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Harry Kam Cheng Hong
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Melaka, MY
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last 30 patents
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Patent Grant
Leadless leadframe package design that provides a greater structura...
Patent number
6,818,970
Issue date
Nov 16, 2004
National Semiconductor Corporation
Harry Kam Cheng Hong
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Locking of mold compound to conductive substrate panels
Patent number
6,808,961
Issue date
Oct 26, 2004
National Semiconductor Corporation
Harry Kam Cheng Hong
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Leadless leadframe package design that provides a greater structura...
Patent number
6,677,667
Issue date
Jan 13, 2004
National Semiconductor Corporation
Harry Kam Cheng Hong
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Rotary mechanical buffing method for deflashing of molded integrate...
Patent number
6,629,880
Issue date
Oct 7, 2003
National Semiconductor Corporation
Aik Seng Kang
B24 - GRINDING POLISHING
Information
Patent Grant
Locking of mold compound to conductive substrate panels
Patent number
6,576,989
Issue date
Jun 10, 2003
National Semiconductor Corporation
Harry Kam Cheng Hong
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Pin indicator for leadless leadframe packages
Patent number
6,448,107
Issue date
Sep 10, 2002
National Semiconductor Corporation
Harry Kam Cheng Hong
H01 - BASIC ELECTRIC ELEMENTS