Hari Mahalingam

Person

Fremont, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Contactless optical probing of edge-coupled photonic ICs
- Patent number 12,216,158
- Issue date Feb 4, 2025
- Intel Corporation
- Jeremy Hicks
- G01 - MEASURING TESTING
Information Patent Grant
Silicon photonic integrated circuits on substrates with structured...
- Patent number 12,197,004
- Issue date Jan 14, 2025
- Intel Corporation
- Harel Frish
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer silicon photonics apparatus
- Patent number 12,019,270
- Issue date Jun 25, 2024
- Intel Corporation
- Hari Mahalingam
- G02 - OPTICS
Information Patent Grant
Optical device including buried optical waveguides and output couplers
- Patent number 10,996,408
- Issue date May 4, 2021
- Intel Corporation
- John Heck
- G02 - OPTICS
Information Patent Grant
Reflow compatible optical packaging
- Patent number 10,816,737
- Issue date Oct 27, 2020
- Intel Corporation
- John Heck
- G02 - OPTICS

Patents Applicationslast 30 patents

Information Patent Application
KINEMATICALLY ALIGNED OPTICAL CONNECTOR FOR SILICON PHOTONIC INTEGR...
- Publication number 20240402443
- Publication date Dec 5, 2024
- Intel Corporation
- John M. Heck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHODS FOR OPTICAL ALIGNMENT FOR PHOTONIC INTEGRATED...
- Publication number 20240361541
- Publication date Oct 31, 2024
- Intel Corporation
- Alexander Krichevsky
- G02 - OPTICS
Information Patent Application
MULTI-LAYER SILICON PHOTONICS APPARATUS
- Publication number 20240345319
- Publication date Oct 17, 2024
- Intel Corporation
- Hari Mahalingam
- G02 - OPTICS
Information Patent Application
ELECTRO-OPTICAL CIRCUITS WITH MODULAR SWITCHABLE PHOTONIC INTERFACE
- Publication number 20240219644
- Publication date Jul 4, 2024
- Intel Corporation
- Suddhasattwa Nad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNOLOGIES FOR SIGNAL AMPLIFICATION FOR A PHOTONIC INTEGRATED CIR...
- Publication number 20230350131
- Publication date Nov 2, 2023
- Intel Corporation
- Hiroki Tanaka
- G02 - OPTICS
Information Patent Application
TECHNOLOGIES FOR A BEAM EXPANSION AND COLLIMATION FOR PHOTONIC INTE...
- Publication number 20230204877
- Publication date Jun 29, 2023
- Intel Corporation
- John M. Heck
- G02 - OPTICS
Information Patent Application
PHOTONIC INTEGRATED CIRCUIT PACKAGING ARCHITECTURES
- Publication number 20230185033
- Publication date Jun 15, 2023
- Intel Corporation
- Kristof Kuwawi Darmawikarta
- G02 - OPTICS
Information Patent Application
DIE LAST AND WAVEGUIDE LAST ARCHITECTURE FOR SILICON PHOTONIC PACKA...
- Publication number 20230087124
- Publication date Mar 23, 2023
- Bai Nie
- G02 - OPTICS
Information Patent Application
DIE FIRST FAN-OUT ARCHITECTURE FOR ELECTRIC AND OPTICAL INTEGRATION
- Publication number 20230090133
- Publication date Mar 23, 2023
- Bai Nie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTONIC INTERCONNECT AND COMPONENTS IN GLASS
- Publication number 20230083222
- Publication date Mar 16, 2023
- Intel Corporation
- Kristof DARMAWIKARTA
- G02 - OPTICS
Information Patent Application
GLASS INTERPOSER OPTICAL SWITCHING DEVICE AND METHOD
- Publication number 20230076917
- Publication date Mar 9, 2023
- Intel Corporation
- Hiroki Tanaka
- G02 - OPTICS
Information Patent Application
OPTICAL COUPLER
- Publication number 20230020440
- Publication date Jan 19, 2023
- John Heck
- G02 - OPTICS
Information Patent Application
SILICON PHOTONIC INTEGRATED CIRCUITS ON SUBSTRATES WITH STRUCTURED...
- Publication number 20220413213
- Publication date Dec 29, 2022
- Intel Corporation
- Harel Frish
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACTLESS OPTICAL PROBING OF EDGE-COUPLED PHOTONIC ICs
- Publication number 20220163583
- Publication date May 26, 2022
- Intel Corporation
- Jeremy Hicks
- G01 - MEASURING TESTING
Information Patent Application
LOW-LOSS WAVEGUIDE WITH UNDERCUT
- Publication number 20220120967
- Publication date Apr 21, 2022
- Intel Corporation
- Harel Frish
- G02 - OPTICS
Information Patent Application
SYSTEMS AND METHODS FOR WAFER LEVEL BEAM PROFILE CHARACTERIZATION
- Publication number 20220107472
- Publication date Apr 7, 2022
- Intel Corporation
- Alexander KRICHEVSKY
- G02 - OPTICS
Information Patent Application
PACKAGING SOLUTIONS FOR HIGH BANDWIDTH NETWORKING APPLICATIONS
- Publication number 20210210478
- Publication date Jul 8, 2021
- Intel Corporation
- Susheel JADHAV
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LAYER SILICON PHOTONICS APPARATUS
- Publication number 20200393619
- Publication date Dec 17, 2020
- Intel Corporation
- Hari Mahalingam
- G02 - OPTICS
Information Patent Application
OPTICAL DEVICE INCLUDING BURIED OPTICAL WAVEGUIDES AND OUTPUT COUPLERS
- Publication number 20190339466
- Publication date Nov 7, 2019
- Intel Corporation
- John Heck
- G02 - OPTICS
Information Patent Application
REFLOW COMPATIBLE OPTICAL PACKAGING
- Publication number 20190121036
- Publication date Apr 25, 2019
- Intel Corporation
- John Heck
- G02 - OPTICS
Information Patent Application
POLYMER OPTICAL COUPLER
- Publication number 20190041582
- Publication date Feb 7, 2019
- Intel Corporation
- John Heck
- G02 - OPTICS

