HARALD WIESNER

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LANDSHUT, DE

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Patents Grantslast 30 patents

Information Patent Grant
Metal bond pad with cobalt interconnect layer and solder thereon
- Patent number 9,960,135
- Issue date May 1, 2018
- Texas Instruments Incorporated
- Helmut Rinck
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METAL BOND PAD WITH COBALT INTERCONNECT LAYER AND SOLDER THEREON
- Publication number 20180218993
- Publication date Aug 2, 2018
- TEXAS INSTRUMENTS INCORPORATED
- HELMUT RINCK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL BOND PAD WITH COBALT INTERCONNECT LAYER AND SOLDER THEREON
- Publication number 20160284656
- Publication date Sep 29, 2016
- Texas Instruments Deutschland GmbH
- HELMUT RINCK
- H01 - BASIC ELECTRIC ELEMENTS