LOWER MOLDED STRUCTURE INCLUDING A SUBS...

Redistribution Lines and The Method Forming the Same Through Stitching

SEMICONDUCTOR PACKAGES AND METHODS OF FORMING SAME

PACKAGE STRUCTURE COMPRISING BUFFER LAYER FOR REDUCING THERMAL STRE...

SEMICONDUCTOR PACKAGE

Three-Dimensional Semiconductor Device and Method

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME

PACKAGE STRUCTURE

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

PACKAGE WITH INTEGRATED VOLTAGE REGULATOR AND METHOD FORMING THE SAME

PACKAGE STRUCTURE AND FORMING METHOD THEREOF

Packages with Chips Comprising Inductor-Vias and Methods Forming th...

Semiconductor Device Packages and Methods of Forming the Same

SEMICONDUCTOR PACKAGE AND METHODS OF FABRICATING A SEMICONDUCTOR PA...

PROBE CARD SUBSTRATE, SUBSTRATE STRUCTURE AND METHOD OF FABRICATING...

LAMINATED STRUCTURE WITH PADS AND MANUFACTURING METHOD THEREOF

Packages Including Interconnect Die Embedded in Package Substrates

Semiconductor Package and Method of Forming the Same

PACKAGING SUBSTRATE INCLUDING AN UNDERFILL INJECTION OPENING AND ME...

SEMICONDUCTOR PACKAGES AND METHOD OF MANUFACTURING THE SAME

Connector Formation Methods and Packaged Semiconductor Devices

PACKAGE STRUCTURE COMPRISING BUFFER LAYER FOR REDUCING THERMAL STRE...

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGES AND METHODS OF FORMING SAME

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF