Hari P. Amanapu

Person

Guilderland, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Low-resistance top contact on VTFET
- Patent number 11,908,923
- Issue date Feb 20, 2024
- International Business Machines Corporation
- Christopher J. Waskiewicz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Phase change memory cell galvanic corrosion prevention
- Patent number 11,800,817
- Issue date Oct 24, 2023
- International Business Machines Corporation
- Injo Ok
Information Patent Grant
Planarization stop region for use with low pattern density intercon...
- Patent number 11,637,036
- Issue date Apr 25, 2023
- International Business Machines Corporation
- Cornelius Brown Peethala
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Middle-of-line contacts with varying contact area providing reduced...
- Patent number 11,127,825
- Issue date Sep 21, 2021
- International Business Machines Corporation
- Chanro Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Forming dual metallization interconnect structures in single metall...
- Patent number 11,037,875
- Issue date Jun 15, 2021
- International Business Machines Corporation
- Hari P. Amanapu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Planarization of dielectric topography and stopping in dielectric
- Patent number 11,037,795
- Issue date Jun 15, 2021
- International Business Machines Corporation
- Hari Prasad Amanapu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Forming dual metallization interconnect structures in single metall...
- Patent number 11,031,337
- Issue date Jun 8, 2021
- International Business Machines Corporation
- Hari P. Amanapu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Non-self aligned contact semiconductor devices
- Patent number 11,024,720
- Issue date Jun 1, 2021
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Skip via for metal interconnects
- Patent number 10,978,388
- Issue date Apr 13, 2021
- International Business Machines Corporation
- Hari Prasad Amanapu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Robust gate cap for protecting a gate from downstream metallization...
- Patent number 10,916,431
- Issue date Feb 9, 2021
- International Business Machines Corporation
- Raghuveer Reddy Patlolla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bottom electrode and dielectric structure for MRAM applications
- Patent number 10,833,122
- Issue date Nov 10, 2020
- International Business Machines Corporation
- Hari Prasad Amanapu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low-resistance top contact on VTFET
- Patent number 10,833,173
- Issue date Nov 10, 2020
- International Business Machines Corporation
- Christopher J. Waskiewicz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Recessed interconnet line having a low-oxygen cap for facilitating...
- Patent number 10,832,946
- Issue date Nov 10, 2020
- International Business Machines Corporation
- Samuel Sung Shik Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal interconnect structures with self-forming sidewall barrier layer
- Patent number 10,818,589
- Issue date Oct 27, 2020
- International Business Machines Corporation
- Hari Prasad Amanapu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Forming dual metallization interconnect structures in single metall...
- Patent number 10,559,530
- Issue date Feb 11, 2020
- International Business Machines Corporation
- Hari P. Amanapu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cobalt contact and interconnect structures
- Patent number 10,373,867
- Issue date Aug 6, 2019
- International Business Machines Corporation
- Hari P. Amanapu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low-resistivity metallic interconnect structures with self-forming...
- Patent number 10,204,829
- Issue date Feb 12, 2019
- International Business Machines Corporation
- Hari P. Amanapu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cobalt contact and interconnect structures
- Patent number 10,177,030
- Issue date Jan 8, 2019
- International Business Machines Corporation
- Hari P. Amanapu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PHASE CHANGE MEMORY CELL GALVANIC CORROSION PREVENTION
- Publication number 20220407005
- Publication date Dec 22, 2022
- International Business Machines Corporation
- Injo Ok
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLANARIZATION STOP REGION FOR USE WITH LOW PATTERN DENSITY INTERCON...
- Publication number 20210242077
- Publication date Aug 5, 2021
- International Business Machines Corporation
- Cornelius Brown Peethala
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID METALLIZATION AND DIELECTRIC INTERCONNECTS IN TOP VIA CONFIG...
- Publication number 20210143061
- Publication date May 13, 2021
- International Business Machines Corporation
- Hari Prasad Amanapu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Planarization of Dielectric Topography and Stopping in Dielectric
- Publication number 20210035813
- Publication date Feb 4, 2021
- International Business Machines Corporation
- Hari Prasad Amanapu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW-RESISTANCE TOP CONTACT ON VTFET
- Publication number 20210005735
- Publication date Jan 7, 2021
- International Business Machines Corporation
- Christopher J. Waskiewicz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RECESSED INTERCONNET LINE HAVING A LOW-OXYGEN CAP FOR FACILITATING...
- Publication number 20200343131
- Publication date Oct 29, 2020
- International Business Machines Corporation
- Samuel Sung, Shik Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ROBUST GATE CAP FOR PROTECTING A GATE FROM DOWNSTREAM METALLIZATION...
- Publication number 20200335345
- Publication date Oct 22, 2020
- International Business Machines Corporation
- Raghuveer Reddy Patlolla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MIDDLE-OF-LINE CONTACTS WITH VARYING CONTACT AREA PROVIDING REDUCED...
- Publication number 20200303264
- Publication date Sep 24, 2020
- International Business Machines Corporation
- Chanro Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Metal Interconnect Structures with Self-Forming Sidewall Barrier Layer
- Publication number 20200294911
- Publication date Sep 17, 2020
- International Business Machines Corporation
- Hari Prasad Amanapu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NON-SELF ALIGNED CONTACT SEMICONDUCTOR DEVICES
- Publication number 20200295151
- Publication date Sep 17, 2020
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOTTOM ELECTRODE AND DIELECTRIC STRUCTURE FOR MRAM APPLICATIONS
- Publication number 20200219931
- Publication date Jul 9, 2020
- International Business Machines Corporation
- Hari Prasad Amanapu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SKIP VIA FOR METAL INTERCONNECTS
- Publication number 20200111736
- Publication date Apr 9, 2020
- International Business Machines Corporation
- Hari Prasad Amanapu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW-RESISTANCE TOP CONTACT ON VTFET
- Publication number 20200075746
- Publication date Mar 5, 2020
- International Business Machines Corporation
- Christopher J. Waskiewicz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FORMING DUAL METALLIZATION INTERCONNECT STRUCTURES IN SINGLE METALL...
- Publication number 20190311986
- Publication date Oct 10, 2019
- International Business Machines Corporation
- Hari P. Amanapu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FORMING DUAL METALLIZATION INTERCONNECT STRUCTURES IN SINGLE METALL...
- Publication number 20190221519
- Publication date Jul 18, 2019
- International Business Machines Corporation
- Hari P. Amanapu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW-RESISTIVITY METALLIC INTERCONNECT STRUCTURES WITH SELF-FORMING...
- Publication number 20190221477
- Publication date Jul 18, 2019
- International Business Machines Corporation
- Hari P. Amanapu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FORMING DUAL METALLIZATION INTERCONNECT STRUCTURES IN SINGLE METALL...
- Publication number 20190198444
- Publication date Jun 27, 2019
- International Business Machines Corporation
- Hari P. Amanapu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COBALT CONTACT AND INTERCONNECT STRUCTURES
- Publication number 20180197774
- Publication date Jul 12, 2018
- International Business Machines Corporation
- Hari P. Amanapu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COBALT CONTACT AND INTERCONNECT STRUCTURES
- Publication number 20180197773
- Publication date Jul 12, 2018
- International Business Machines Corporation
- Hari P. Amanapu
- H01 - BASIC ELECTRIC ELEMENTS

