Harry J. Jones

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Underhill, VT, US

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Patents Grantslast 30 patents

Information Patent Grant
Balltape structure for tape automated bonding, multilayer packaging...
- Patent number 4,814,855
- Issue date Mar 21, 1989
- International Business Machines Corporation
- Rodney T. Hodgson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic EC for minimizing EC pads
- Patent number 4,746,815
- Issue date May 24, 1988
- International Business Machines Corporation
- Harsaran S. Bhatia
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Dotting circuit with inhibit function
- Patent number 4,743,781
- Issue date May 10, 1988
- International Business Machines Corporation
- Harsaran S. Bhatia
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Process for making a dual implanted drain extension for bucket brig...
- Patent number 4,358,890
- Issue date Nov 16, 1982
- IBM Corporation
- Lawrence G. Heller
- H01 - BASIC ELECTRIC ELEMENTS