Hao-Jan Pei

Person

Hsin-Chu, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Method for laser drilling process for an integrated circuit package
- Patent number 12,368,053
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chia-Shen Cheng
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods of forming semiconductor packages
- Patent number 12,368,149
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hao-Jan Pei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor package, method of handling w...
- Patent number 12,266,559
- Issue date Apr 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng-Shiuan Wong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of forming the same
- Patent number 12,261,088
- Issue date Mar 25, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jen-Jui Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure with warpage-control element
- Patent number 12,230,597
- Issue date Feb 18, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hao-Jan Pei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reflow method and system
- Patent number 12,176,319
- Issue date Dec 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng-Shiuan Wong
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 12,107,064
- Issue date Oct 1, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jen-Jui Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding through multi-shot laser reflow
- Patent number 12,040,309
- Issue date Jul 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of package on package structure
- Patent number 11,996,400
- Issue date May 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsuan-Ting Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method
- Patent number 11,942,464
- Issue date Mar 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hao-Jan Pei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Iintegrated fan-out packages with embedded heat dissipation structure
- Patent number 11,901,258
- Issue date Feb 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hao-Jan Pei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of fabricating the same
- Patent number 11,862,577
- Issue date Jan 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hao-Jan Pei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacture
- Patent number 11,830,746
- Issue date Nov 28, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wei-Yu Chen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Workpiece holder, wafer chuck, wafer holding method
- Patent number 11,791,192
- Issue date Oct 17, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng-Shiuan Wong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure with warpage-control element
- Patent number 11,721,659
- Issue date Aug 8, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hao-Jan Pei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reflow method and system
- Patent number 11,610,859
- Issue date Mar 21, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng-Shiuan Wong
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding through multi-shot laser reflow
- Patent number 11,462,507
- Issue date Oct 4, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of package on package structure
- Patent number 11,342,321
- Issue date May 24, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsuan-Ting Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated fan-out packages and methods of forming the same
- Patent number 11,309,294
- Issue date Apr 19, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of fabrcating the same
- Patent number 11,211,341
- Issue date Dec 28, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hao-Jan Pei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package and method
- Patent number 11,121,089
- Issue date Sep 14, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jen-Jui Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method
- Patent number 11,069,671
- Issue date Jul 20, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hao-Jan Pei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Formation method of package structure with warpage-control element
- Patent number 11,049,832
- Issue date Jun 29, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hao-Jan Pei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated fan-out packages with embedded heat dissipation structure
- Patent number 10,978,370
- Issue date Apr 13, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hao-Jan Pei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of singulate a package structure using a light transmitting...
- Patent number 10,903,090
- Issue date Jan 26, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng-Ting Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding through multi-shot laser reflow
- Patent number 10,790,261
- Issue date Sep 29, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure with warpage-control element
- Patent number 10,658,323
- Issue date May 19, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hao-Jan Pei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated fan-out packages with embedded heat dissipation structure
- Patent number 10,566,261
- Issue date Feb 18, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hao-Jan Pei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of package on package structure
- Patent number 10,535,644
- Issue date Jan 14, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hsuan-Ting Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated fan-out packages with embedded heat dissipation structure
- Patent number 10,504,815
- Issue date Dec 10, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hao-Jan Pei
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20250201640
- Publication date Jun 19, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jen-Jui Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WORKPIECE HOLDER, WAFER CHUCK, WAFER HOLDING METHOD
- Publication number 20250201621
- Publication date Jun 19, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Shiuan Wong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250192011
- Publication date Jun 12, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chao-Wei Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE WITH WARPAGE-CONTROL ELEMENT
- Publication number 20250157974
- Publication date May 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hao-Jan PEI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING SCHEME FOR SEMICONDUCTOR PACKAGING
- Publication number 20250149488
- Publication date May 8, 2025
- Taiwan Semiconductor Manufacturing Co, LTD.
- Wei-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250118716
- Publication date Apr 10, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE INTEGRATED WITH OPTICAL INTERFACE ENGINE
- Publication number 20250087652
- Publication date Mar 13, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wei-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REFLOW METHOD AND SYSTEM
- Publication number 20250070077
- Publication date Feb 27, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Shiuan Wong
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240371813
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jen-Jui Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROBUMP STRUCTURE WITH ENCLOSED JOINT WINDOW
- Publication number 20240339424
- Publication date Oct 10, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wei-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC APPARATUS AND METHOD FOR FORMING CONDUCTIVE BUMPS
- Publication number 20240312941
- Publication date Sep 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chao-Wei Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF PACKAGE ON PACKAGE STRUCTURE
- Publication number 20240274589
- Publication date Aug 15, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsuan-Ting Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME
- Publication number 20240266316
- Publication date Aug 8, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wei-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING THROUGH MULTI-SHOT LASER REFLOW
- Publication number 20240234365
- Publication date Jul 11, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wei-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and Treatment System for Uniform Processing of Semiconductor...
- Publication number 20240234192
- Publication date Jul 11, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Cheng-Shiuan Wong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING SEMICONDUCTOR PACKAGES
- Publication number 20240203971
- Publication date Jun 20, 2024
- Taiwan Semiconductor Manufacturning Company, Ltd.
- Hao-Jan Pei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Fan-Out Packages with Embedded Heat Dissipation Structure
- Publication number 20240153842
- Publication date May 9, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hao-Jan Pei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME
- Publication number 20240105642
- Publication date Mar 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hao-Jan Pei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20240088062
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hao-Jan Pei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE
- Publication number 20230386862
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wei-Yu Chen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE, METHOD OF HANDLING W...
- Publication number 20230369094
- Publication date Nov 16, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Shiuan Wong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE WITH WARPAGE-CONTROL ELEMENT
- Publication number 20230335525
- Publication date Oct 19, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hao-Jan PEI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20230335523
- Publication date Oct 19, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jen-Jui Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LASER DRILLING PROCESS FOR INTEGRATED CIRCUIT PACKAGE
- Publication number 20230230849
- Publication date Jul 20, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chia-Shen Cheng
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
REFLOW METHOD AND SYSTEM
- Publication number 20230197671
- Publication date Jun 22, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Shiuan Wong
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20230067313
- Publication date Mar 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jen-Jui Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bonding Through Multi-Shot Laser Reflow
- Publication number 20220367408
- Publication date Nov 17, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wei-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF PACKAGE ON PACKAGE STRUCTURE
- Publication number 20220254767
- Publication date Aug 11, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsuan-Ting Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Fan-Out Packages and Methods of Forming the Same
- Publication number 20220246590
- Publication date Aug 4, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE
- Publication number 20220216071
- Publication date Jul 7, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wei-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS

Hao-Jan Pei

Person

Patents Grantslast 30 patents

Method for laser drilling process for an integrated circuit package

Methods of forming semiconductor packages

Method of manufacturing semiconductor package, method of handling w...

Package structure and method of forming the same

Package structure with warpage-control element

Reflow method and system

Semiconductor package and manufacturing method thereof

Bonding through multi-shot laser reflow

Manufacturing method of package on package structure

Semiconductor package and method

Iintegrated fan-out packages with embedded heat dissipation structure

Package structure and method of fabricating the same

Semiconductor device and method of manufacture

Workpiece holder, wafer chuck, wafer holding method

Package structure with warpage-control element

Reflow method and system

Bonding through multi-shot laser reflow

Manufacturing method of package on package structure

Integrated fan-out packages and methods of forming the same

Package structure and method of fabrcating the same

Integrated circuit package and method

Semiconductor package and method

Formation method of package structure with warpage-control element

Integrated fan-out packages with embedded heat dissipation structure

Method of singulate a package structure using a light transmitting...

Bonding through multi-shot laser reflow

Package structure with warpage-control element

Integrated fan-out packages with embedded heat dissipation structure

Manufacturing method of package on package structure

Integrated fan-out packages with embedded heat dissipation structure

Patents Applicationslast 30 patents

PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME

WORKPIECE HOLDER, WAFER CHUCK, WAFER HOLDING METHOD

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

PACKAGE STRUCTURE WITH WARPAGE-CONTROL ELEMENT

BONDING SCHEME FOR SEMICONDUCTOR PACKAGING

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

STRUCTURE INTEGRATED WITH OPTICAL INTERFACE ENGINE

REFLOW METHOD AND SYSTEM

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

MICROBUMP STRUCTURE WITH ENCLOSED JOINT WINDOW

ELECTRONIC APPARATUS AND METHOD FOR FORMING CONDUCTIVE BUMPS

MANUFACTURING METHOD OF PACKAGE ON PACKAGE STRUCTURE

INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME

BONDING THROUGH MULTI-SHOT LASER REFLOW

Method and Treatment System for Uniform Processing of Semiconductor...

METHODS OF FORMING SEMICONDUCTOR PACKAGES

Integrated Fan-Out Packages with Embedded Heat Dissipation Structure

PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME

PACKAGE STRUCTURE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE

METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE, METHOD OF HANDLING W...

PACKAGE STRUCTURE WITH WARPAGE-CONTROL ELEMENT

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

LASER DRILLING PROCESS FOR INTEGRATED CIRCUIT PACKAGE

REFLOW METHOD AND SYSTEM

PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME

Bonding Through Multi-Shot Laser Reflow

MANUFACTURING METHOD OF PACKAGE ON PACKAGE STRUCTURE

Integrated Fan-Out Packages and Methods of Forming the Same

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE