Harpuneet Singh

Person

Dublin, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Camera device methods, apparatus and components
- Patent number 10,353,195
- Issue date Jul 16, 2019
- Light Labs Inc.
- Harpuneet Singh
- G02 - OPTICS
Information Patent Grant
Camera calibration apparatus and methods
- Patent number 10,306,218
- Issue date May 28, 2019
- Light Labs Inc.
- Nitesh Shroff
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Filter mounting methods and apparatus and related camera apparatus
- Patent number 9,930,233
- Issue date Mar 27, 2018
- Light Labs Inc.
- Harpuneet Singh
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Camera device methods, apparatus and components
- Patent number 9,857,584
- Issue date Jan 2, 2018
- Light Labs Inc.
- Harpuneet Singh
- G02 - OPTICS
Information Patent Grant
Camera
- Patent number D802646
- Issue date Nov 14, 2017
- Light Labs Inc.
- Rajiv Laroia
- D16 - Photography and optical equipment
Information Patent Grant
Wafer level camera module with molded housing and method of manufac...
- Patent number 9,419,032
- Issue date Aug 16, 2016
- Nanchang O-Film Optoelectronics Technology Ltd
- Harpuneet Singh
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Attachment of wafer level optics
- Patent number 9,118,825
- Issue date Aug 25, 2015
- Nan Chang O-Film Optoelectronics Technology Ltd
- Harpuneet Singh
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Compact camera modules with features for reducing Z-height and faci...
- Patent number 9,029,759
- Issue date May 12, 2015
- Nan Chang O-Film Optoelectronics Technology Ltd
- Harpuneet Singh
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Wafer level camera module and method of manufacture
- Patent number 8,730,369
- Issue date May 20, 2014
- DigitalOptics Corporation
- Harpuneet Singh
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Small form factor modules using wafer level optics with bottom cavi...
- Patent number 8,605,208
- Issue date Dec 10, 2013
- DigitalOptics Corporation
- Harpuneet Singh
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Wafer level camera module and method of manufacture
- Patent number 8,456,560
- Issue date Jun 4, 2013
- DigitalOptics Corporation
- Harpuneet Singh
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Techniques for glass attachment in an image sensor package
- Patent number 8,093,092
- Issue date Jan 10, 2012
- Flextronics AP, LLC
- Harpuneet Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for mounting an image capture device on a flexibl...
- Patent number 7,714,931
- Issue date May 11, 2010
- Flextronics International USA, Inc.
- Harpuneet Singh
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Patents Applicationslast 30 patents

Information Patent Application
CAMERA DEVICE METHODS, APPARATUS AND COMPONENTS
- Publication number 20180188523
- Publication date Jul 5, 2018
- Light Labs Inc.
- Harpuneet Singh
- G02 - OPTICS
Information Patent Application
CAMERA CALIBRATION APPARATUS AND METHODS
- Publication number 20170280135
- Publication date Sep 28, 2017
- The LightCo Inc.
- Nitesh Shroff
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
FILTER MOUNTING METHODS AND APPARATUS AND RELATED CAMERA APPARATUS
- Publication number 20160316117
- Publication date Oct 27, 2016
- The LightCo Inc.
- Harpuneet Singh
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
CAMERA DEVICE METHODS, APPARATUS AND COMPONENTS
- Publication number 20160306168
- Publication date Oct 20, 2016
- The LightCo Inc.
- Harpuneet Singh
- G02 - OPTICS
Information Patent Application
WAFER LEVEL CAMERA MODULE AND METHOD OF MANUFACTURE
- Publication number 20150026971
- Publication date Jan 29, 2015
- DigitalOptics Corporation
- Harpuneet Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SMALL FORM FACTOR MODULES USING WAFER LEVEL OPTICS WITH BOTTOM CAVI...
- Publication number 20140098288
- Publication date Apr 10, 2014
- DigitalOptics Corporation
- Harpuneet Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Compact Camera Module
- Publication number 20130270419
- Publication date Oct 17, 2013
- DigitalOptics Corporation
- Harpuneet Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL CAMERA MODULE AND METHOD OF MANUFACTURE
- Publication number 20130265481
- Publication date Oct 10, 2013
- Harpuneet Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAMERA MODULE HOUSING HAVING MOLDED TAPE SUBSTRATE WITH FOLDED LEADS
- Publication number 20130128106
- Publication date May 23, 2013
- FLEXTRONICS AP, LLC
- Samuel Tam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer level camera module with molded housing and method of manufac...
- Publication number 20110037886
- Publication date Feb 17, 2011
- Harpuneet Singh
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Techniques for Glass Attachment in an Image Sensor Package
- Publication number 20100105160
- Publication date Apr 29, 2010
- Harpuneet Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Small form factor modules using wafer level optics with bottom cavi...
- Publication number 20100053423
- Publication date Mar 4, 2010
- Harpuneet Singh
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
ATTACHMENT OF WAFER LEVEL OPTICS
- Publication number 20090213262
- Publication date Aug 27, 2009
- FLEXTRONICS AP, LLC
- Harpuneet Singh
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Auto focus/zoom modules using wafer level optics
- Publication number 20090015706
- Publication date Jan 15, 2009
- Harpuneet Singh
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Wafer level camera module and method of manufacture
- Publication number 20080180566
- Publication date Jul 31, 2008
- Harpuneet Singh
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
System and method for mounting an image capture device on a flexibl...
- Publication number 20050285973
- Publication date Dec 29, 2005
- Harpuneet Singh
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Harpuneet Singh

Person

Patents Grantslast 30 patents

Camera device methods, apparatus and components

Camera calibration apparatus and methods

Filter mounting methods and apparatus and related camera apparatus

Camera device methods, apparatus and components

Camera

Wafer level camera module with molded housing and method of manufac...

Attachment of wafer level optics

Compact camera modules with features for reducing Z-height and faci...

Wafer level camera module and method of manufacture

Small form factor modules using wafer level optics with bottom cavi...

Wafer level camera module and method of manufacture

Techniques for glass attachment in an image sensor package

System and method for mounting an image capture device on a flexibl...

Patents Applicationslast 30 patents

CAMERA DEVICE METHODS, APPARATUS AND COMPONENTS

CAMERA CALIBRATION APPARATUS AND METHODS

FILTER MOUNTING METHODS AND APPARATUS AND RELATED CAMERA APPARATUS

CAMERA DEVICE METHODS, APPARATUS AND COMPONENTS

WAFER LEVEL CAMERA MODULE AND METHOD OF MANUFACTURE

SMALL FORM FACTOR MODULES USING WAFER LEVEL OPTICS WITH BOTTOM CAVI...

Compact Camera Module

WAFER LEVEL CAMERA MODULE AND METHOD OF MANUFACTURE

CAMERA MODULE HOUSING HAVING MOLDED TAPE SUBSTRATE WITH FOLDED LEADS

Wafer level camera module with molded housing and method of manufac...

Techniques for Glass Attachment in an Image Sensor Package

Small form factor modules using wafer level optics with bottom cavi...

ATTACHMENT OF WAFER LEVEL OPTICS

Auto focus/zoom modules using wafer level optics

Wafer level camera module and method of manufacture

System and method for mounting an image capture device on a flexibl...