Hari Mahalingam

Person

Patents Grantslast 30 patents

Contactless optical probing of edge-coupled photonic ICs

Silicon photonic integrated circuits on substrates with structured...

Multi-layer silicon photonics apparatus

Optical device including buried optical waveguides and output couplers

Reflow compatible optical packaging

Patents Applicationslast 30 patents

KINEMATICALLY ALIGNED OPTICAL CONNECTOR FOR SILICON PHOTONIC INTEGR...

APPARATUS AND METHODS FOR OPTICAL ALIGNMENT FOR PHOTONIC INTEGRATED...

MULTI-LAYER SILICON PHOTONICS APPARATUS

ELECTRO-OPTICAL CIRCUITS WITH MODULAR SWITCHABLE PHOTONIC INTERFACE

TECHNOLOGIES FOR SIGNAL AMPLIFICATION FOR A PHOTONIC INTEGRATED CIR...

TECHNOLOGIES FOR A BEAM EXPANSION AND COLLIMATION FOR PHOTONIC INTE...

PHOTONIC INTEGRATED CIRCUIT PACKAGING ARCHITECTURES

DIE LAST AND WAVEGUIDE LAST ARCHITECTURE FOR SILICON PHOTONIC PACKA...

DIE FIRST FAN-OUT ARCHITECTURE FOR ELECTRIC AND OPTICAL INTEGRATION

PHOTONIC INTERCONNECT AND COMPONENTS IN GLASS

GLASS INTERPOSER OPTICAL SWITCHING DEVICE AND METHOD

OPTICAL COUPLER

SILICON PHOTONIC INTEGRATED CIRCUITS ON SUBSTRATES WITH STRUCTURED...

CONTACTLESS OPTICAL PROBING OF EDGE-COUPLED PHOTONIC ICs

LOW-LOSS WAVEGUIDE WITH UNDERCUT

SYSTEMS AND METHODS FOR WAFER LEVEL BEAM PROFILE CHARACTERIZATION

PACKAGING SOLUTIONS FOR HIGH BANDWIDTH NETWORKING APPLICATIONS

MULTI-LAYER SILICON PHOTONICS APPARATUS

OPTICAL DEVICE INCLUDING BURIED OPTICAL WAVEGUIDES AND OUTPUT COUPLERS

REFLOW COMPATIBLE OPTICAL PACKAGING

POLYMER OPTICAL COUPLER