Harsono Siem Simka

Person

Saratoga, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit devices including a via and methods of forming t...
- Patent number 11,978,668
- Issue date May 7, 2024
- Samsung Electronics Co., Ltd.
- Ming He
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for electroless plating dispense
- Patent number 11,769,686
- Issue date Sep 26, 2023
- Intel Corporation
- Harinath Reddy
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Fully aligned via integration with selective catalyzed vapor phase...
- Patent number 11,705,363
- Issue date Jul 18, 2023
- Samsung Electronics Co., Ltd.
- Ming He
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnects having long grains and methods of manufacturing the same
- Patent number 11,289,419
- Issue date Mar 29, 2022
- Samsung Electronics Co., Ltd.
- Jorge A. Kittl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of screening materials using forward conducting modes
- Patent number 11,087,055
- Issue date Aug 10, 2021
- Samsung Electronics Co., Ltd.
- Ganesh Hegde
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Low resistivity interconnects with doped barrier layer for integrat...
- Patent number 11,043,454
- Issue date Jun 22, 2021
- Samsung Electronics Co., Ltd.
- Ganesh Hegde
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit devices including a via and methods of forming t...
- Patent number 10,957,579
- Issue date Mar 23, 2021
- Samsung Electronics Co., Ltd.
- Yung Bae Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system for providing a reverse engineering resistant har...
- Patent number 10,916,513
- Issue date Feb 9, 2021
- Samsung Electronics Co., Ltd.
- Harsono S. Simka
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Semiconductor device and method for making the same
- Patent number 10,825,723
- Issue date Nov 3, 2020
- Samsung Electronics Co., Ltd.
- Joon Goo Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnects having long grains and methods of manufacturing the same
- Patent number 10,763,207
- Issue date Sep 1, 2020
- Samsung Electronics Co., Ltd.
- Jorge A. Kittl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system for providing a reverse-engineering resistant har...
- Patent number 10,381,315
- Issue date Aug 13, 2019
- Samsung Electronics Co., Ltd.
- Harsono S. Simka
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Precursor and process design for photo-assisted metal atomic layer...
- Patent number 9,932,671
- Issue date Apr 3, 2018
- Intel Corporation
- James M. Blackwell
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Liner layers for metal interconnects
- Patent number 8,779,589
- Issue date Jul 15, 2014
- Intel Corporation
- Harsono S. Simka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface charge enhanced atomic layer deposition of pure metallic films
- Patent number 8,425,987
- Issue date Apr 23, 2013
- Intel Corporation
- Juan E. Dominguez
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Using unstable nitrides to form semiconductor structures
- Patent number 8,344,352
- Issue date Jan 1, 2013
- Intel Corporation
- Juan E. Dominguez
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Tunable gate electrode work function material for transistor applic...
- Patent number 8,319,287
- Issue date Nov 27, 2012
- Intel Corporation
- Adrien R. Lavoie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Atomic layer volatilization process for metal layers
- Patent number 8,012,878
- Issue date Sep 6, 2011
- Intel Corporation
- Adrien R. Lavoie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Using unstable nitrides to form semiconductor structures
- Patent number 7,982,204
- Issue date Jul 19, 2011
- Intel Corporation
- Juan E. Dominguez
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Copper precursors for CVD/ALD/digital CVD of copper metal films
- Patent number 7,964,746
- Issue date Jun 21, 2011
- Advanced Technology Materials, Inc.
- Tianniu Chen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Fluorine-free precursors and methods for the deposition of conforma...
- Patent number 7,858,525
- Issue date Dec 28, 2010
- Intel Corporation
- Juan E. Dominguez
