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Patents Grants
last 30 patents
Information
Patent Grant
Chip package unit and chip packaging method
Patent number
12,300,565
Issue date
May 13, 2025
Richtek Technology Corporation
Hao-Lin Yen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Chip packaging method and chip package unit
Patent number
11,973,010
Issue date
Apr 30, 2024
Richtek Technology Corporation
Hao-Lin Yen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Plurality of vertical heat conduction elements attached to metal film
Patent number
11,469,162
Issue date
Oct 11, 2022
Richtek Technology Corporation
Hao-Lin Yen
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
CHIP PACKAGE UNIT AND CHIP PACKAGING METHOD
Publication number
20250140630
Publication date
May 1, 2025
RICHTEK TECHNOLOGY CORPORATION
Hao-Lin Yen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP PACKAGING METHOD AND CHIP PACKAGE UNIT
Publication number
20240234264
Publication date
Jul 11, 2024
RICHTEK TECHNOLOGY CORPORATION
Hao-Lin Yen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LEAD FRAME AND PACKAGING METHOD
Publication number
20230098393
Publication date
Mar 30, 2023
RICHTEK TECHNOLOGY CORPORATION
Hao-Lin Yen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP PACKAGE UNIT AND CHIP PACKAGING METHOD
Publication number
20220367309
Publication date
Nov 17, 2022
RICHTEK TECHNOLOGY CORPORATION
Hao-Lin Yen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP PACKAGING STRUCTURE
Publication number
20220208628
Publication date
Jun 30, 2022
RICHTEK TECHNOLOGY CORPORATION
Shih-Chieh Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP PACKAGING METHOD AND CHIP PACKAGE UNIT
Publication number
20220181237
Publication date
Jun 9, 2022
RICHTEK TECHNOLOGY CORPORATION
Hao-Lin Yen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP PACKAGING METHOD AND CHIP PACKAGE UNIT
Publication number
20220181238
Publication date
Jun 9, 2022
RICHTEK TECHNOLOGY CORPORATION
Hao-Lin Yen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP PACKAGING METHOD AND CHIP PACKAGE UNIT
Publication number
20220157622
Publication date
May 19, 2022
RICHTEK TECHNOLOGY CORPORATION
Heng-Chi Huang
H01 - BASIC ELECTRIC ELEMENTS