Harlan Lawler

Follow

Person

Milpitas, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Die bonding process
- Patent number 4,772,935
- Issue date Sep 20, 1988
- Fairchild Semiconductor Corporation
- Harlan Lawler
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Charge coupled devices in tiled arrays
- Publication number 20040012689
- Publication date Jan 22, 2004
- Fairchild Imaging
- Natale F. Tinnerino
- H04 - ELECTRIC COMMUNICATION TECHNIQUE