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Organometallic precursors for seed/barrier processes and methods th...
- Patent number 7,851,360
- Issue date Dec 14, 2010
- Intel Corporation
- Juan Dominguez
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Using unstable nitrides to form semiconductor structures
- Patent number 7,749,906
- Issue date Jul 6, 2010
- Intel Corporation
- Juan E. Dominguez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Deposition method for high-k dielectric materials
- Patent number 7,704,895
- Issue date Apr 27, 2010
- Intel Corporation
- Adrien R. Lavoie
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Tunable gate electrode work function material for transistor applic...
- Patent number 7,682,891
- Issue date Mar 23, 2010
- Intel Corporation
- Adrien R. Lavoie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Direct tailoring of the composition and density of ALD films
- Patent number 7,524,765
- Issue date Apr 28, 2009
- Intel Corporation
- Juan E. Dominquez
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Deposition process for iodine-doped ruthenium barrier layers
- Patent number 7,476,615
- Issue date Jan 13, 2009
- Intel Corporation
- Joseph H. Han
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Treating a liner layer to reduce surface oxides
- Patent number 7,470,617
- Issue date Dec 30, 2008
- Intel Corporation
- Ramanan Chebiam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Catalytically enhanced atomic layer deposition process
- Patent number 7,354,849
- Issue date Apr 8, 2008
- Intel Corporation
- John J. Plombon
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Apparatus having plating solution container with current applying a...
- Patent number 7,279,084
- Issue date Oct 9, 2007
- Intel Corporation
- Radek P. Chalupa
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Organometallic precursors for the chemical phase deposition of meta...
- Patent number 7,220,671
- Issue date May 22, 2007
- Intel Corporation
- Harsono Simka
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
SYSTEMS AND METHODS OF APPLYING STRESS IN TRANSISTORS
- Publication number 20240429307
- Publication date Dec 26, 2024
- Samsung Electronics Co., Ltd.
- Rebecca Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PATTERNING ELEMENTAL METALS
- Publication number 20240429065
- Publication date Dec 26, 2024
- Samsung Electronics Co., Ltd.
- Jane P. Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH PERFORMANCE FETS
- Publication number 20240413232
- Publication date Dec 12, 2024
- Samsung Electronics Co., Ltd.
- Mehdi Saremi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FIELD EFFECT TRANSISTOR (FET) AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240405128
- Publication date Dec 5, 2024
- Samsung Electronics Co., Ltd.
- Aravindh Kumar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMMON OUTPUT IN 3D STACK FET
- Publication number 20240347537
- Publication date Oct 17, 2024
- Samsung Electronics Co., Ltd.
- Mehdi Saremi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D STACKED FIELD-EFFECT TRANSISTOR DEVICE WITH PN JUNCTION STRUCTURE
- Publication number 20240047539
- Publication date Feb 8, 2024
- Samsung Electronics Co., Ltd.
- Ming HE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3DSFET STANDARD CELL ARCHITECTURE WITH SOURCE-DRAIN JUNCTION ISOLATION
- Publication number 20240047456
- Publication date Feb 8, 2024
- Samsung Electronics Co., Ltd.
- Ming HE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FULLY ALIGNED VIA INTEGRATION WITH SELECTIVE CATALYZED VAPOR PHASE...
- Publication number 20230317513
- Publication date Oct 5, 2023
- Samsung Electronics Co., Ltd.
- Ming HE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NANOSHEET TRANSISTOR DEVICES AND RELATED FABRICATION METHODS
- Publication number 20230178420
- Publication date Jun 8, 2023
- Samsung Electronics Co., Ltd.
- Ming He
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING INTEGRATED CIRCUIT DEVICES INCLUDING STACKED TRA...
- Publication number 20230178440
- Publication date Jun 8, 2023
- Samsung Electronics Co., Ltd.
- MING HE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING LOW-RESISTIVITY RU ALD THROUGH A BI-LAYER PROCESS...
