Harry-Hak-Lay Chuang

Person

Zhubei, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method for fabricating the same
- Patent number 12,223,989
- Issue date Feb 11, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Harry-Hak-Lay Chuang
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor device having metal gate and poly gate
- Patent number 12,217,975
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Alexander Kalnitsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
DC and AC magnetic field protection for MRAM device using magnetic-...
- Patent number 12,218,074
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Harry-Hak-Lay Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor wafer testing system and related method for improving...
- Patent number 12,210,055
- Issue date Jan 28, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Harry-Hak-Lay Chuang
- G11 - INFORMATION STORAGE
Information Patent Grant
Shared pad/bridge layout for a 3D IC
- Patent number 12,191,282
- Issue date Jan 7, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Harry-Hak-Lay Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method for fabricating the same
- Patent number 12,191,262
- Issue date Jan 7, 2025
- Taiwan Semiconductor Manufacturing Company Ltd.
- Harry-Hak-Lay Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Techniques for MRAM MTJ top electrode to via interface
- Patent number 12,167,614
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Harry-Hak-Lay Chuang
Information Patent Grant
3DIC structure for high voltage device on a SOI substrate
- Patent number 12,136,627
- Issue date Nov 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Harry-Hak-Lay Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor feature and method for manufacturing the same
- Patent number 12,107,001
- Issue date Oct 1, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Harry-Hak-Lay Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor arrangement and formation thereof
- Patent number 12,068,313
- Issue date Aug 20, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Harry-Hak-Lay Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Magnetic random access memory device and formation method thereof
- Patent number 12,069,963
- Issue date Aug 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Harry-Hak-Lay Chuang
Information Patent Grant
Etch stop layer for memory device formation
- Patent number 12,027,420
- Issue date Jul 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sheng-Huang Huang
- G11 - INFORMATION STORAGE
Information Patent Grant
Method to embed planar FETs with finFETs
- Patent number 12,015,029
- Issue date Jun 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Harry-Hak-Lay Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor-on-insulator (SOI) semiconductor structures including...
- Patent number 11,978,740
- Issue date May 7, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Harry-Hak-Lay Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded wafer device structure and methods for making the same
- Patent number 11,961,826
- Issue date Apr 16, 2024
- Harry-Hak-Lay Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High voltage device with boosted breakdown voltage
- Patent number 11,935,918
- Issue date Mar 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Harry-Hak-Lay Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure integrated with magnetic tunneling junction
- Patent number 11,930,645
- Issue date Mar 12, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Alexander Kalnitsky
- G11 - INFORMATION STORAGE
Information Patent Grant
Method for MRAM top electrode connection
- Patent number 11,910,619
- Issue date Feb 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Harry-Hak-Lay Chuang
Information Patent Grant
Embedded flash memory device with floating gate embedded in a subst...
- Patent number 11,903,191
- Issue date Feb 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei Cheng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory cell with top electrode via
- Patent number 11,889,769
- Issue date Jan 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Che Ku
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having metal gate and poly gate
- Patent number 11,854,828
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Alexander Kalnitsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method to embed planar FETS with FINFETS
- Patent number 11,830,875
- Issue date Nov 28, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Harry-Hak-Lay Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory device
- Patent number 11,832,529
- Issue date Nov 28, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Harry-Hak-Lay Chuang
Information Patent Grant
Semiconductor device
- Patent number 11,832,452
- Issue date Nov 28, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Harry-Hak-Lay Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sidewall spacer structure for memory cell
- Patent number 11,818,962
- Issue date Nov 14, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yao-Wen Chang
Information Patent Grant
MRAM memory cell layout for minimizing bitcell area
- Patent number 11,800,724
- Issue date Oct 24, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Harry-Hak-Lay Chuang
Information Patent Grant
Via landing enhancement for memory device
- Patent number 11,785,862
- Issue date Oct 10, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun-Heng Liao
Information Patent Grant
Semiconductor feature and method for manufacturing the same
- Patent number 11,764,103
- Issue date Sep 19, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Harry-Hak-Lay Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method for fabricating the same
- Patent number 11,749,617
- Issue date Sep 5, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Harry-Hak-Lay Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for forming the same
- Patent number 11,742,348
- Issue date Aug 29, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Li-Feng Teng
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20250048935
- Publication date Feb 6, 2025
- Taiwan Semiconductor Manufacturing company Ltd.
- Harry-Hak Lay Chuang
Information Patent Application
