Harry M. Siegel

Person

Hurst, TX, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method for providing a redistribution metal layer in an integrated...
- Patent number 8,163,645
- Issue date Apr 24, 2012
- STMicroelectronics, Inc.
- Danielle A. Thomas
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
System for providing a redistribution metal layer in an integrated...
- Patent number 7,786,582
- Issue date Aug 31, 2010
- STMicroelectronics, Inc.
- Danielle A. Thomas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for using a pre-formed film in a transfer molding process fo...
- Patent number 7,595,017
- Issue date Sep 29, 2009
- STMicroelectronics, Inc.
- Harry Michael Siegel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for controlling integrated circuit die height and...
- Patent number 7,456,050
- Issue date Nov 25, 2008
- STMicroelectronics, Inc.
- Harry Michael Siegel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded flat film molding
- Patent number 7,202,110
- Issue date Apr 10, 2007
- STMicroelectronics, Inc.
- Anthony M. Chiu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Integrated circuit package with exposed die surfaces and auxiliary...
- Patent number 7,109,574
- Issue date Sep 19, 2006
- STMicroelectronics, Inc.
- Anthony M. Chiu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Integrated lid formed on MEMS device
- Patent number 7,098,065
- Issue date Aug 29, 2006
- STMicroelectronics, Inc.
- Anthony M. Chiu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for providing a redistribution metal layer in an integrated...
- Patent number 7,096,581
- Issue date Aug 29, 2006
- STMicroelectronics, Inc.
- Danielle A. Thomas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for aligning an integrated circuit die on an inte...
- Patent number 6,951,125
- Issue date Oct 4, 2005
- STMicroelectronics, Inc.
- Harry Michael Siegel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded flat film molding
- Patent number 6,900,508
- Issue date May 31, 2005
- STMicroelectronics, Inc.
- Anthony M. Chiu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method and system for removing heat from an active area of an integ...
- Patent number 6,785,137
- Issue date Aug 31, 2004
- STMicroelectronics, Inc.
- Harry Michael Siegel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for direct convective cooling of an exposed integ...
- Patent number 6,771,500
- Issue date Aug 3, 2004
- STMicroelectronics, Inc.
- Harry Michael Siegel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframeless package structure and method
- Patent number 6,769,174
- Issue date Aug 3, 2004
- STMicroeletronics, Inc.
- Harry M. Siegel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fingerprint sensor having a portion of the fluorocarbon polymer phy...
- Patent number 6,762,470
- Issue date Jul 13, 2004
- STMicroelectronics, Inc.
- Harry M. Siegel
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method of making a semiconductor device having a planarized fluorop...
- Patent number 6,759,326
- Issue date Jul 6, 2004
- STMicroelectronics, Inc.
- Harry M. Siegel
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Selective ionic implantation of fluoropolymer film to modify the se...
- Patent number 6,707,093
- Issue date Mar 16, 2004
- STMicroelectronics, Inc.
- Harry M. Siegel
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Integrated circuit device with exposed upper and lower die surfaces
- Patent number 6,700,190
- Issue date Mar 2, 2004
- STMicroelectronics, Inc.
- Harry M. Siegel
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Capacitive fingerprint sensor with protective coating containing a...
- Patent number 6,693,441
- Issue date Feb 17, 2004
- STMicroelectronics, Inc.
- Fred P. Lane
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Scratch resistance improvement by filling metal gaps
- Patent number 6,603,192
- Issue date Aug 5, 2003
- STMicroelectronics, Inc.
- Danielle A. Thomas
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
System and method for providing mechanical planarization of a seque...
- Patent number 6,600,227
- Issue date Jul 29, 2003
- STMicroelectronics, Inc.
- Anthony M. Chiu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wrap-around interconnect for fine pitch ball grid array
- Patent number 6,372,543
- Issue date Apr 16, 2002
- STMicroelectronics, Inc.
- Anthony Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wrap-around interconnect for fine pitch ball grid array
- Patent number 6,121,678
- Issue date Sep 19, 2000
- STMicroelectronics, Inc.
- Anthony Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface mountable integrated circuit package with detachable module...
- Patent number 5,994,774
- Issue date Nov 30, 1999
- STMicroelectronics, Inc.
- Harry Michael Siegel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of mounting an integrated circuit to a mounting surface
- Patent number 5,724,728
- Issue date Mar 10, 1998
- SGS-Thomson Microelectronics, Inc.
- Robert H. Bond
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ball grid array package with detachable module
- Patent number 5,642,265
- Issue date Jun 24, 1997
- SGS-Thomson Microelectronics, Inc.
- Robert H. Bond
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate mounting of circuit components with a low profile
- Patent number 5,610,800
- Issue date Mar 11, 1997
- SGS-Thomson Microelectronics, Inc.
- Michael J. Hundt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface mountable integrated circuit package with low-profile detac...
- Patent number 5,570,273
- Issue date Oct 29, 1996
- SGS-Thomson Microelectronics, Inc.
- Harry M. Siegel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface mountable integrated circuit package with detachable module
- Patent number 5,557,504
- Issue date Sep 17, 1996
- SGS-Thomson Microelectronics, Inc.
- Harry M. Siegel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded package integrated circuit with electrochemical cell
- Patent number 5,451,715
- Issue date Sep 19, 1995
- SGS-Thomson Microelectronics, Inc.
- Michael J. Hundt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Socketed integrated circuit package
- Patent number D359028
- Issue date Jun 6, 1995
- SGS-Thomson Microelectronics, Inc.
- Harry M. Siegel
- D13 - Equipment for production, distribution, or transformation of energy

