Harry Fujimoto

Person

Sunnyvale, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Isolation structure configurations for modifying stresses in semico...
- Patent number 7,411,269
- Issue date Aug 12, 2008
- Intel Corporation
- Qing Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Isolation structure configurations for modifying stresses in semico...
- Patent number 7,410,858
- Issue date Aug 12, 2008
- Intel Corporation
- Qing Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Isolation structure configurations for modifying stresses in semico...
- Patent number 6,876,053
- Issue date Apr 5, 2005
- Intel Corporation
- Qing Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die-in-heat spreader microelectronic package
- Patent number 6,709,898
- Issue date Mar 23, 2004
- Intel Corporation
- Qing Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon interposer and multi-chip-module (MCM) with through substra...
- Patent number 6,562,653
- Issue date May 13, 2003
- Intel Corporation
- Qing Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit guard ring structures
- Patent number 6,509,622
- Issue date Jan 21, 2003
- Intel Corporation
- Qing Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Direct build-up layer on an encapsulated die package
- Patent number 6,271,469
- Issue date Aug 7, 2001
- Intel Corporation
- Qing Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon interposer and multi-chip-module (MCM) with through substra...
- Patent number 6,229,216
- Issue date May 8, 2001
- Intel Corporation
- Qing Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat spreader structures for enhanced heat removal from both sides...
- Patent number 6,219,243
- Issue date Apr 17, 2001
- Intel Corporation
- Qing Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures and processes for fabricating moisture resistant chip-on...
- Patent number 6,154,366
- Issue date Nov 28, 2000
- Intel Corporation
- Qing Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interface between titanium and aluminum-alloy in metal stack for in...
- Patent number 5,747,879
- Issue date May 5, 1998
- Intel Corporation
- Rajiv Rastogi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Isolation structure configurations for modifying stresses in semico...
- Publication number 20070013023
- Publication date Jan 18, 2007
- Qing Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Isolation structure configurations for modifying stresses in semico...
- Publication number 20060220147
- Publication date Oct 5, 2006
- Qing Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Isolation structure configurations for modifying stresses in semico...
- Publication number 20050179109
- Publication date Aug 18, 2005
- Qing Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Die-in heat spreader microelectronic package
- Publication number 20040155325
- Publication date Aug 12, 2004
- Intel Corporation
- Qing Ma
- H01 - BASIC ELECTRIC ELEMENTS

Harry Fujimoto

Person

Patents Grantslast 30 patents

Isolation structure configurations for modifying stresses in semico...

Isolation structure configurations for modifying stresses in semico...

Isolation structure configurations for modifying stresses in semico...

Die-in-heat spreader microelectronic package

Silicon interposer and multi-chip-module (MCM) with through substra...

Integrated circuit guard ring structures

Direct build-up layer on an encapsulated die package

Silicon interposer and multi-chip-module (MCM) with through substra...

Heat spreader structures for enhanced heat removal from both sides...

Structures and processes for fabricating moisture resistant chip-on...

Interface between titanium and aluminum-alloy in metal stack for in...

Patents Applicationslast 30 patents

Isolation structure configurations for modifying stresses in semico...

Isolation structure configurations for modifying stresses in semico...

Isolation structure configurations for modifying stresses in semico...

Die-in heat spreader microelectronic package