PHASE CHANGE MATERIAL SWITCH INCLUDING AN IONIC RESISTANCE CHANGE M...
- Publication number 20240389483
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Yu-Wei Ting
Information Patent Application
MFM DEVICE WITH AN ENHANCED BOTTOM ELECTRODE
- Publication number 20240389350
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Harry-Hak-Lay Chuang
Information Patent Application
RFSOI SEMICONDUCTOR STRUCTURES INCLUDING AN ELECTROMAGNETIC SHIELD...
- Publication number 20240387399
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Fu-Hai Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20240381666
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- Harry-Hak-Lay CHUANG
Information Patent Application
TECHNIQUES FOR MRAM MTJ TOP ELECTRODE TO VIA INTERFACE
- Publication number 20240381670
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Harry-Hak-Lay Chuang
Information Patent Application
METHOD AND STRUCTURE FOR IMPROVED MEMORY INTEGRITY AT ARRAY BOUNDARIES
- Publication number 20240381785
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jun-Yao Chen
Information Patent Application
INTEGRATED CHIP WITH GOOD THERMAL DISSIPATION PERFORMANCE
- Publication number 20240379486
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Harry-Hak-Lay Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CHIP WITH SOLID-STATE POWER STORAGE DEVICE
- Publication number 20240379656
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi Ching Ong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EXTERNAL MAGNETIC FIELD DETECTION FOR MRAM DEVICE
- Publication number 20240371459
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Harry-Hak-Lay Chuang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR FEATURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240371681
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Harry-Hak-Lay CHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENERGY HARVEST AND STORAGE DEVICE FOR SEMICONDUCTOR CHIPS AND METHO...
- Publication number 20240371798
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Kuen-Yi Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3DIC STRUCTURE FOR HIGH VOLTAGE DEVICE ON A SOI SUBSTRATE
- Publication number 20240371884
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Harry-Hak-Lay Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MAGNETIC RANDOM ACCESS MEMORY DEVICE AND FORMATION METHOD THEREOF
- Publication number 20240365682
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Harry-Hak-Lay CHUANG
Information Patent Application
METHOD FOR FABRICATING SEMICONDUCTOR DEVICE
- Publication number 20240341102
- Publication date Oct 10, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- ALEXANDER KALNITSKY
- G11 - INFORMATION STORAGE
Information Patent Application
Magnetoresistive Random-Access Memory (MRAM) Cell and Method of Ope...
- Publication number 20240339144
- Publication date Oct 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Harry-Hak-Lay Chuang
- G11 - INFORMATION STORAGE
Information Patent Application
ETCH STOP LAYER FOR MEMORY DEVICE FORMATION
- Publication number 20240321635
- Publication date Sep 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sheng-Huang Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD TO EMBED PLANAR FETS WITH FINFETS
- Publication number 20240290786
- Publication date Aug 29, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Harry-Hak-Lay Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH VOLTAGE DEVICE WITH BOOSTED BREAKDOWN VOLTAGE
- Publication number 20240250116
- Publication date Jul 25, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Harry-Hak-Lay Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR-ON-INSULATOR (SOI) SEMICONDUCTOR STRUCTURES INCLUDING...
- Publication number 20240250089
- Publication date Jul 25, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Harry-Hak-Lay CHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED WAFER DEVICE STRUCTURE AND METHODS FOR MAKING THE SAME
- Publication number 20240222332
- Publication date Jul 4, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Harry-Hak-Lay CHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Embedded Flash Memory Device with Floating Gate Embedded in a Subst...
- Publication number 20240147716
- Publication date May 2, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wei Cheng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MRAM TOP ELECTRODE CONNECTION
- Publication number 20240147734
- Publication date May 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Harry-Hak-Lay Chuang
Information Patent Application
EMBEDDED MEMORY DEVICE WITH REDUCED PLASMA-INDUCED DAMAGE AND METHO...
- Publication number 20240113043
- Publication date Apr 4, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Harry-Hak-Lay Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING METAL GATE AND POLY GATE
- Publication number 20240096643
- Publication date Mar 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Alexander KALNITSKY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SHIELDING FOR REDUCING ELECTROMAGNETIC INTERFERENCE AND MAGNETIC IN...
- Publication number 20240096818
- Publication date Mar 21, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Harry-Hak-Lay Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY CELL WITH TOP ELECTRODE VIA
- Publication number 20240090340
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Che Ku
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240057344
- Publication date Feb 15, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- HARRY-HAK-LAY CHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FERROMAGNETIC PLATES FOR ENHANCING INDUCTANCE AND METHODS OF FORMIN...
- Publication number 20240047508
- Publication date Feb 8, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Yu-Sheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURING THEREOF
- Publication number 20240021515
- Publication date Jan 18, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- HARRY-HAK-LAY CHUANG
- H01 - BASIC ELECTRIC ELEMENTS

Harry-Hak-Lay Chuang

Person

Patents Grantslast 30 patents

Semiconductor device and method for fabricating the same

Semiconductor device having metal gate and poly gate

DC and AC magnetic field protection for MRAM device using magnetic-...