Hari P. Amanapu

Person

Patents Grantslast 30 patents

Low-resistance top contact on VTFET

Phase change memory cell galvanic corrosion prevention

Planarization stop region for use with low pattern density intercon...

Middle-of-line contacts with varying contact area providing reduced...

Forming dual metallization interconnect structures in single metall...

Planarization of dielectric topography and stopping in dielectric

Forming dual metallization interconnect structures in single metall...

Non-self aligned contact semiconductor devices

Skip via for metal interconnects

Robust gate cap for protecting a gate from downstream metallization...

Bottom electrode and dielectric structure for MRAM applications

Low-resistance top contact on VTFET

Recessed interconnet line having a low-oxygen cap for facilitating...

Metal interconnect structures with self-forming sidewall barrier layer

Forming dual metallization interconnect structures in single metall...

Cobalt contact and interconnect structures

Low-resistivity metallic interconnect structures with self-forming...

Cobalt contact and interconnect structures

Patents Applicationslast 30 patents

PHASE CHANGE MEMORY CELL GALVANIC CORROSION PREVENTION

PLANARIZATION STOP REGION FOR USE WITH LOW PATTERN DENSITY INTERCON...

HYBRID METALLIZATION AND DIELECTRIC INTERCONNECTS IN TOP VIA CONFIG...

Planarization of Dielectric Topography and Stopping in Dielectric

LOW-RESISTANCE TOP CONTACT ON VTFET

RECESSED INTERCONNET LINE HAVING A LOW-OXYGEN CAP FOR FACILITATING...

ROBUST GATE CAP FOR PROTECTING A GATE FROM DOWNSTREAM METALLIZATION...

MIDDLE-OF-LINE CONTACTS WITH VARYING CONTACT AREA PROVIDING REDUCED...

Metal Interconnect Structures with Self-Forming Sidewall Barrier Layer

NON-SELF ALIGNED CONTACT SEMICONDUCTOR DEVICES

BOTTOM ELECTRODE AND DIELECTRIC STRUCTURE FOR MRAM APPLICATIONS

SKIP VIA FOR METAL INTERCONNECTS

LOW-RESISTANCE TOP CONTACT ON VTFET

FORMING DUAL METALLIZATION INTERCONNECT STRUCTURES IN SINGLE METALL...

FORMING DUAL METALLIZATION INTERCONNECT STRUCTURES IN SINGLE METALL...

LOW-RESISTIVITY METALLIC INTERCONNECT STRUCTURES WITH SELF-FORMING...

FORMING DUAL METALLIZATION INTERCONNECT STRUCTURES IN SINGLE METALL...

COBALT CONTACT AND INTERCONNECT STRUCTURES

COBALT CONTACT AND INTERCONNECT STRUCTURES