Patents Applicationslast 30 patents

Information Patent Application
Method for providing a redistribution metal layer in an integrated...
- Publication number 20100297841
- Publication date Nov 25, 2010
- Danielle A. Thomas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Leadframeless package structure and method
- Publication number 20060261450
- Publication date Nov 23, 2006
- STMicroelectronics, Inc.
- Harry M. Siegel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
System for providing a redistribution metal layer in an integrated...
- Publication number 20060234423
- Publication date Oct 19, 2006
- STMicroelectronics, Inc.
- Danielle A. Thomas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED LID FORMED ON MEMS DEVICE
- Publication number 20060065961
- Publication date Mar 30, 2006
- STMicroelectronics, Inc.
- Anthony M. Chiu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Embedded flat film molding
- Publication number 20050161784
- Publication date Jul 28, 2005
- STMicroelectronics, Inc.
- Anthony M. Chiu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
System and method for controlling integrated circuit die height and...
- Publication number 20050001330
- Publication date Jan 6, 2005
- STMicroelectronics, Inc.
- Harry Michael Siegel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Leadframeless package structure and method
- Publication number 20040200062
- Publication date Oct 14, 2004
- STMicroelectronics, Inc.
- Harry M. Siegel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of making a semiconductor device having a planarized fluorop...
- Publication number 20040038515
- Publication date Feb 26, 2004
- Harry M. Siegel
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
INTEGRATED CIRCUIT DEVICE WITH EXPOSED UPPER AND LOWER DIE SURFACES
- Publication number 20040017002
- Publication date Jan 29, 2004
- STMicroelectronics, Inc.
- Harry M. Siegel
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Leadframeless package structure and method
- Publication number 20040017668
- Publication date Jan 29, 2004
- STMicroelectronics, Inc.
- Harry M. Siegel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated circuit package with exposed die surfaces and auxiliary...
- Publication number 20040017000
- Publication date Jan 29, 2004
- STMicroelectronics, Inc.
- Anthony M. Chiu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHOD AND SYSTEM FOR REMOVING HEAT FROM AN ACTIVE AREA OF AN INTEG...
- Publication number 20040017661
- Publication date Jan 29, 2004
- STMicroelectronics, Inc.
- Harry Michael Siegel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Use of fluoropolymer coating for planarizing and passivating integr...
- Publication number 20030199147
- Publication date Oct 23, 2003
- Harry M. Siegel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Embedded flat film molding
- Publication number 20030193072
- Publication date Oct 16, 2003
- STMicroelectronics, Inc.
- Anthony M. Chiu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
System and method for providing a redistribution metal layer in an...
- Publication number 20030167632
- Publication date Sep 11, 2003
- STMicroelectronics, Inc.
- Danielle A. Thomas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
System and method for aligning an integrated circuit die on an inte...
- Publication number 20030140678
- Publication date Jul 31, 2003
- STMicroelectronics, Inc.
- Harry Michael Siegel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHOD FOR PROVIDING MECHANICAL PLANARIZATION OF A SEQUE...
- Publication number 20030141595
- Publication date Jul 31, 2003
- STMicroelectronics, Inc.
- Anthony M. Chiu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
System and method for using a pre-formed film in a transfer molding...
- Publication number 20030143406
- Publication date Jul 31, 2003
- STMicroelectronics, Inc.
- Harry Michael Siegel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
USE OF FLUOROPOLYMER COATING FOR PLANARIZING AND PASSIVATING INTEGR...
- Publication number 20030104693
- Publication date Jun 5, 2003
- Harry M. Siegel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Protection of exposed semiconductor chip using thin polymer coatings
- Publication number 20030102533
- Publication date Jun 5, 2003
- Harry M. Siegel
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Capacitive fingerprint sensor with protective coating containing a...
- Publication number 20030102874
- Publication date Jun 5, 2003
- Fred P. Lane
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Selective ionic implantation of fluoropolymer film to modify the se...
- Publication number 20030104647
- Publication date Jun 5, 2003
- Harry M. Siegel
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SCRATCH RESISTANCE IMPROVEMENT BY FILLING METAL GAPS
- Publication number 20030071287
- Publication date Apr 17, 2003
- DANIELLE A. THOMAS
- G06 - COMPUTING CALCULATING COUNTING