- Publication number 20230175133
- Publication date Jun 8, 2023
- The Regents of the University of California
- Andrew Kummel
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
STACKED TRANSISTORS HAVING AN ISOLATION REGION THEREBETWEEN AND A C...
- Publication number 20230086084
- Publication date Mar 23, 2023
- Samsung Electronics Co., Ltd.
- Seungchan Yun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICES INCLUDING A VIA AND METHODS OF FORMING T...
- Publication number 20230074982
- Publication date Mar 9, 2023
- Samsung Electronics Co., Ltd.
- MING HE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FULLY ALIGNED VIA INTEGRATION WITH SELECTIVE CATALYZED VAPOR PHASE...
- Publication number 20220301924
- Publication date Sep 22, 2022
- Samsung Electronics Co., Ltd.
- Ming HE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS & APPARATUS FOR ELECTROLESS PLATING DISPENSE
- Publication number 20210375662
- Publication date Dec 2, 2021
- Intel Corporation
- Harinath Reddy
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
INTERCONNECTS HAVING LONG GRAINS AND METHODS OF MANUFACTURING THE SAME
- Publication number 20200357740
- Publication date Nov 12, 2020
- Samsung Electronics Co., Ltd.
- Jorge A. Kittl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW RESISTIVITY INTERCONNECTS FOR INTEGRATED CIRCUIT AND METHODS OF...
- Publication number 20200235055
- Publication date Jul 23, 2020
- Samsung Electronics Co., Ltd.
- Ganesh Hegde
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICES INCLUDING A VIA AND METHODS OF FORMING T...
- Publication number 20200144103
- Publication date May 7, 2020
- Samsung Electronics Co., Ltd.
- Yung Bae Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MAKING THE SAME
- Publication number 20200135549
- Publication date Apr 30, 2020
- Samsung Electronics Co., Ltd.
- Joon Goo Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICES AND METHODS FOR ENHANCING INTERCONNECT RELI...
- Publication number 20200066645
- Publication date Feb 27, 2020
- Intel Corporation
- Jason A. FARMER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND SYSTEM FOR PROVIDING A REVERSE-ENGINEERING RESISTANT HAR...
- Publication number 20190318998
- Publication date Oct 17, 2019
- Samsung Electronics Co., Ltd.
- Harsono S. Simka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF SCREENING MATERIALS USING FORWARD CONDUCTING MODES
- Publication number 20190155977
- Publication date May 23, 2019
- Samsung Electronics Co., Ltd.
- Ganesh Hegde
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
INTERCONNECTS HAVING LONG GRAINS AND METHODS OF MANUFACTURING THE SAME
- Publication number 20190157200
- Publication date May 23, 2019
- Samsung Electronics Co., Ltd.
- Jorge A. Kittl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND SYSTEM FOR PROVIDING A REVERSE-ENGINEERING RESISTANT HAR...
- Publication number 20190148312
- Publication date May 16, 2019
- Samsung Electronics Co., Ltd.
- Harsono S. Simka
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Precursor and Process Design for Photo-Assisted Metal Atomic Layer...
- Publication number 20170058401
- Publication date Mar 2, 2017
- Intel Corporation
- James M. BLACKWELL
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
LINER LAYERS FOR METAL INTERCONNECTS
- Publication number 20120153478
- Publication date Jun 21, 2012
- Harsono S. Simka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
USING UNSTABLE NITRIDES TO FORM SEMICONDUCTOR STRUCTURES
- Publication number 20110272811
- Publication date Nov 10, 2011
- Juan E. Dominguez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Using Unstable Nitrides to Form Semiconductor Structures
- Publication number 20100230817
- Publication date Sep 16, 2010
- Juan E. Dominguez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SURFACE CHARGE ENHANCED ATOMIC LAYER DEPOSITION OF PURE METALLIC FILMS
- Publication number 20100166981
- Publication date Jul 1, 2010
- JUAN E. DOMINGUEZ
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
TUNABLE GATE ELECTRODE WORK FUNCTION MATERIAL FOR TRANSISTOR APPLIC...
- Publication number 20100140717
- Publication date Jun 10, 2010
- Adrien R. Lavoie
- H01 - BASIC ELECTRIC ELEMENTS

