Harald Wiesbauer

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Patents Grantslast 30 patents

Information Patent Grant
Method for treatment of a temporarily bonded product wafer
- Patent number 9,362,154
- Issue date Jun 7, 2016
- EV Group E. Thallner GmbH
- Jürgen Burggraf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fastening chips with a contact element onto a substrate...
- Patent number 9,245,869
- Issue date Jan 26, 2016
- EV Group E. Thallner GmbH
- Jurgen Burggraf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing a wafer provided with chips
- Patent number 9,224,630
- Issue date Dec 29, 2015
- EV Group E. Thallner GmbH
- Jürgen Burggraf
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR THE BONDING AND DEBONDING OF SUBSTRATES
- Publication number 20180233394
- Publication date Aug 16, 2018
- EV GROUP E. THALLNER GMBH
- Jurgen Burggraf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FASTENING CHIPS WITH A CONTACT ELEMENT ONTO A SUBSTRATE...
- Publication number 20150104902
- Publication date Apr 16, 2015
- EV GROUP E. THALLNER GMBH
- Jurgen Burggraf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING A WAFER PROVIDED WITH CHIPS
- Publication number 20130011997
- Publication date Jan 10, 2013
- EV GROUP E. THALLNER GMBH
- Jürgen Burggraf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR TREATMENT OF A TEMPORARILY BONDED PRODUCT WAFER
- Publication number 20120292288
- Publication date Nov 22, 2012
- Jürgen Burggraf
- H01 - BASIC ELECTRIC ELEMENTS