Hao-Wei LIU

Person

Hsinchu City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor packages having conductive pillars with inclined surf...
- Patent number 12,272,664
- Issue date Apr 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chiang-Jui Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stress reduction apparatus and method
- Patent number 12,113,055
- Issue date Oct 8, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yao-Chun Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Passivation layer and planarization layer and method of forming the...
- Patent number 12,051,622
- Issue date Jul 30, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ming-Da Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,021,048
- Issue date Jun 25, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chien-Hao Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding structures in semiconductor packaged device and method of f...
- Patent number 11,990,428
- Issue date May 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hao Chun Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dielectric protection layer in middle-of-line interconnect structur...
- Patent number 11,942,372
- Issue date Mar 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuan-Da Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor arrangement and method for making
- Patent number 11,901,176
- Issue date Feb 13, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Yi-Shan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages having conductive pillars with inclined surf...
- Patent number 11,901,323
- Issue date Feb 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chiang-Jui Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid micro-bump integration with redistribution layer
- Patent number 11,855,028
- Issue date Dec 26, 2023
- TAIWAN SEMICONDUCTOR MANUFACTURING
- Ting-Li Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor arrangement and method for making
- Patent number 11,587,782
- Issue date Feb 21, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Yi-Shan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages having conductive pillars with inclined surf...
- Patent number 11,398,444
- Issue date Jul 26, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chiang-Jui Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding structures in semiconductor packaged device and method of f...
- Patent number 11,393,771
- Issue date Jul 19, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hao Chun Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stress reduction apparatus and method
- Patent number 11,244,940
- Issue date Feb 8, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yao-Chun Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded structures for package and substrate
- Patent number 11,088,102
- Issue date Aug 10, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Hong Cha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate pad structure
- Patent number 10,867,810
- Issue date Dec 15, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hao-Juin Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a semiconductor structure
- Patent number 10,818,556
- Issue date Oct 27, 2020
- United Microelectronics Corp.
- Hao-Yeh Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate pad structure
- Patent number 10,748,785
- Issue date Aug 18, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hao-Juin Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stress reduction apparatus and method
- Patent number 10,692,848
- Issue date Jun 23, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yao-Chun Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded structures for package and substrate
- Patent number 10,468,366
- Issue date Nov 5, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Hong Cha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor package structure
- Patent number 10,037,973
- Issue date Jul 31, 2018
- Taiwan Semiconductor Manufacturing Company Ltd.
- Hua-Wei Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mechanisms for forming fine-pitch copper bump structures
- Patent number 9,978,656
- Issue date May 22, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tsung-Shu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate pad structure
- Patent number 9,741,589
- Issue date Aug 22, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hao-Juin Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded structures for package and substrate
- Patent number 9,673,161
- Issue date Jun 6, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Hong Cha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnection structure
- Patent number 9,673,125
- Issue date Jun 6, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hao-Juin Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming the same
- Patent number 9,524,967
- Issue date Dec 20, 2016
- United Microelectronics Corp.
- Hao-Yeh Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Scheme for connector site spacing and resulting structures
- Patent number 9,472,521
- Issue date Oct 18, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yao-Chun Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure and manufacturing method thereof
- Patent number 9,406,629
- Issue date Aug 2, 2016
- Taiwan Semiconductor Manufacturing Company Ltd.
- Hua-Wei Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded structures for package and substrate
- Patent number 9,397,059
- Issue date Jul 19, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Hong Cha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating fin field effect transistor
- Patent number 9,379,242
- Issue date Jun 28, 2016
- United Microelectronics Corp.
- Mon-Sen Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and method
- Patent number 9,287,191
- Issue date Mar 15, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hao-Juin Liu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250118666
- Publication date Apr 10, 2025
- Taiwan Semiconductor Manufacturing company Ltd.
- TZU PEI CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHODS OF FORMATION
- Publication number 20250031404
- Publication date Jan 23, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Min-Hsuan LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA PROCESSING APPARATUS AND METHOD
- Publication number 20240404860
- Publication date Dec 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Fu Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID MICRO-BUMP INTEGRATION WITH REDISTRIBUTION LAYER
- Publication number 20240379605
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacaturing Co., Ltd.
- Ting-Li Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE WITH PULL-IN PLANARIZATION LAYER AND METHOD...
- Publication number 20240379428
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Da Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RELAXATION OSCILLATOR
- Publication number 20240339991
- Publication date Oct 10, 2024
- FARADAY TECHNOLOGY CORPORATION
- Hao-Wei LIU
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240332230
- Publication date Oct 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien-Hao Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR
- Publication number 20240274634
- Publication date Aug 15, 2024
- VisEra Technologies Company Ltd.
- Hao-Wei LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING STRUCTURES IN SEMICONDUCTOR PACKAGED DEVICE AND METHOD OF F...
- Publication number 20240266304
- Publication date Aug 8, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hao Chun Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIELECTRIC PROTECTION LAYER IN MIDDLE-OF-LINE INTERCONNECT STRUCTUR...
- Publication number 20240162095
- Publication date May 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuan-Da Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES HAVING CONDUCTIVE PILLARS WITH INCLINED SURF...
- Publication number 20240136316
- Publication date Apr 25, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chiang-Jui Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR IMPROVING LIGHT SENSOR RESPONSE
- Publication number 20240079504
- Publication date Mar 7, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
- Meng-Ju Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE STRUCTURES AND METHODS OF FORMING THE SAME
- Publication number 20230395429
- Publication date Dec 7, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kan-Ju LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID MICRO-BUMP INTEGRATION WITH REDISTRIBUTION LAYER
- Publication number 20230369269
- Publication date Nov 16, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ting-Li Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ARRANGEMENT AND METHOD FOR MAKING
- Publication number 20230197439
- Publication date Jun 22, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Yi-Shan CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD
- Publication number 20230155005
- Publication date May 18, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Lien Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIELECTRIC PROTECTION LAYER IN MIDDLE-OF-LINE INTERCONNECT STRUCTUR...
- Publication number 20230061082
- Publication date Mar 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuan-Da Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT, SEMICONDUCTOR PACKAGE, AND MANUFACTURING METHOD...
- Publication number 20230065429
- Publication date Mar 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chiang-Jui Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230068329
- Publication date Mar 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien-Hao Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Structure with Pull-in Planarization Layer and Method...
- Publication number 20220384259
- Publication date Dec 1, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Da Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING STRUCTURES IN SEMICONDUCTOR PACKAGED DEVICE AND METHOD OF F...
- Publication number 20220352094
- Publication date Nov 3, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hao Chun Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES HAVING CONDUCTIVE PILLARS WITH INCLINED SURF...
- Publication number 20220310543
- Publication date Sep 29, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chiang-Jui Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID MICRO-BUMP INTEGRATION WITH REDISTRIBUTION LAYER
- Publication number 20220230978
- Publication date Jul 21, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ting-Li Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Redistribution Lines Having Nano Columns and Method Forming Same
- Publication number 20210375672
- Publication date Dec 2, 2021
- Taiwan Semiconductor Manfacturing Co., Ltd.
- Ming-Da Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL DEVICES, SEMICONDUCTOR PACKAGES AND METHODS OF FORMING T...
- Publication number 20210066226
- Publication date Mar 4, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chiang-Jui Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stress Reduction Apparatus and Method
- Publication number 20200321326
- Publication date Oct 8, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yao-Chun Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING A SEMICONDUCTOR STRUCTURE
- Publication number 20200194313
- Publication date Jun 18, 2020
- UNITED MICROELECTRONICS CORP.
- Hao-Yeh Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ARRANGEMENT AND METHOD FOR MAKING
- Publication number 20200176242
- Publication date Jun 4, 2020
- Taiwan Semiconductor Manufacturing Company Limited
- Yi-Shan CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bonded Structures for Package and Substrate
- Publication number 20200098714
- Publication date Mar 26, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Hong Cha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Substrate Pad Structure
- Publication number 20200013710
- Publication date Jan 9, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hao-Juin Liu
- H01 - BASIC ELECTRIC ELEMENTS

Hao-Wei LIU

Person

Patents Grantslast 30 patents

Semiconductor packages having conductive pillars with inclined surf...

