Hao JIANG

Person

San Jose, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Fully aligned subtractive processes and electronic devices therefrom
- Patent number 11,967,527
- Issue date Apr 23, 2024
- Applied Materials, Inc.
- He Ren
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Subtractive metals and subtractive metal semiconductor structures
- Patent number 11,923,244
- Issue date Mar 5, 2024
- Applied Materials, Inc.
- He Ren
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and devices for subtractive self-alignment
- Patent number 11,908,696
- Issue date Feb 20, 2024
- Applied Materials, Inc.
- He Ren
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of cleaning a structure and method of depositing a capping l...
- Patent number 11,830,725
- Issue date Nov 28, 2023
- Applied Materials, Inc.
- Naomi Yoshida
- B08 - CLEANING
Information Patent Grant
Methods and apparatus for processing a substrate
- Patent number 11,749,532
- Issue date Sep 5, 2023
- Applied Materials, Inc.
- Hao Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming interconnect for semiconductor device
- Patent number 11,508,617
- Issue date Nov 22, 2022
- Applied Materials, Inc.
- Hao Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fully aligned subtractive processes and electronic devices therefrom
- Patent number 11,410,885
- Issue date Aug 9, 2022
- Applied Materials, Inc.
- He Ren
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and devices for subtractive self-alignment
- Patent number 11,257,677
- Issue date Feb 22, 2022
- Applied Materials, Inc.
- He Ren
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods and apparatuses for forming interconnection structures
- Patent number 11,205,589
- Issue date Dec 21, 2021
- Applied Materials, Inc.
- He Ren
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Gap fill deposition process
- Patent number 11,101,174
- Issue date Aug 24, 2021
- Applied Materials, Inc.
- Hao Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for etching a structure for semiconductor applications
- Patent number 10,957,533
- Issue date Mar 23, 2021
- Applied Materials, Inc.
- Hao Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for manufacturing an interconnect structure for semiconduct...
- Patent number 10,692,759
- Issue date Jun 23, 2020
- Applied Materials, Inc.
- Hao Jiang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
FABRICATION OF HIGH ASPECT RATIO ELECTRONIC DEVICES WITH MINIMAL SI...
- Publication number 20240321641
- Publication date Sep 26, 2024
- Applied Materials, Inc.
- Hao Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBTRACTIVE METALS AND SUBTRACTIVE METAL SEMICONDUCTOR STRUCTURES
- Publication number 20240213088
- Publication date Jun 27, 2024
- Applied Materials, Inc.
- He REN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING INTERCONNECT FOR SEMICONDUCTOR DEVICE
- Publication number 20230045689
- Publication date Feb 9, 2023
- Applied Materials, Inc.
- Hao Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR PROCESSING A SUBSTRATE
- Publication number 20220359224
- Publication date Nov 10, 2022
- Hao JIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fully Aligned Subtractive Processes And Electronic Devices Therefrom
- Publication number 20220328352
- Publication date Oct 13, 2022
- Applied Materials, Inc.
- He Ren
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBTRACTIVE METALS AND SUBTRACTIVE METAL SEMICONDUCTOR STRUCTURES
- Publication number 20220285212
- Publication date Sep 8, 2022
- Applied Materials, Inc.
- He REN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND DEVICES FOR SUBTRACTIVE SELF-ALIGNMENT
- Publication number 20220130676
- Publication date Apr 28, 2022
- Applied Materials, Inc.
- He Ren
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD OF CLEANING A STRUCTURE AND METHOD OF DEPOSITING A CAPPING L...
- Publication number 20210233765
- Publication date Jul 29, 2021
- Applied Materials, Inc.
- Naomi YOSHIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND DEVICES FOR SUBTRACTIVE SELF-ALIGNMENT
- Publication number 20210233770
- Publication date Jul 29, 2021
- Applied Materials, Inc.
- He Ren
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD OF FORMING INTERCONNECT FOR SEMICONDUCTOR DEVICE
- Publication number 20210125864
- Publication date Apr 29, 2021
- Applied Materials, Inc.
- Hao Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GAP FILL DEPOSITION PROCESS
- Publication number 20210111067
- Publication date Apr 15, 2021
- Applied Materials, Inc.
- Hao JIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUSES FOR FORMING INTERCONNECTION STRUCTURES
- Publication number 20210104434
- Publication date Apr 8, 2021
- Applied Materials, Inc.
- He Ren
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR CLEANING METAL CONTACTS
- Publication number 20210066064
- Publication date Mar 4, 2021
- Applied Materials, Inc.
- He REN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fully Aligned Subtractive Processes And Electronic Devices Therefrom
- Publication number 20200350206
- Publication date Nov 5, 2020
- Applied Materials, Inc.
- He Ren
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR ETCHING A STRUCTURE FOR SEMICONDUCTOR APPLICATIONS
- Publication number 20200135459
- Publication date Apr 30, 2020
- Applied Materials, Inc.
- Hao JIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR MANUFACTURING AN INTERCONNECT STRUCTURE FOR SEMICONDUCT...
- Publication number 20200027782
- Publication date Jan 23, 2020
- Applied Materials, Inc.
- Hao JIANG
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Fully aligned subtractive processes and electronic devices therefrom

Subtractive metals and subtractive metal semiconductor structures

Methods and devices for subtractive self-alignment

Method of cleaning a structure and method of depositing a capping l...

Methods and apparatus for processing a substrate

Method of forming interconnect for semiconductor device

Fully aligned subtractive processes and electronic devices therefrom

Methods and devices for subtractive self-alignment

Methods and apparatuses for forming interconnection structures

Gap fill deposition process

Methods for etching a structure for semiconductor applications

Methods for manufacturing an interconnect structure for semiconduct...

Patents Applicationslast 30 patents

FABRICATION OF HIGH ASPECT RATIO ELECTRONIC DEVICES WITH MINIMAL SI...

SUBTRACTIVE METALS AND SUBTRACTIVE METAL SEMICONDUCTOR STRUCTURES

METHOD OF FORMING INTERCONNECT FOR SEMICONDUCTOR DEVICE

METHODS AND APPARATUS FOR PROCESSING A SUBSTRATE

Fully Aligned Subtractive Processes And Electronic Devices Therefrom

SUBTRACTIVE METALS AND SUBTRACTIVE METAL SEMICONDUCTOR STRUCTURES

METHODS AND DEVICES FOR SUBTRACTIVE SELF-ALIGNMENT

METHOD OF CLEANING A STRUCTURE AND METHOD OF DEPOSITING A CAPPING L...

METHODS AND DEVICES FOR SUBTRACTIVE SELF-ALIGNMENT

METHOD OF FORMING INTERCONNECT FOR SEMICONDUCTOR DEVICE

GAP FILL DEPOSITION PROCESS

METHODS AND APPARATUSES FOR FORMING INTERCONNECTION STRUCTURES

METHODS AND APPARATUS FOR CLEANING METAL CONTACTS

Fully Aligned Subtractive Processes And Electronic Devices Therefrom

METHODS FOR ETCHING A STRUCTURE FOR SEMICONDUCTOR APPLICATIONS

METHODS FOR MANUFACTURING AN INTERCONNECT STRUCTURE FOR SEMICONDUCT...