Hao-Yu Tung

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Hsinchu, TW

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Patents Grantslast 30 patents

Information Patent Grant
Interposer routing structure and semiconductor package
- Patent number 11,869,846
- Issue date Jan 9, 2024
- Global Unichip Corporation
- Sheng-Fan Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Routing structure between dies and method for arranging routing bet...
- Patent number 11,600,572
- Issue date Mar 7, 2023
- Global Unichip Corporation
- Wei-Chieh Liao
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTERPOSER DEVICE AND SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20240213129
- Publication date Jun 27, 2024
- Global Unichip Corporation
- Hao-Yu TUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ROUTING STRUCTURE BETWEEN DIES AND METHOD FOR ARRANGING ROUTING BET...
- Publication number 20220293526
- Publication date Sep 15, 2022
- GLOBAL UNICHIP CORPORATION
- Wei-Chieh Liao
- H01 - BASIC ELECTRIC ELEMENTS