Hao Zhuang

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Hohenbrunn, DE

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package, semiconductor module and methods for manufac...
- Patent number 11,978,692
- Issue date May 7, 2024
- Infineon Technologies Austria AG
- Sergey Yuferev
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE WITH COMPONENT-CARRYING INTERMEDIATE STRUCTURE AND ADDITION...
- Publication number 20250218914
- Publication date Jul 3, 2025
- INFINEON TECHNOLOGIES AG
- Hao ZHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADFRAME PACKAGE WITH INCREASED ROUTING CAPABILITY
- Publication number 20250157895
- Publication date May 15, 2025
- Infineon Technologies Austria AG
- Hao Zhuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods for Manufacturing a Semiconductor Package and a Semiconduct...
- Publication number 20240258213
- Publication date Aug 1, 2024
- Infineon Technologies Austria AG
- Sergey Yuferev
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING A SEMICONDUCTOR PA...
- Publication number 20240030111
- Publication date Jan 25, 2024
- Infineon Technologies Austria AG
- Sergey Yuferev
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP, CHIP SYSTEM, METHOD OF FORMING A SEMICONDUCTOR...
- Publication number 20230230903
- Publication date Jul 20, 2023
- INFINEON TECHNOLOGIES AG
- Hooi Boon TEOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package, Semiconductor Module and Methods for Manufac...
- Publication number 20220084915
- Publication date Mar 17, 2022
- Sergey Yuferev
- H01 - BASIC ELECTRIC ELEMENTS