Harald Beyer

Person

Lenzburg, CH

People

Patents Grantslast 30 patents

Information Patent Grant
Metal substrate structure for a semiconductor power module
- Patent number 12,218,192
- Issue date Feb 4, 2025
- HITACHI ENERGY LTD
- David Guillon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Clamping element and method for producing a power semiconductor device
- Patent number 12,125,767
- Issue date Oct 22, 2024
- HITACHI ENERGY LTD
- Lluis Santolaria
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor module with baseplate and heat dissipating element
- Patent number 12,062,591
- Issue date Aug 13, 2024
- HITACHI ENERGY LTD
- Milad Maleki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor module
- Patent number 11,502,434
- Issue date Nov 15, 2022
- Hitachi Energy Switzerland AG
- Dominik Truessel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor module
- Patent number 9,559,024
- Issue date Jan 31, 2017
- ABB Schweiz AG
- Harald Beyer
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
POWER MODULE AND METHOD FOR MANUFACTURING A POWER MODULE
- Publication number 20250062242
- Publication date Feb 20, 2025
- Hitachi Energy Ltd
- Fabian FISCHER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR MODULE
- Publication number 20240355704
- Publication date Oct 24, 2024
- Hitachi Energy Ltd
- Milad Maleki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CLAMPING ELEMENT AND METHOD FOR PRODUCING A POWER SEMICONDUCTOR DEVICE
- Publication number 20240266250
- Publication date Aug 8, 2024
- Lluis SANTOLARIA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR MODULE, POWER SEMICONDUCTOR DEVICE AND METHOD F...
- Publication number 20240120255
- Publication date Apr 11, 2024
- Hitachi Energy Switzerland AG
- Dominik TRUESSEL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR COMPONENT
- Publication number 20240096746
- Publication date Mar 21, 2024
- Hitachi Energy Switzerland AG
- Lluis SANTOLARIA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR POWER MODULE AND METHOD FOR MANUFACTURING A SEMICONDU...
- Publication number 20230420271
- Publication date Dec 28, 2023
- Hitachi Energy Switzerland AG
- Harald Beyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BASE PLATE HAVING SIDEWALL, POWER SEMICONDUCTOR MODULE COMPRISING T...
- Publication number 20230420315
- Publication date Dec 28, 2023
- Hitachi Energy Switzerland AG
- Biwei ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRE-PRODUCT, METHOD AND ELECTRONIC DEVICE
- Publication number 20230352377
- Publication date Nov 2, 2023
- Hitachi Energy Switzerland AG
- Dominik TRUESSEL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Semiconductor Module and Manufacturing Method
- Publication number 20230317684
- Publication date Oct 5, 2023
- Hitachi Energy Switzerland AG
- Harald Beyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Metal Substrate Structure for a Semiconductor Power Module
- Publication number 20220344456
- Publication date Oct 27, 2022
- Hitachi Energy Switzerland AG
- David Guillon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Semiconductor Module
- Publication number 20210233831
- Publication date Jul 29, 2021
- ABB Power Grids Switzerland AG
- Milad Maleki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR MODULE
- Publication number 20200112111
- Publication date Apr 9, 2020
- ABB Power Grids Switzerland AG
- Dominik Truessel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Semiconductor Module
- Publication number 20160043009
- Publication date Feb 11, 2016
- ABB Technology AG
- Harald Beyer
- H01 - BASIC ELECTRIC ELEMENTS

Harald Beyer

Person

Patents Grantslast 30 patents

Metal substrate structure for a semiconductor power module

Clamping element and method for producing a power semiconductor device

Power semiconductor module with baseplate and heat dissipating element

Power semiconductor module

Power semiconductor module

Patents Applicationslast 30 patents

POWER MODULE AND METHOD FOR MANUFACTURING A POWER MODULE

POWER SEMICONDUCTOR MODULE

CLAMPING ELEMENT AND METHOD FOR PRODUCING A POWER SEMICONDUCTOR DEVICE

POWER SEMICONDUCTOR MODULE, POWER SEMICONDUCTOR DEVICE AND METHOD F...

POWER SEMICONDUCTOR COMPONENT

SEMICONDUCTOR POWER MODULE AND METHOD FOR MANUFACTURING A SEMICONDU...

BASE PLATE HAVING SIDEWALL, POWER SEMICONDUCTOR MODULE COMPRISING T...

PRE-PRODUCT, METHOD AND ELECTRONIC DEVICE

Power Semiconductor Module and Manufacturing Method

Metal Substrate Structure for a Semiconductor Power Module

Power Semiconductor Module

POWER SEMICONDUCTOR MODULE

Power Semiconductor Module