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Harry J. Geyer
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Phoenix, AZ, US
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last 30 patents
Information
Patent Grant
Semiconductor chip package and method of forming
Patent number
5,467,253
Issue date
Nov 14, 1995
Motorola, Inc.
James K. Heckman
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method and apparatus for controlled deformation bonding
Patent number
5,240,165
Issue date
Aug 31, 1993
Motorola, Inc.
Harry J. Geyer
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Apparatus for tape automated bonding
Patent number
5,232,144
Issue date
Aug 3, 1993
Motorola, Inc.
Francis J. Carney
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Data device module having locking groove
Patent number
4,943,708
Issue date
Jul 24, 1990
Motorola, Inc.
Marion I. Simmons
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Metallization scheme providing adhesion and barrier properties
Patent number
4,927,505
Issue date
May 22, 1990
Motorola Inc.
Ravinder K. Sharma
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Metallization scheme providing adhesion and barrier properties
Patent number
4,880,708
Issue date
Nov 14, 1989
Motorola, Inc.
Ravinder K. Sharma
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Bonding method and apparatus
Patent number
4,795,077
Issue date
Jan 3, 1989
Motorola Inc.
Harry J. Geyer
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Integrated circuit device employing metal frame means with preforme...
Patent number
4,003,073
Issue date
Jan 11, 1977
Motorola, Inc.
Robert W. Helda
H01 - BASIC ELECTRIC ELEMENTS