Haoyu Li

Person

Boise, ID, US

People

Patents Grantslast 30 patents

Information Patent Grant
Integrated assemblies and methods of forming integrated assemblies
- Patent number 11,844,220
- Issue date Dec 12, 2023
- Micron Technology, Inc.
- Yiping Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming an apparatus including laminate spacer structures
- Patent number 11,729,964
- Issue date Aug 15, 2023
- Micron Technology, Inc.
- Silvia Borsari
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated assemblies and methods of forming integrated assemblies
- Patent number 11,621,273
- Issue date Apr 4, 2023
- Micron Technology, Inc.
- Yiping Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and electronic systems including an etch stop...
- Patent number 11,527,548
- Issue date Dec 13, 2022
- Micron Technology, Inc.
- Haoyu Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatuses including laminate spacer structures, and related memor...
- Patent number 11,164,873
- Issue date Nov 2, 2021
- Micron Technology, Inc.
- Silvia Borsari
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Assemblies having vertically-extending structures, and methods of f...
- Patent number 10,916,564
- Issue date Feb 9, 2021
- Micron Technology, Inc.
- David Ross Economy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Assemblies having vertically-extending structures, and methods of f...
- Patent number 10,700,091
- Issue date Jun 30, 2020
- Micron Technology, Inc.
- David Ross Economy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated assemblies and methods of forming integrated assemblies
- Patent number 10,546,848
- Issue date Jan 28, 2020
- Micron Technology, Inc.
- Daniel Billingsley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated assemblies and methods of forming integrated assemblies
- Patent number 10,354,989
- Issue date Jul 16, 2019
- Micron Technology, Inc.
- Daniel Billingsley
- G11 - INFORMATION STORAGE
Information Patent Grant
Assemblies having vertically-extending structures
- Patent number 10,355,014
- Issue date Jul 16, 2019
- Micron Technology, Inc.
- David Ross Economy
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
LOW RESISTANCE STAIRCASE RIVET CONTACT USING METAL-TO-METAL STRAP C...
- Publication number 20240379544
- Publication date Nov 14, 2024
- Micron Technology, Inc.
- Darwin A. Clampitt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Assemblies and Methods of Forming Integrated Assemblies
- Publication number 20240064982
- Publication date Feb 22, 2024
- Micron Technology, Inc.
- Yiping Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Memory Arrays Comprising Strings Of Memory Cells And Methods Used I...
- Publication number 20230386575
- Publication date Nov 30, 2023
- Micron Technology, Inc.
- Haoyu Li
- G11 - INFORMATION STORAGE
Information Patent Application
Integrated Assemblies and Methods of Forming Integrated Assemblies
- Publication number 20230104297
- Publication date Apr 6, 2023
- Micron Technology, Inc.
- Yiping Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Memory Arrays Comprising Strings Of Memory Cells And Methods Used I...
- Publication number 20230062084
- Publication date Mar 2, 2023
- Micron Technology, Inc.
- John D. Hopkins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuitry Comprising A Memory Array Comprising Strings O...
- Publication number 20230057852
- Publication date Feb 23, 2023
- Micron Technology, Inc.
- Collin Howder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING AN APPARATUS INCLUDING LAMINATE SPACER STRUCTURES
- Publication number 20220020748
- Publication date Jan 20, 2022
- Micron Technology, Inc.
- Silvia Borsari
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Assemblies and Methods of Forming Integrated Assemblies
- Publication number 20210358940
- Publication date Nov 18, 2021
- Micron Technology, Inc.
- Yiping Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUSES INCLUDING LAMINATE SPACER STRUCTURES, AND RELATED MEMOR...
- Publication number 20200373304
- Publication date Nov 26, 2020
- Micron Technology, Inc.
- Silvia Borsari
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Assemblies Having Vertically-Extending Structures, and Methods of F...
- Publication number 20200266210
- Publication date Aug 20, 2020
- Micron Technology, Inc.
- David Ross Economy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND ELECTRONIC SYSTEMS INCLUDING AN ETCH STOP...
- Publication number 20200185406
- Publication date Jun 11, 2020
- Micron Technology, Inc.
- Haoyu Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Assemblies and Methods of Forming Integrated Assemblies
- Publication number 20190355711
- Publication date Nov 21, 2019
- Micron Technology, Inc.
- Daniel Billingsley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Assemblies Having Vertically-Extending Structures, and Methods of F...
- Publication number 20190304996
- Publication date Oct 3, 2019
- Micron Technology, Inc.
- David Ross Economy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Assemblies Having Vertically-Extending Structures, and Methods of F...
- Publication number 20190198519
- Publication date Jun 27, 2019
- Micron Technology, Inc.
- David Ross Economy
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Integrated assemblies and methods of forming integrated assemblies

Methods of forming an apparatus including laminate spacer structures

Integrated assemblies and methods of forming integrated assemblies

Semiconductor devices and electronic systems including an etch stop...

Apparatuses including laminate spacer structures, and related memor...

Assemblies having vertically-extending structures, and methods of f...

Assemblies having vertically-extending structures, and methods of f...

Integrated assemblies and methods of forming integrated assemblies

Integrated assemblies and methods of forming integrated assemblies

Assemblies having vertically-extending structures

Patents Applicationslast 30 patents

LOW RESISTANCE STAIRCASE RIVET CONTACT USING METAL-TO-METAL STRAP C...

Integrated Assemblies and Methods of Forming Integrated Assemblies

Memory Arrays Comprising Strings Of Memory Cells And Methods Used I...

Integrated Assemblies and Methods of Forming Integrated Assemblies

Memory Arrays Comprising Strings Of Memory Cells And Methods Used I...

Integrated Circuitry Comprising A Memory Array Comprising Strings O...

METHODS OF FORMING AN APPARATUS INCLUDING LAMINATE SPACER STRUCTURES

Integrated Assemblies and Methods of Forming Integrated Assemblies

APPARATUSES INCLUDING LAMINATE SPACER STRUCTURES, AND RELATED MEMOR...

Assemblies Having Vertically-Extending Structures, and Methods of F...

SEMICONDUCTOR DEVICES AND ELECTRONIC SYSTEMS INCLUDING AN ETCH STOP...

Integrated Assemblies and Methods of Forming Integrated Assemblies

Assemblies Having Vertically-Extending Structures, and Methods of F...

Assemblies Having Vertically-Extending Structures, and Methods of F...