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Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    SEMICONDUCTOR STRUCTURE
    • Publication number 20200044050
    • Publication date Feb 6, 2020
    • Semiconductor Manufacturing International (Shanghai) Corporation
    • HAO DENG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    METHOD TO FORM HYBRID SIGE FIN
    • Publication number 20190355623
    • Publication date Nov 21, 2019
    • Semiconductor Manufacturing International (Shanghai) Corporation
    • HAO DENG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR STRUCTURE AND FABRICATION METHOD THEREOF
    • Publication number 20180286747
    • Publication date Oct 4, 2018
    • Semiconductor Manufacturing International (Shanghai) Corporation
    • Hao Deng
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Application

    METHOD TO FORM HYBRID SIGE FIN
    • Publication number 20180277439
    • Publication date Sep 27, 2018
    • Semiconductor Manufacturing International (Shanghai) Corporation
    • HAO DENG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR STRUCTURE AND FABRICATION METHOD THEREOF
    • Publication number 20180277653
    • Publication date Sep 27, 2018
    • Semiconductor Manufacturing International (Shanghai) Corporation
    • HAO DENG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    INTERCONNECTION STRUCTURES AND FABRICATION METHODS THEREOF
    • Publication number 20180151505
    • Publication date May 31, 2018
    • Semiconductor Manufacturing International (Shanghai) Corporation
    • HAO DENG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR STRUCTURE
    • Publication number 20170373169
    • Publication date Dec 28, 2017
    • Semiconductor Manufacturing International (Shanghai) Corporation
    • HAO DENG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SHALLOW TRENCH ISOLATION STRUCTURE AND FABRICATING METHOD THEREOF
    • Publication number 20170062266
    • Publication date Mar 2, 2017
    • Semiconductor Manufacturing International (Beijing Corporation
    • HAO DENG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR INTERCONNECT DEVICE
    • Publication number 20160307843
    • Publication date Oct 20, 2016
    • Semiconductor Manufacturing International (Beijing) Corporation
    • HAO DENG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR STRUCTURE AND FABRICATION METHOD THEREOF
    • Publication number 20160181149
    • Publication date Jun 23, 2016
    • Semiconductor Manufacturing International (Shanghai) Corporation
    • HAO DENG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR STRUCTURE AND FABRICATION METHOD THEREOF
    • Publication number 20160181396
    • Publication date Jun 23, 2016
    • Semiconductor Manufacturing International (Shanghai) Corporation
    • HAO DENG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREOF
    • Publication number 20150348835
    • Publication date Dec 3, 2015
    • Semiconductor Manufacturing International (Beijing) Corporation
    • HAO DENG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREOF
    • Publication number 20150348777
    • Publication date Dec 3, 2015
    • Semiconductor Manufacturing International (Beijing) Corporation
    • HAO DENG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    METHOD FOR FORMING SHALLOW TRENCH ISOLATION
    • Publication number 20150004773
    • Publication date Jan 1, 2015
    • Semiconductor Manufacturing International (Shanghai) Corporation
    • HAO DENG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR STRUCTURES AND FABRICATION METHOD
    • Publication number 20140061807
    • Publication date Mar 6, 2014
    • SEMICONDUCTOR MANUFACTURING INTERNATIONAL CORP.
    • HAO DENG
    • H01 - BASIC ELECTRIC ELEMENTS