Harsono Siem Simka

Person

Patents Grantslast 30 patents

Integrated circuit devices including a via and methods of forming t...

Methods and apparatus for electroless plating dispense

Fully aligned via integration with selective catalyzed vapor phase...

Interconnects having long grains and methods of manufacturing the same

Method of screening materials using forward conducting modes

Low resistivity interconnects with doped barrier layer for integrat...

Integrated circuit devices including a via and methods of forming t...

Method and system for providing a reverse engineering resistant har...

Semiconductor device and method for making the same

Interconnects having long grains and methods of manufacturing the same

Method and system for providing a reverse-engineering resistant har...

Precursor and process design for photo-assisted metal atomic layer...

Liner layers for metal interconnects

Surface charge enhanced atomic layer deposition of pure metallic films

Using unstable nitrides to form semiconductor structures

Tunable gate electrode work function material for transistor applic...

Atomic layer volatilization process for metal layers

Using unstable nitrides to form semiconductor structures

Copper precursors for CVD/ALD/digital CVD of copper metal films

Fluorine-free precursors and methods for the deposition of conforma...

Organometallic precursors for seed/barrier processes and methods th...

Using unstable nitrides to form semiconductor structures

Deposition method for high-k dielectric materials

Tunable gate electrode work function material for transistor applic...

Direct tailoring of the composition and density of ALD films

Deposition process for iodine-doped ruthenium barrier layers

Treating a liner layer to reduce surface oxides

Catalytically enhanced atomic layer deposition process

Apparatus having plating solution container with current applying a...

Organometallic precursors for the chemical phase deposition of meta...

Patents Applicationslast 30 patents

SYSTEMS AND METHODS OF APPLYING STRESS IN TRANSISTORS

METHOD OF PATTERNING ELEMENTAL METALS

HIGH PERFORMANCE FETS

FIELD EFFECT TRANSISTOR (FET) AND METHOD OF MANUFACTURING THE SAME

COMMON OUTPUT IN 3D STACK FET

3D STACKED FIELD-EFFECT TRANSISTOR DEVICE WITH PN JUNCTION STRUCTURE

3DSFET STANDARD CELL ARCHITECTURE WITH SOURCE-DRAIN JUNCTION ISOLATION

FULLY ALIGNED VIA INTEGRATION WITH SELECTIVE CATALYZED VAPOR PHASE...

NANOSHEET TRANSISTOR DEVICES AND RELATED FABRICATION METHODS

METHODS OF FORMING INTEGRATED CIRCUIT DEVICES INCLUDING STACKED TRA...

METHOD OF FORMING LOW-RESISTIVITY RU ALD THROUGH A BI-LAYER PROCESS...

STACKED TRANSISTORS HAVING AN ISOLATION REGION THEREBETWEEN AND A C...

INTEGRATED CIRCUIT DEVICES INCLUDING A VIA AND METHODS OF FORMING T...

FULLY ALIGNED VIA INTEGRATION WITH SELECTIVE CATALYZED VAPOR PHASE...

METHODS & APPARATUS FOR ELECTROLESS PLATING DISPENSE

INTERCONNECTS HAVING LONG GRAINS AND METHODS OF MANUFACTURING THE SAME

LOW RESISTIVITY INTERCONNECTS FOR INTEGRATED CIRCUIT AND METHODS OF...

INTEGRATED CIRCUIT DEVICES INCLUDING A VIA AND METHODS OF FORMING T...

SEMICONDUCTOR DEVICE AND METHOD FOR MAKING THE SAME

MICROELECTRONIC DEVICES AND METHODS FOR ENHANCING INTERCONNECT RELI...

METHOD AND SYSTEM FOR PROVIDING A REVERSE-ENGINEERING RESISTANT HAR...

METHOD OF SCREENING MATERIALS USING FORWARD CONDUCTING MODES

INTERCONNECTS HAVING LONG GRAINS AND METHODS OF MANUFACTURING THE SAME

METHOD AND SYSTEM FOR PROVIDING A REVERSE-ENGINEERING RESISTANT HAR...

Precursor and Process Design for Photo-Assisted Metal Atomic Layer...

LINER LAYERS FOR METAL INTERCONNECTS

USING UNSTABLE NITRIDES TO FORM SEMICONDUCTOR STRUCTURES

Using Unstable Nitrides to Form Semiconductor Structures

SURFACE CHARGE ENHANCED ATOMIC LAYER DEPOSITION OF PURE METALLIC FILMS

TUNABLE GATE ELECTRODE WORK FUNCTION MATERIAL FOR TRANSISTOR APPLIC...