Harry Kam Cheng Hong

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Melaka, MY

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Patents Grantslast 30 patents

Information Patent Grant
Locking of mold compound to conductive substrate panels
- Patent number 6,963,124
- Issue date Nov 8, 2005
- National Semiconductor Corporation
- Harry Kam Cheng Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadless leadframe package design that provides a greater structura...
- Patent number 6,933,174
- Issue date Aug 23, 2005
- National Semiconductor Corporation
- Harry Kam Cheng Hong
- H01 - BASIC ELECTRIC ELEMENTS