Hao-Wen Ko

Follow

Person

Hsinchu, TW

People

Patents Applicationslast 30 patents

Information Patent Application
3DIC WITH GAP-FILL STRUCTURES AND THE METHOD OF MANUFACTURING THE SAME
- Publication number 20250070010
- Publication date Feb 27, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ping-Jung Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHODS OF FORMING THE SAME
- Publication number 20250070085
- Publication date Feb 27, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tsang-Jiuh Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3DIC WITH GAP-FILL STRUCTURES AND THE METHOD OF MANUFACTURING THE SAME
- Publication number 20250070007
- Publication date Feb 27, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ping-Jung Wu
- H01 - BASIC ELECTRIC ELEMENTS