Hao-Chun Hsieh

Person

New Taipei City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Temperature measuring board device and temperature measuring board...
- Patent number 9,810,582
- Issue date Nov 7, 2017
- Wistron Corporation
- Hao-Chun Hsieh
- G01 - MEASURING TESTING
Information Patent Grant
Process apparatus capable of pushing panel-shaped object and proces...
- Patent number 9,699,911
- Issue date Jul 4, 2017
- Wistron Corporation
- Hao-Chun Hsieh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Feeder system and material guiding carrier thereof
- Patent number 9,591,794
- Issue date Mar 7, 2017
- Wistron Corp.
- Hao-Chun Hsieh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Soldering system of soldering a dip component on a circuit board
- Patent number 8,740,046
- Issue date Jun 3, 2014
- Wistron Corporation
- Hao-Chun Hsieh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and soldering system of soldering a DIP component on a circu...
- Patent number 8,690,041
- Issue date Apr 8, 2014
- Wistron Corporation
- Hao-Chun Hsieh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for assembling components on a circuit board
- Patent number 8,656,583
- Issue date Feb 25, 2014
- Wistron Corporation
- Jun-Min Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Clamping tool and equipment for rework process
- Patent number 8,556,154
- Issue date Oct 15, 2013
- Wistron Corporation
- Hao-Chun Hsieh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Metal shielding can and assembly of the metal shielding can and a c...
- Patent number 8,462,520
- Issue date Jun 11, 2013
- Wistron Corporation
- Hao-Chun Hsieh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
System for assembling components on a circuit board
- Patent number 8,387,233
- Issue date Mar 5, 2013
- Wistron Corporation
- Jun-Min Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Heat conducting apparatus and solder melting method therefor
- Patent number 8,070,050
- Issue date Dec 6, 2011
- Wistron Corporation
- Chia-Hsien Lee
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
PROCESS APPARATUS CAPABLE OF PUSHING PANEL-SHAPED OBJECT AND PROCES...
- Publication number 20150334888
- Publication date Nov 19, 2015
- Wistron Corporation
- Hao-Chun Hsieh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TEMPERATURE MEASURING BOARD DEVICE AND TEMPERATURE MEASURING BOARD...
- Publication number 20150323393
- Publication date Nov 12, 2015
- Wistron Corporation
- Hao-Chun Hsieh
- G01 - MEASURING TESTING
Information Patent Application
FEEDER SYSTEM AND MATERIAL GUIDING CARRIER THEREOF
- Publication number 20150195962
- Publication date Jul 9, 2015
- WISTRON CORP.
- Hao-Chun HSIEH
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDERING SYSTEM OF SOLDERING A DIP COMPONENT ON A CIRCUIT BOARD
- Publication number 20140110458
- Publication date Apr 24, 2014
- Wistron Corporation
- Hao-Chun Hsieh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CLAMPING TOOL AND EQUIPMENT FOR REWORK PROCESS
- Publication number 20130240608
- Publication date Sep 19, 2013
- Wistron Corporation
- Hao-Chun Hsieh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR ASSEMBLING COMPONENTS ON A CIRCUIT BOARD
- Publication number 20130133192
- Publication date May 30, 2013
- Wistron Corporation
- Jun-Min Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD, A SUPPORTING JIG AND A POSITIONING METHOD
- Publication number 20120261870
- Publication date Oct 18, 2012
- Wistron Corporation
- Hao-Chun HSIEH
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD AND SOLDERING SYSTEM OF SOLDERING A DIP COMPONENT ON A CIRCU...
- Publication number 20120193400
- Publication date Aug 2, 2012
- Hao-Chun Hsieh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CLEANING APPARATUS FOR SOLDER PASTE IN APERTURES
- Publication number 20120090652
- Publication date Apr 19, 2012
- Wistron Corporation
- Hao-Chun HSIEH
- B08 - CLEANING
Information Patent Application
Heat dissipation module and portable device having the heat dissipa...
- Publication number 20110155361
- Publication date Jun 30, 2011
- Wistron Corporation
- Jun-Min Yang
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
METAL SHIELDING CAN AND ASSEMBLY OF THE METAL SHIELDING CAN AND A C...
- Publication number 20110141714
- Publication date Jun 16, 2011
- Wistron Corporation
- Hao-Chun Hsieh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEAT CONDUCTING APPARATUS AND SOLDER MELTING METHOD THEREFOR
- Publication number 20110079634
- Publication date Apr 7, 2011
- Wistron Corporation
- Chia-Hsieh Lee
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR ASSEMBLING COMPONENTS ON A CIRCUIT BOARD AND RELATED ASS...
- Publication number 20110016708
- Publication date Jan 27, 2011
- Jun-Min Yang
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...

Hao-Chun Hsieh

Person

Patents Grantslast 30 patents

Temperature measuring board device and temperature measuring board...

Process apparatus capable of pushing panel-shaped object and proces...

Feeder system and material guiding carrier thereof

Soldering system of soldering a dip component on a circuit board

Method and soldering system of soldering a DIP component on a circu...

Method for assembling components on a circuit board

Clamping tool and equipment for rework process

Metal shielding can and assembly of the metal shielding can and a c...

System for assembling components on a circuit board

Heat conducting apparatus and solder melting method therefor

Patents Applicationslast 30 patents

PROCESS APPARATUS CAPABLE OF PUSHING PANEL-SHAPED OBJECT AND PROCES...

TEMPERATURE MEASURING BOARD DEVICE AND TEMPERATURE MEASURING BOARD...

FEEDER SYSTEM AND MATERIAL GUIDING CARRIER THEREOF

SOLDERING SYSTEM OF SOLDERING A DIP COMPONENT ON A CIRCUIT BOARD

CLAMPING TOOL AND EQUIPMENT FOR REWORK PROCESS

METHOD FOR ASSEMBLING COMPONENTS ON A CIRCUIT BOARD

PRINTED CIRCUIT BOARD, A SUPPORTING JIG AND A POSITIONING METHOD

METHOD AND SOLDERING SYSTEM OF SOLDERING A DIP COMPONENT ON A CIRCU...

CLEANING APPARATUS FOR SOLDER PASTE IN APERTURES

Heat dissipation module and portable device having the heat dissipa...

METAL SHIELDING CAN AND ASSEMBLY OF THE METAL SHIELDING CAN AND A C...

HEAT CONDUCTING APPARATUS AND SOLDER MELTING METHOD THEREFOR

METHOD FOR ASSEMBLING COMPONENTS ON A CIRCUIT BOARD AND RELATED ASS...