Haojun Zhang

Person

Clay, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Stacked semiconductor die assemblies with multiple thermal paths an...
- Patent number 11,594,462
- Issue date Feb 28, 2023
- Micron Technology, Inc.
- Steven K. Groothuis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transistor structures having electrically floating metal layers bet...
- Patent number 10,833,012
- Issue date Nov 10, 2020
- GLOBALFOUNDRIES Inc.
- Chien-Hsin Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor die assemblies with multiple thermal paths an...
- Patent number 10,741,468
- Issue date Aug 11, 2020
- Micron Technology, Inc.
- Steven K. Groothuis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transistor structures having electrically floating metal layer betw...
- Patent number 10,510,663
- Issue date Dec 17, 2019
- GLOBALFOUNDRIES Inc.
- Chien-Hsin Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrostatic discharge protection device and methods
- Patent number 10,403,622
- Issue date Sep 3, 2019
- GLOBALFOUNDRIES Inc.
- Mahadeva Iyer Natarajan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor die assemblies with multiple thermal paths an...
- Patent number 10,170,389
- Issue date Jan 1, 2019
- Micron Technology, Inc.
- Steven K. Groothuis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backside spacer structures for improved thermal performance
- Patent number 10,153,224
- Issue date Dec 11, 2018
- GLOBALFOUNDRIES Inc.
- Rahul Agarwal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor die assemblies with multiple thermal paths an...
- Patent number 9,153,520
- Issue date Oct 6, 2015
- Micron Technology, Inc.
- Steven K. Groothuis
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH MULTIPLE THERMAL PATHS AN...
- Publication number 20200350224
- Publication date Nov 5, 2020
- Micron Technology, Inc.
- Steven K. Groothuis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSISTOR STRUCTURES
- Publication number 20200027826
- Publication date Jan 23, 2020
- GLOBALFOUNDRIES INC.
- CHIEN-HSIN LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROSTATIC DISCHARGE PROTECTION DEVICE AND METHODS
- Publication number 20190244954
- Publication date Aug 8, 2019
- GLOBALFOUNDRIES INC.
- MAHADEVA IYER NATARAJAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH MULTIPLE THERMAL PATHS AN...
- Publication number 20190122950
- Publication date Apr 25, 2019
- Micron Technology, Inc.
- Steven K. Groothuis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSISTOR STRUCTURES
- Publication number 20180286801
- Publication date Oct 4, 2018
- GLOBALFOUNDRIES INC.
- CHIEN-HSIN LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE SPACER STRUCTURES FOR IMPROVED THERMAL PERFORMANCE
- Publication number 20180076110
- Publication date Mar 15, 2018
- GLOBALFOUNDRIES INC.
- Rahul AGARWAL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH MULTIPLE THERMAL PATHS AN...
- Publication number 20150348956
- Publication date Dec 3, 2015
- Micron Technology, Inc.
- Steven K. Groothuis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH MULTIPLE THERMAL PATHS AN...
- Publication number 20130119528
- Publication date May 16, 2013
- Micron Technology, Inc.
- Steven K. Groothuis
- H01 - BASIC ELECTRIC ELEMENTS

Haojun Zhang

Person

Patents Grantslast 30 patents

Stacked semiconductor die assemblies with multiple thermal paths an...

Transistor structures having electrically floating metal layers bet...

Stacked semiconductor die assemblies with multiple thermal paths an...

Transistor structures having electrically floating metal layer betw...

Electrostatic discharge protection device and methods

Stacked semiconductor die assemblies with multiple thermal paths an...

Backside spacer structures for improved thermal performance

Stacked semiconductor die assemblies with multiple thermal paths an...

Patents Applicationslast 30 patents

STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH MULTIPLE THERMAL PATHS AN...

TRANSISTOR STRUCTURES

ELECTROSTATIC DISCHARGE PROTECTION DEVICE AND METHODS

STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH MULTIPLE THERMAL PATHS AN...

TRANSISTOR STRUCTURES

BACKSIDE SPACER STRUCTURES FOR IMPROVED THERMAL PERFORMANCE

STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH MULTIPLE THERMAL PATHS AN...

STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH MULTIPLE THERMAL PATHS AN...