Semiconductor wafer testing system and related method for improving...

Shared pad/bridge layout for a 3D IC

Package structure and method for fabricating the same

Techniques for MRAM MTJ top electrode to via interface

3DIC structure for high voltage device on a SOI substrate

Semiconductor feature and method for manufacturing the same

Semiconductor arrangement and formation thereof

Magnetic random access memory device and formation method thereof

Etch stop layer for memory device formation

Method to embed planar FETs with finFETs

Semiconductor-on-insulator (SOI) semiconductor structures including...

Bonded wafer device structure and methods for making the same

High voltage device with boosted breakdown voltage

Semiconductor structure integrated with magnetic tunneling junction

Method for MRAM top electrode connection

Embedded flash memory device with floating gate embedded in a subst...

Memory cell with top electrode via

Semiconductor device having metal gate and poly gate

Method to embed planar FETS with FINFETS

Memory device

Semiconductor device

Sidewall spacer structure for memory cell

MRAM memory cell layout for minimizing bitcell area

Via landing enhancement for memory device

Semiconductor feature and method for manufacturing the same

Package structure and method for fabricating the same

Semiconductor device and method for forming the same

Patents Applicationslast 30 patents

SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME

PHASE CHANGE MATERIAL SWITCH INCLUDING AN IONIC RESISTANCE CHANGE M...

MFM DEVICE WITH AN ENHANCED BOTTOM ELECTRODE

RFSOI SEMICONDUCTOR STRUCTURES INCLUDING AN ELECTROMAGNETIC SHIELD...

SEMICONDUCTOR MEMORY DEVICE AND METHOD FOR FABRICATING THE SAME

TECHNIQUES FOR MRAM MTJ TOP ELECTRODE TO VIA INTERFACE

METHOD AND STRUCTURE FOR IMPROVED MEMORY INTEGRITY AT ARRAY BOUNDARIES

INTEGRATED CHIP WITH GOOD THERMAL DISSIPATION PERFORMANCE

INTEGRATED CHIP WITH SOLID-STATE POWER STORAGE DEVICE

EXTERNAL MAGNETIC FIELD DETECTION FOR MRAM DEVICE

SEMICONDUCTOR FEATURE AND METHOD FOR MANUFACTURING THE SAME

ENERGY HARVEST AND STORAGE DEVICE FOR SEMICONDUCTOR CHIPS AND METHO...

3DIC STRUCTURE FOR HIGH VOLTAGE DEVICE ON A SOI SUBSTRATE

MAGNETIC RANDOM ACCESS MEMORY DEVICE AND FORMATION METHOD THEREOF

METHOD FOR FABRICATING SEMICONDUCTOR DEVICE

Magnetoresistive Random-Access Memory (MRAM) Cell and Method of Ope...

ETCH STOP LAYER FOR MEMORY DEVICE FORMATION

METHOD TO EMBED PLANAR FETS WITH FINFETS

HIGH VOLTAGE DEVICE WITH BOOSTED BREAKDOWN VOLTAGE

SEMICONDUCTOR-ON-INSULATOR (SOI) SEMICONDUCTOR STRUCTURES INCLUDING...

BONDED WAFER DEVICE STRUCTURE AND METHODS FOR MAKING THE SAME

Embedded Flash Memory Device with Floating Gate Embedded in a Subst...

METHOD FOR MRAM TOP ELECTRODE CONNECTION

EMBEDDED MEMORY DEVICE WITH REDUCED PLASMA-INDUCED DAMAGE AND METHO...

SEMICONDUCTOR DEVICE HAVING METAL GATE AND POLY GATE

SHIELDING FOR REDUCING ELECTROMAGNETIC INTERFERENCE AND MAGNETIC IN...

MEMORY CELL WITH TOP ELECTRODE VIA

SEMICONDUCTOR DEVICE

FERROMAGNETIC PLATES FOR ENHANCING INDUCTANCE AND METHODS OF FORMIN...

SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURING THEREOF