Stress reduction apparatus and method

Passivation layer and planarization layer and method of forming the...

Semiconductor device

Bonding structures in semiconductor packaged device and method of f...

Dielectric protection layer in middle-of-line interconnect structur...

Semiconductor arrangement and method for making

Semiconductor packages having conductive pillars with inclined surf...

Hybrid micro-bump integration with redistribution layer

Semiconductor arrangement and method for making

Semiconductor packages having conductive pillars with inclined surf...

Bonding structures in semiconductor packaged device and method of f...

Stress reduction apparatus and method

Bonded structures for package and substrate

Substrate pad structure

Method for forming a semiconductor structure

Substrate pad structure

Stress reduction apparatus and method

Bonded structures for package and substrate

Method for manufacturing semiconductor package structure

Mechanisms for forming fine-pitch copper bump structures

Substrate pad structure

Bonded structures for package and substrate

Interconnection structure

Semiconductor device and method of forming the same

Scheme for connector site spacing and resulting structures

Semiconductor package structure and manufacturing method thereof

Bonded structures for package and substrate

Method of fabricating fin field effect transistor

Semiconductor device package and method

Patents Applicationslast 30 patents

SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND METHODS OF FORMATION

PLASMA PROCESSING APPARATUS AND METHOD

HYBRID MICRO-BUMP INTEGRATION WITH REDISTRIBUTION LAYER

SEMICONDUCTOR STRUCTURE WITH PULL-IN PLANARIZATION LAYER AND METHOD...

RELAXATION OSCILLATOR

SEMICONDUCTOR DEVICE

IMAGE SENSOR

BONDING STRUCTURES IN SEMICONDUCTOR PACKAGED DEVICE AND METHOD OF F...

DIELECTRIC PROTECTION LAYER IN MIDDLE-OF-LINE INTERCONNECT STRUCTUR...

SEMICONDUCTOR PACKAGES HAVING CONDUCTIVE PILLARS WITH INCLINED SURF...

METHODS FOR IMPROVING LIGHT SENSOR RESPONSE

CONDUCTIVE STRUCTURES AND METHODS OF FORMING THE SAME

HYBRID MICRO-BUMP INTEGRATION WITH REDISTRIBUTION LAYER

SEMICONDUCTOR ARRANGEMENT AND METHOD FOR MAKING

SEMICONDUCTOR DEVICE AND METHOD

DIELECTRIC PROTECTION LAYER IN MIDDLE-OF-LINE INTERCONNECT STRUCTUR...

INTEGRATED CIRCUIT, SEMICONDUCTOR PACKAGE, AND MANUFACTURING METHOD...

SEMICONDUCTOR DEVICE

Semiconductor Structure with Pull-in Planarization Layer and Method...

BONDING STRUCTURES IN SEMICONDUCTOR PACKAGED DEVICE AND METHOD OF F...

SEMICONDUCTOR PACKAGES HAVING CONDUCTIVE PILLARS WITH INCLINED SURF...

HYBRID MICRO-BUMP INTEGRATION WITH REDISTRIBUTION LAYER

Redistribution Lines Having Nano Columns and Method Forming Same

ELECTRICAL DEVICES, SEMICONDUCTOR PACKAGES AND METHODS OF FORMING T...

Stress Reduction Apparatus and Method

METHOD FOR FORMING A SEMICONDUCTOR STRUCTURE

SEMICONDUCTOR ARRANGEMENT AND METHOD FOR MAKING

Bonded Structures for Package and Substrate

Substrate Pad Structure