Harry M. Siegel

Person

Patents Grantslast 30 patents

Method for providing a redistribution metal layer in an integrated...

System for providing a redistribution metal layer in an integrated...

Method for using a pre-formed film in a transfer molding process fo...

System and method for controlling integrated circuit die height and...

Embedded flat film molding

Integrated circuit package with exposed die surfaces and auxiliary...

Integrated lid formed on MEMS device

Method for providing a redistribution metal layer in an integrated...

System and method for aligning an integrated circuit die on an inte...

Embedded flat film molding

Method and system for removing heat from an active area of an integ...

System and method for direct convective cooling of an exposed integ...

Leadframeless package structure and method

Fingerprint sensor having a portion of the fluorocarbon polymer phy...

Method of making a semiconductor device having a planarized fluorop...

Selective ionic implantation of fluoropolymer film to modify the se...

Integrated circuit device with exposed upper and lower die surfaces

Capacitive fingerprint sensor with protective coating containing a...

Scratch resistance improvement by filling metal gaps

System and method for providing mechanical planarization of a seque...

Wrap-around interconnect for fine pitch ball grid array

Wrap-around interconnect for fine pitch ball grid array

Surface mountable integrated circuit package with detachable module...

Method of mounting an integrated circuit to a mounting surface

Ball grid array package with detachable module

Substrate mounting of circuit components with a low profile

Surface mountable integrated circuit package with low-profile detac...

Surface mountable integrated circuit package with detachable module

Molded package integrated circuit with electrochemical cell

Socketed integrated circuit package

Patents Applicationslast 30 patents

Method for providing a redistribution metal layer in an integrated...

Leadframeless package structure and method

System for providing a redistribution metal layer in an integrated...

INTEGRATED LID FORMED ON MEMS DEVICE

Embedded flat film molding

System and method for controlling integrated circuit die height and...

Leadframeless package structure and method

Method of making a semiconductor device having a planarized fluorop...

INTEGRATED CIRCUIT DEVICE WITH EXPOSED UPPER AND LOWER DIE SURFACES

Leadframeless package structure and method

Integrated circuit package with exposed die surfaces and auxiliary...

METHOD AND SYSTEM FOR REMOVING HEAT FROM AN ACTIVE AREA OF AN INTEG...

Use of fluoropolymer coating for planarizing and passivating integr...

Embedded flat film molding

System and method for providing a redistribution metal layer in an...

System and method for aligning an integrated circuit die on an inte...

SYSTEM AND METHOD FOR PROVIDING MECHANICAL PLANARIZATION OF A SEQUE...

System and method for using a pre-formed film in a transfer molding...

USE OF FLUOROPOLYMER COATING FOR PLANARIZING AND PASSIVATING INTEGR...

Protection of exposed semiconductor chip using thin polymer coatings

Capacitive fingerprint sensor with protective coating containing a...

Selective ionic implantation of fluoropolymer film to modify the se...

SCRATCH RESISTANCE IMPROVEMENT BY FILLING METAL GAPS